An on-chip test structure to measure the Seebeck coefficient of thermopile sensors

2021 ◽  
Author(s):  
Peng Huang ◽  
Jianyu Fu ◽  
Yihong Lu ◽  
Jinbiao Liu ◽  
Jian Zhang ◽  
...  
Keyword(s):  
Seebeck Coefficient ◽  
Thermal Parameter ◽  
Test Structure ◽  
Sensitive Region ◽  
Wide Range ◽  
Temperature Detector ◽  
Measurement Results ◽  
On Chip ◽  
Thermopile Sensor

Abstract Thermopile sensors have a wide range of applications in consumer and industry. Seebeck coefficient is a basic thermal parameter of thermopile sensors. Extracting the Seebeck coefficient of both materials and thermocouple in thermopile sensors is of great importance. In this work, an on-chip test structure is designed. It consists of a substrate, a framework, supporting legs and a sensitive region which has a resistor serving as both heater and temperature detector. A set of on-chip test structures are fabricated along with a thermopile sensor. Its measurement results are analyzed and compared with apparatus measurement results. These results are consistent with each other, and the validity of structure is verified.

scholarly journals A Comparative Study of Methods for Measurement of Energy of Computing

Energies ◽  
2019 ◽  
Vol 12 (11) ◽  
pp. 2204 ◽  
Author(s):  
Muhammad Fahad ◽  
Arsalan Shahid ◽  
Ravi Reddy Manumachu ◽  
Alexey Lastovetsky
Keyword(s):  
Predictive Models ◽  
Ground Truth ◽  
System Level ◽  
Average Error ◽  
Level Energy ◽  
Physical Measurements ◽  
Wide Range ◽  
External Power ◽  
On Chip ◽  
Multicore Cpus

Energy of computing is a serious environmental concern and mitigating it is an important technological challenge. Accurate measurement of energy consumption during an application execution is key to application-level energy minimization techniques. There are three popular approaches to providing it: (a) System-level physical measurements using external power meters; (b) Measurements using on-chip power sensors and (c) Energy predictive models. In this work, we present a comprehensive study comparing the accuracy of state-of-the-art on-chip power sensors and energy predictive models against system-level physical measurements using external power meters, which we consider to be the ground truth. We show that the average error of the dynamic energy profiles obtained using on-chip power sensors can be as high as 73% and the maximum reaches 300% for two scientific applications, matrix-matrix multiplication and 2D fast Fourier transform for a wide range of problem sizes. The applications are executed on three modern Intel multicore CPUs, two Nvidia GPUs and an Intel Xeon Phi accelerator. The average error of the energy predictive models employing performance monitoring counters (PMCs) as predictor variables can be as high as 32% and the maximum reaches 100% for a diverse set of seventeen benchmarks executed on two Intel multicore CPUs (one Haswell and the other Skylake). We also demonstrate that using inaccurate energy measurements provided by on-chip sensors for dynamic energy optimization can result in significant energy losses up to 84%. We show that, owing to the nature of the deviations of the energy measurements provided by on-chip sensors from the ground truth, calibration can not improve the accuracy of the on-chip sensors to an extent that can allow them to be used in optimization of applications for dynamic energy. Finally, we present the lessons learned, our recommendations for the use of on-chip sensors and energy predictive models and future directions.

scholarly journals Bioprinting for Liver Transplantation

2019 ◽  
Vol 6 (4) ◽  
pp. 95 ◽  
Author(s):  
Christina Kryou ◽  
Valentina Leva ◽  
Marianneza Chatzipetrou ◽  
Ioanna Zergioti
Keyword(s):  
Direct Writing ◽  
Liver Tissue Engineering ◽  
Liver Model ◽  
Cell Structures ◽  
Wide Range ◽  
Ink Jet ◽  
Functional Complex ◽  
On Chip ◽  
2D And 3D

Bioprinting techniques can be used for the in vitro fabrication of functional complex bio-structures. Thus, extensive research is being carried on the use of various techniques for the development of 3D cellular structures. This article focuses on direct writing techniques commonly used for the fabrication of cell structures. Three different types of bioprinting techniques are depicted: Laser-based bioprinting, ink-jet bioprinting and extrusion bioprinting. Further on, a special reference is made to the use of the bioprinting techniques for the fabrication of 2D and 3D liver model structures and liver on chip platforms. The field of liver tissue engineering has been rapidly developed, and a wide range of materials can be used for building novel functional liver structures. The focus on liver is due to its importance as one of the most critical organs on which to test new pharmaceuticals, as it is involved in many metabolic and detoxification processes, and the toxicity of the liver is often the cause of drug rejection.

scholarly journals QoSS Hierarchical NoC-Based Architecture for MPSoC Dynamic Protection

2012 ◽  
Vol 2012 ◽  
pp. 1-10 ◽  
Author(s):  
Johanna Sepulveda ◽  
Ricardo Pires ◽  
Guy Gogniat ◽  
Wang Jiang Chau ◽  
Marius Strum
Keyword(s):  
Critical Role ◽  
Security Requirements ◽  
Multiprocessor System ◽  
Electronic Systems ◽  
Fast Detection ◽  
Dynamic Security ◽  
Wide System ◽  
Wide Range ◽  
On Chip ◽  
Novel Concept

