The heterogeneous composition of working place aerosols in a nickel refinery: a transmission and scanning electron microscope studyPresented at ENVIRONMIN 2001 at Skukuza, Kruger National Park, South Africa, 14–18 July 2001.Electronic supplementary information (ESI) available: TEM bright field images, energy-dispersive X-ray spectra and electron diffraction patterns of various phases observed in the refinery at Monchegorsk; (a) godlevskite, (b) heazlewoodite, (c) bunsenite, (d) trevorite, (e) amorphous sulfate, (f) soot agglomerate with inclusions, (g) bunsenite. See http://www.rsc.org/suppdata/em/b1/b110504n/

2002 ◽  
Vol 4 (3) ◽  
pp. 344-350 ◽  
Author(s):  
Stephan Weinbruch ◽  
Peter van Aken ◽  
Martin Ebert ◽  
Yngvar Thomassen ◽  
Asbjørn Skogstad ◽  
...  
Keyword(s):  
South Africa ◽  
Electron Microscope ◽  
National Park ◽  
Kruger National Park ◽  
Supplementary Information ◽  
Bright Field ◽  
X Ray ◽  
Electronic Supplementary Information ◽  
Diffraction Patterns ◽  
Scanning Electron

Redescription of Lamproglena Clariae Fryer, 1956 (Copepoda, Lernaeidae), With Notes On Its Occurrence and Distribution

Crustaceana ◽  
1996 ◽  
Vol 69 (4) ◽  
pp. 509-523 ◽  
Author(s):  
A. Avenant-Oldewage ◽  
Hazel M. Marx
Keyword(s):  
Electron Microscopy ◽  
South Africa ◽  
Scanning Electron Microscopy ◽  
National Park ◽  
Kruger National Park ◽  
Gill Parasite ◽  
Morphological Findings ◽  
Olifants River ◽  
First Time ◽  
Scanning Electron

AbstractThe morphology of the gill parasite Lamproglena clariae Fryer, 1956, from the Olifants River, Kruger National Park, South Africa, was studied with the aid of light and scanning electron microscopy. Ultrastructural details of all appendages are given as well as a table and map with information on the occurrence and distribution of L. clariae in Africa. Important morphological findings include: the observation of only one claw on the maxilla; first time findings and descriptions of the nuchal organ, upper and lower lips, the fifth pair of legs and circular openings on all appendages.

Choosing an Electron Backscattering Pattern (EBSP) System.

1999 ◽  
Vol 5 (S2) ◽  
pp. 250-251
Author(s):  
Alwyn Eades
Keyword(s):  
Electron Microscope ◽  
World Wide ◽  
Geological Samples ◽  
X Ray ◽  
Electron Backscattering ◽  
Routine Basis ◽  
Biomedical Field ◽  
Diffraction Patterns ◽  
New Instruments ◽  
Scanning Electron

Recent advances in cameras and computers have made it possible to build electron backscattering pattern (EBSP) cameras which can give crystallographic information from diffraction patterns in the scanning electron microscope (SEM) on a routine basis.[1] There are a few hundred such systems world wide and the number is growing fast. In the case of crystalline samples (nearly all applications of SEM outside the biomedical field), it will surely soon be considered essential to fit an SEM with an EBSP system, just as it is now considered essential to have the SEM equipped with an energy-dispersive x-ray spectroscopy (EDS) system. There are at least four commercial manufacturers of EBSP systems. In the next few years, then, I anticipate that many owners of existing SEMs as well as buyers of new instruments will be faced with the problem of selecting an EBSP system. This paper presents some of the issues involved in making such a choice.As in many technical decisions, different people will have different needs and put different priorities on the specifications to be met. An instrument which is to be used to do repeated analyses of aluminum for beer cans will have different needs from a system used mostly to teach crystallography, and those will be different in turn from the needs of a system used to determine which phases are present in geological samples.

