Residue-Free Suspended Graphene Transferred by Perforated Template

2021 ◽  
Author(s):  
sangmin kim ◽  
Choong-Kwang Lee ◽  
Sung-Uk Yoon ◽  
Kyung-Shik Kim ◽  
Yun Hwangbo
Keyword(s):  
2D Materials ◽  
Si Substrates ◽  
Polymer Templates ◽  
Transmission Electron ◽  
Powerful Approach ◽  
Device Applications ◽  
Thermal Annealing Process ◽  
Specific Position ◽  
Transfer Method ◽  
Subsequent Thermal Annealing

Abstract A residue-free transfer method for graphene is proposed in this study, especially for the fabrication of suspended structures. Using perforated polymer templates, graphene can be precisely transferred onto the specific position in the perforated target SiO2/Si substrates without the need for polymer removal and the subsequent thermal annealing process. The surface of the transferred graphene by the proposed method was analyzed and corroborated via Raman spectroscopy, Fourier transform infrared spectroscopy, transmission electron microscopy. The results of these analyses suggest that the graphene surface has no polymeric residues resulting from the transfer process. The proposed method provides a powerful approach for the transfer of 2D materials and it enables the exploitation of their suspended structures for device applications as well as the physical characterizations without worry on the effect of contaminants.

Ion Beam Synthesis of Luminescent SI and GE Nanocrystals in a Silicon Dioxide Matrix

1993 ◽  
Vol 316 ◽  
Author(s):  
H.A. Atwater ◽  
K.V. Shcheglov ◽  
S.S. Wong ◽  
K.J. Vahala ◽  
R.C. Flagan ◽  
...  
Keyword(s):  
Ion Beam ◽  
Optoelectronic Device ◽  
Structural Defects ◽  
Si Substrates ◽  
Localized State ◽  
Transmission Electron ◽  
Ion Beam Synthesis ◽  
Theoretical Predictions ◽  
Device Applications ◽  
Ge Nanocrystals

ABSTRACTIon beam synthesis of Si and Ge nanocrystals in an SiO2 matrix is performed by precipitation from supersaturated solid solutions created by ion implantation. Films of SiO2 on (100) Si substrates are implanted with Si and Ge at doses 1 × 1016/cm2 - 5 × 1016/cm2. Implanted samples are subsequently annealed to induce precipitation of Si and Ge nanocrystals. Raman spectroscopy and high-resolution transmission electron microscopy indicate a correlation between visible room-temperature photoluminescence and the formation of diamond cubic nanocrystals approximately 2–5 nm in diameter in annealed samples. As-implanted but unannealed samples do not exhibit luminescence. Rutherford backscattering spectra indicate a steepening of implanted Ge profiles upon annealing. Photoluminescence spectra are correlated with annealing temperatures, and compared with theoretical predictions for various possible luminescence mechanisms, such as radiative recombination of quantum-confined excitons, as well as possible localized state luminescence related to structural defects in SiO2. Potential optoelectronic device applications are also discussed.

Fabrication of PZT Based Capacitor with SrRuO3 Electrode for Memory Device Applications

1998 ◽  
Vol 541 ◽  
Author(s):  
Ashok Kumar ◽  
H. Rahman ◽  
M. Shamsuzzoha
Keyword(s):  
Ferroelectric Properties ◽  
Ruthenium Oxide ◽  
Memory Device ◽  
Ferroelectric Material ◽  
Test System ◽  
X Ray Diffraction ◽  
Si Substrates ◽  
Transmission Electron ◽  
Device Applications

AbstractStrontium ruthenium oxide (SrRuO3) was deposited on Pt/(100)Si substrates at varying temperatures and 300 mTorr oxygen pressure using the pulsed laser deposition method and was found to be highly crystalline and textured when deposited over 450°C. After achieving highly crystalline SrRuO3 films, capacitors using the ferroelectric material - PZT (PbZr0.5Ti0.48O3) were successfully fabricated on Pt/(100)Si substrates. The ferroelectric properties of the films were determined by the RT66A Standardized Ferroelectric Test System. The structural properties of the films were analyzed by X-ray diffraction. Transmission electron microscopy was used to determine the crystallinity and quality of interfaces among different layers.