As electronic systems are pervading our lives, MPSoC (multiprocessor system-on-chip) security is becoming an important requirement. MPSoCs are able to support multiple applications on the same chip. The challenge is to provide MPSoC security that makes possible a trustworthy system that meets the performance and security requirements of all the applications. The network-on-chip (NoC) can be used to efficiently incorporate security. Our work proposes the implementation of QoSS (quality of security service) to overcome present MPSoC vulnerabilities. QoSS is a novel concept for data protection that introduces security as a dimension of QoS. QoSS takes advantage of the NoC wide system visibility and critical role in enabling system operation, exploiting the NoC components to detect and prevent a wide range of attacks. In this paper, we present the implementation of a layered dynamic security NoC architecture that integrates agile and dynamic security firewalls in order to detect attacks based on different security rules. We evaluate the effectiveness of our approach over several MPSoCs scenarios and estimate their impact on the overall performance. We show that our architecture can perform a fast detection of a wide range of attacks and a fast configuration of different security policies for several MPSoC applications.

Thermoelectric Performance of Glass Microsphere Dispersed Bi-Sb Composites at Low Temperature

2013 ◽  
Vol 743-744 ◽  
pp. 120-125
Author(s):  
Zhen Chen ◽  
Ye Mao Han ◽  
Min Zhou ◽  
Rong Jin Huang ◽  
Yuan Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Materials ◽  
Sem Analysis ◽  
Glass Microsphere ◽  
Thermoelectric Performance ◽  
X Ray Diffraction ◽  
X Ray ◽  
Measurement Results

In the present study, the glass microsphere dispersed Bi-Sb thermoelectric materials have been fabricated through mechanical alloying followed by pressureless sintering. The phase composition and the microstructure were investigated by X-ray diffraction (XRD) and scanning electron microscopy (SEM) analysis. Electrical conductivity, Seebeck coefficient and thermal conductivity were measured in the temperature range of 77~300 K. The ZT values were calculated according to the measurement results. The results showed that the electrical conductivity, Seebeck coefficient and thermal conductivity decreased by adding glass microsphere into Bi-Sb thermoelectric materials. However, the optimum ZT value of 0.24 was obtained at 260 K, which was increased 10% than that of the Bi-Sb matrix. So it is confirmed that the thermoelectric performance of Bi-Sb-based materials can be improved by adding moderate glass microspheres.

Thermoelectric transport of semiconductor full-Heusler VFe2Al

2020 ◽  
Vol 8 (30) ◽  
pp. 10174-10184
Author(s):  
Shashwat Anand ◽  
Ramya Gurunathan ◽  
Thomas Soldi ◽  
Leah Borgsmiller ◽  
Rachel Orenstein ◽  
...  
Keyword(s):  
High Temperature ◽  
Seebeck Coefficient ◽  
Band Gap ◽  
Thermoelectric Transport ◽  
Resistivity Data ◽  
Wide Range ◽  
Small Band ◽  
Full Heusler ◽  
Temperature Resistivity

Seebeck coefficient of VFe2Al over a wide range of doping levels can be explained only with a small band-gap (Eg) range of 0.02–0.04 eV. This Eg value is also consistent with high-temperature resistivity data of nominally stoichiometric VFe2Al.

scholarly journals Metamaterial Cell-Based Superstrate towards Bandwidth and Gain Enhancement of Quad-Band CPW-Fed Antenna for Wireless Applications

Sensors ◽  
2020 ◽  
Vol 20 (2) ◽  
pp. 457 ◽  
Author(s):  
Samir Salem Al-Bawri ◽  
Md Shabiul Islam ◽  
Hin Yong Wong ◽  
Mohd Faizal Jamlos ◽  
Adam Narbudowicz ◽  
...  
Keyword(s):  
Refractive Index ◽  
Wave Propagation ◽  
Negative Refractive Index ◽  
Coplanar Waveguide ◽  
Ring Resonators ◽  
Wireless Applications ◽  
Gain Enhancement ◽  
Wide Range ◽  
Measurement Results ◽  
High Bandwidth

A multiband coplanar waveguide (CPW)-fed antenna loaded with metamaterial unit cell for GSM900, WLAN, LTE-A, and 5G Wi-Fi applications is presented in this paper. The proposed metamaterial structure is a combination of various symmetric split-ring resonators (SSRR) and its characteristics were investigated for two major axes directions at (x and y-axis) wave propagation through the material. For x-axis wave propagation, it indicates a wide range of negative refractive index in the frequency span of 2–8.5 GHz. For y-axis wave propagation, it shows more than 2 GHz bandwidth of near-zero refractive index (NZRI) property. Two categories of the proposed metamaterial plane were applied to enhance the bandwidth and gain. The measured reflection coefficient (S11) demonstrated significant bandwidths increase at the upper bands by 4.92–6.49 GHz and 3.251–4.324 GHz, considered as a rise of 71.4% and 168%, respectively, against the proposed antenna without using metamaterial. Besides being high bandwidth achieving, the proposed antenna radiates bi-directionally with 95% as the maximum radiation efficiency. Moreover, the maximum measured gain reaches 6.74 dBi by a 92.57% improvement compared with the antenna without using metamaterial. The simulation and measurement results of the proposed antenna show good agreement.

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