Comparison of Environmental Secondary Electron Detector (ESD) Imaging and Electron Diffraction Mapping of a Nickel Tape Using the Environmental Scanning Electron Microscope (ESEM)

1999 ◽  
Vol 5 (S2) ◽  
pp. 266-267 ◽  
Author(s):  
R. E. Goddard ◽  
Y. S. Hascicek
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Electron Backscatter Diffraction ◽  
Environmental Scanning ◽  
Entire Sample ◽  
X Ray ◽  
Pole Figures ◽  
Structure Relationship ◽  
Diffraction Patterns ◽  
Scanning Electron

A relationship between the local microstructure (crystallographic orientation) of a sample and an image from a scanning electron microscope (SEM) has been an elusive goal. Being able to show the structure from an exact area and relate it to other data is essential to the understanding of the structure relationship to the entire sample. Conventionally microtextural information of tapes is obtained by using x-ray diffraction and pole figures. But this only provides information about the global texture. The precise location is not well defined. The ability to physically transfer the sample from the x-ray diffractometer to a SEM and accurately state that this is the same area has been impossible. Electron Backscatter Diffraction Patterns (EBSPs) have been obtained in an electron microscope and the exact area in relation to the rest of the sample is determined. Thus larger areas can be defined and put together to form a composite of an entire sample. This, however, may be hard to accomplish in that defined areas for the image scan may be at a different scale than the EBSP scan. A contrast method of imaging in the ESEM using an increased vacuum and the ESD yields a good correlation to mapped areas obtained from EBSPs or also known as backscatter electron Kikuchi diffraction patterns (BEKPs or BKPs).

X-ray micro tomography in the scanning electron microscope

1978 ◽  
Vol 36 (1) ◽  
pp. 106-107 ◽  
Author(s):  
W. Brünger
Keyword(s):  
Electron Beam ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Target Surface ◽  
The Body ◽  
X Rays ◽  
Cross Sectional ◽  
X Ray ◽  
Micro Tomography ◽  
Scanning Electron

Reconstructive tomography is a new technique in diagnostic radiology for imaging cross-sectional planes of the human body /1/. A collimated beam of X-rays is scanned through a thin slice of the body and the transmitted intensity is recorded by a detector giving a linear shadow graph or projection (see fig. 1). Many of these projections at different angles are used to reconstruct the body-layer, usually with the aid of a computer. The picture element size of present tomographic scanners is approximately 1.1 mm2.Micro tomography can be realized using the very fine X-ray source generated by the focused electron beam of a scanning electron microscope (see fig. 2). The translation of the X-ray source is done by a line scan of the electron beam on a polished target surface /2/. Projections at different angles are produced by rotating the object.During the registration of a single scan the electron beam is deflected in one direction only, while both deflections are operating in the display tube.

Slow-Scan CCD Observation of Backscattering Patterns in SEM

1992 ◽  
Vol 50 (2) ◽  
pp. 1308-1309
Author(s):  
F. Ouyang ◽  
D. A. Ray ◽  
O. L. Krivanek
Keyword(s):  
Electron Beam ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Dynamic Range ◽  
High Sensitivity ◽  
Lens System ◽  
Wide Dynamic Range ◽  
Peltier Cooler ◽  
Diffraction Patterns ◽  
Scanning Electron

Electron backscattering Kikuchi diffraction patterns (BKDP) reveal useful information about the structure and orientation of crystals under study. With the well focused electron beam in a scanning electron microscope (SEM), one can use BKDP as a microanalysis tool. BKDPs have been recorded in SEMs using a phosphor screen coupled to an intensified TV camera through a lens system, and by photographic negatives. With the development of fiber-optically coupled slow scan CCD (SSC) cameras for electron beam imaging, one can take advantage of their high sensitivity and wide dynamic range for observing BKDP in SEM.We have used the Gatan 690 SSC camera to observe backscattering patterns in a JEOL JSM-840A SEM. The CCD sensor has an active area of 13.25 mm × 8.83 mm and 576 × 384 pixels. The camera head, which consists of a single crystal YAG scintillator fiber optically coupled to the CCD chip, is located inside the SEM specimen chamber. The whole camera head is cooled to about -30°C by a Peltier cooler, which permits long integration times (up to 100 seconds).