Microstructure of GaAs nanocrystals formed inside single crystalline silicon

1996 ◽  
Vol 54 ◽  
pp. 968-969
Author(s):  
Jane G. Zhu ◽  
C. W. White ◽  
J. D. Budai ◽  
M. J. Yacaman ◽  
G. Mondragon
Keyword(s):  
Electronic Device ◽  
Crystalline Silicon ◽  
Semiconductor Nanocrystals ◽  
Implantation Technique ◽  
Single Crystalline Silicon ◽  
Semiconductor Technology ◽  
Cross Sectional ◽  
Si Substrates ◽  
Transmission Electron ◽  
Device Applications

Semiconductor nanocrystals exhibit novel properties that are important for electronic and opto-electronic device applications. Many methods have been developed to synthesize semiconductor nanocrystals. Among them is the ion implantation technique, which is compatible with the semiconductor technology. It has been recently reported that the compound semiconductor GaAs can be formed inside Si by sequential implantation of Ga and As and thermal annealing.In this study, GaAs nanocrystals were formed by sequential implantation of As and Ga, with the same dose of 1 x 1017 cm-2, into (100) Si substrates at 550°C. The implantation energies were chosen so that the Ga and As ions are overlapped over a few hundred nanometers in depth. The samples were then annealed at 1000°C for 1 h in flowing Ar + 4%H2 atmosphere to form GaAs precipitates. Transmission electron microscopy (TEM) has been used to study the microstructures of these samples.The cross-sectional TEM image in Fig. 1 shows the GaAs precipitates formed inside the Si substrateimplanted with As and then Ga.

Ion Beam Synthesis of Luminescent Si and Ge Nanocrystals in a Silicon Dioxide Matrix

1993 ◽  
Vol 321 ◽  
Author(s):  
H. A. Atwater ◽  
K. V. Shcheglov ◽  
S. S. Wong ◽  
K. J. Vahala ◽  
R. C. Flagan ◽  
...  
Keyword(s):  
Ion Beam ◽  
Optoelectronic Device ◽  
Structural Defects ◽  
Si Substrates ◽  
Localized State ◽  
Transmission Electron ◽  
Ion Beam Synthesis ◽  
Theoretical Predictions ◽  
Device Applications ◽  
Ge Nanocrystals

ABSTRACTIon beam synthesis of Si and Ge nanocrystals in an SiO2 Matrix is performed by precipitation from supersaturated solid solutions created by ion implantation. Films of SiO2 on (100) Si substrates are implanted with Si and Ge at doses 1 × 1016/cm2 - 5 × 1016/cm2. IMplanted samples are subsequently annealed to induce precipitation of Si and Ge nanocrystals. Raman spectroscopy and high-resolution transmission electron microscopy indicate a correlation between visible room-temperature photoluminescence and the formation of diamond cubic nanocrystals approximately 2–5 nm in diameter in annealed samples. As-implanted but unannealed samples do not exhibit luminescence. Rutherford backscattering spectra indicate a steepening of implanted Ge profiles upon annealing. Photoluminescence spectra are correlated with annealing temperatures, and compared with theoretical predictions for various possible luminescence Mechanisms, such as radiative recombination of quantum-confined excitons, as well as possible localized state luminescence related to structural defects in SiO2 Potential optoelectronic device applications are also discussed.

Fabrication and Optical Properties of ZnO Quantum Dots

2007 ◽  
Vol 31 ◽  
pp. 71-73
Author(s):  
X.H. Zhang ◽  
Soo Jin Chua ◽  
A.M. Yong ◽  
S.Y. Chow ◽  
H.Y. Yang ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Quantum Confinement ◽  
Silicon Oxide ◽  
Quantum Confinement Effect ◽  
Blue Shift ◽  
Si Substrates ◽  
Transmission Electron ◽  
Oxide Matrix ◽  
Zno Quantum Dots ◽  
Subsequent Thermal Annealing

Using a simple process of the deposition of ZnO thin films on SiOx/Si substrates and subsequent thermal annealing, we fabricated ZnO quantum dots embedded in silicon oxide matrix. The ZnO quantum dots were characterized using transmission electron microscopy and timeintegrated photoluminescence. The photoluminescence of the quantum dots show a blue-shift of 47 meV due to the quantum confinement effect.