PHAX-SCAN: Functional integration of a Scanning Electron Microscope and an energy-dispersive x-ray analyser

1989 ◽  
Vol 47 ◽  
pp. 56-57
Author(s):  
Marc H. Peeters ◽  
Max T. Otten
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
Functional Integration ◽  
Energy Dispersive ◽  
X Rays ◽  
X Ray ◽  
High Speed Analysis ◽  
Scanning Electron

Over the past decades, the combination of energy-dispersive analysis of X-rays and scanning electron microscopy has proved to be a powerful tool for fast and reliable elemental characterization of a large variety of specimens. The technique has evolved rapidly from a purely qualitative characterization method to a reliable quantitative way of analysis. In the last 5 years, an increasing need for automation is observed, whereby energy-dispersive analysers control the beam and stage movement of the scanning electron microscope in order to collect digital X-ray images and perform unattended point analysis over multiple locations.The Philips High-speed Analysis of X-rays system (PHAX-Scan) makes use of the high performance dual-processor structure of the EDAX PV9900 analyser and the databus structure of the Philips series 500 scanning electron microscope to provide a highly automated, user-friendly and extremely fast microanalysis system. The software that runs on the hardware described above was specifically designed to provide the ultimate attainable speed on the system.

PENGGUNAAN TiO2 PARTIKEL NANO HASIL SINTESIS BERBASIS AIR MENGGUNAKAN METODA SOL-GEL PADA BAHAN KAPAS SEBAGAI APLIKASI UNTUK TEKSTIL ANTI UV

Arena Tekstil ◽  
2013 ◽  
Vol 28 (1) ◽  
Author(s):  
Maya Komalasari ◽  
Bambang Sunendar
Keyword(s):  
Fourier Transform ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Sol Gel ◽  
Crosslinking Agent ◽  
X Ray Diffraction ◽  
Nano Tio2 ◽  
X Ray ◽  
Infra Red ◽  
Scanning Electron

Partikel nano TiO2 berbasis air dengan pH basa telah berhasil disintesis dengan menggunakan metode sol-gel dan diimobilisasi pada kain kapas dengan menggunakan kitosan sebagai zat pengikat silang. Sintesis dilakukan  dengan prekursor TiCl4 pada konsentrasi 0,3 M, 0,5 M dan 1 M, dan menggunakan templat kanji dengan proses kalsinasi pada suhu 500˚C selama 2 jam. Partikel nano TiO2 diaplikasikan ke kain kapas dengan metoda pad-dry-cure dan menggunakan kitosan sebagai crosslinking agent. Berdasarkan hasil Scanning Electron Microscope (SEM),diketahui bahwa morfologi partikel TiO2 berbentuk spherical dengan ukuran nano (kurang dari 100 nm). Karakterisasi X-Ray Diffraction (XRD) menunjukkan adanya tiga tipe struktur kristal utama, yaitu (100), (101) dan (102) dengan fasa kristal yang terbentuk adalah anatase dan rutile. Pada karakterisasi menggunakan SEM terhadap serbuk dari TiO2 yang telah diaplikasikan ke permukaan kain kapas, terlihat adanya imobilisasi partikel nano TiO2 melalui ikatan hidrogen silang dengan kitosan pada kain kapas. Hasil analisa tersebut kemudian dikonfirmasi dengan FTIR (Fourier Transform Infra Red) yang hasilnya memperlihatkan puncak serapan pada bilangan gelombang 3495 cm-1, 2546 cm-1, dan 511 cm-1,  yang masing-masing diasumsikan sebagai adanya vibrasi gugus fungsi O-H, N-H dan Ti-O-Ti. Hasil SEM menunjukkan pula bahwa kristal nano yang terbentuk diantaranya adalah fasa rutile , yang berdasarkan literatur terbukti dapatberfungsi sebagai anti UV.

Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

2000 ◽  
Author(s):  
Y. N. Hua ◽  
Z. R. Guo ◽  
L. H. An ◽  
Shailesh Redkar
Keyword(s):  
Electron Microscope ◽  
Failure Analysis ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Wafer Fabrication ◽  
X Ray ◽  
Particle Contamination ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Scanning Electron

Abstract In this paper, some low yield cases in Flat ROM device (0.45 and 0.6 µm) were investigated. To find killer defects and particle contamination, KLA, bitmap and emission microscopy techniques were used in fault isolation. Reactive ion etching (RIE) and chemical delayering, 155 Wright Etch, BN+ Etch and scanning electron microscope (SEM) were used for identification and inspection of defects. In addition, energy-dispersive X-ray microanalysis (EDX) was used to determine the composition of the particle or contamination. During failure analysis, seven kinds of killer defects and three killer particles were found in Flat ROM devices. The possible root causes, mechanisms and elimination solutions of these killer defects/particles were also discussed.

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