TEM and cathodoluminescence of precipitates in II-VI semiconductors

1988 ◽  
Vol 46 ◽  
pp. 488-489
Author(s):  
Joanna L. Batstone
Keyword(s):  
Crystal Growth ◽  
Band Gap ◽  
Local Strain ◽  
Wide Band ◽  
Optoelectronic Device ◽  
Wide Band Gap ◽  
Bulk Crystal Growth ◽  
Transmission Electron ◽  
Device Applications ◽  
Stoichiometry Control

Interest in II-VI semiconductors centres around optoelectronic device applications. The wide band gap II-VI semiconductors such as ZnS, ZnSe and ZnTe have been used in lasers and electroluminescent displays yielding room temperature blue luminescence. The narrow gap II-VI semiconductors such as CdTe and HgxCd1-x Te are currently used for infrared detectors, where the band gap can be varied continuously by changing the alloy composition x.Two major sources of precipitation can be identified in II-VI materials; (i) dopant introduction leading to local variations in concentration and subsequent precipitation and (ii) Te precipitation in ZnTe, CdTe and HgCdTe due to native point defects which arise from problems associated with stoichiometry control during crystal growth. Precipitation is observed in both bulk crystal growth and epitaxial growth and is frequently associated with segregation and precipitation at dislocations and grain boundaries. Precipitation has been observed using transmission electron microscopy (TEM) which is sensitive to local strain fields around inclusions.

Electron Energy Analysis of Germanium and Silica Layers on Silicon Substrates

1975 ◽  
Vol 33 ◽  
pp. 96-97
Author(s):  
R. W. Ditchfield ◽  
A. G. Cullis
Keyword(s):  
Epitaxial Growth ◽  
Electron Energy ◽  
Silicon Substrates ◽  
Secondary Phases ◽  
Si Substrates ◽  
Transmission Electron ◽  
Layer Structures ◽  
Si Films ◽  
Electron Energy Loss ◽  
Growth Centres

An energy analyzing transmission electron microscope of the Möllenstedt type was used to measure the electron energy loss spectra given by various layer structures to a spatial resolution of 100Å. The technique is an important, method of microanalysis and has been used to identify secondary phases in alloys and impurity particles incorporated into epitaxial Si films.Layers Formed by the Epitaxial Growth of Ge on Si Substrates Following studies of the epitaxial growth of Ge on (111) Si substrates by vacuum evaporation, it was important to investigate the possible mixing of these two elements in the grown layers. These layers consisted of separate growth centres which were often triangular and oriented in the same sense, as shown in Fig. 1.

Defects in β-SiC thin films grown on α-SiC substrates

1988 ◽  
Vol 46 ◽  
pp. 568-569
Author(s):  
Karren L. More
Keyword(s):  
Thin Films ◽  
Semiconductor Device ◽  
Lattice Mismatch ◽  
Chemical Vapor ◽  
Substrate Material ◽  
Growth Interface ◽  
Si Substrates ◽  
Thermal Expansion Coefficients ◽  
Device Applications ◽  
Expansion Coefficients

Beta-SiC is an ideal candidate material for use in semiconductor device applications. Currently, monocrystalline β-SiC thin films are epitaxially grown on {100} Si substrates by chemical vapor deposition (CVD). These films, however, contain a high density of defects such as stacking faults, microtwins, and antiphase boundaries (APBs) as a result of the 20% lattice mismatch across the growth interface and an 8% difference in thermal expansion coefficients between Si and SiC. An ideal substrate material for the growth of β-SiC is α-SiC. Unfortunately, high purity, bulk α-SiC single crystals are very difficult to grow. The major source of SiC suitable for use as a substrate material is the random growth of {0001} 6H α-SiC crystals in an Acheson furnace used to make SiC grit for abrasive applications. To prepare clean, atomically smooth surfaces, the substrates are oxidized at 1473 K in flowing 02 for 1.5 h which removes ∽50 nm of the as-grown surface. The natural {0001} surface can terminate as either a Si (0001) layer or as a C (0001) layer.

Influence of MBE Growth Conditions on Dislocation Densities of GaAs/Ge Epilayers Grown on Silicon Substrates

1985 ◽  
Vol 43 ◽  
pp. 364-365
Author(s):  
K.M. Hones ◽  
P. Sheldon ◽  
B.G. Yacobi ◽  
A. Mason
Keyword(s):  
High Efficiency ◽  
Lattice Mismatch ◽  
Low Cost ◽  
Growth Conditions ◽  
Nonradiative Recombination ◽  
Device Structure ◽  
Si Substrates ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Dislocation Type

There is increasing interest in growing epitaxial GaAs on Si substrates. Such a device structure would allow low-cost substrates to be used for high-efficiency cascade- junction solar cells. However, high-defect densities may result from the large lattice mismatch (∼4%) between the GaAs epilayer and the silicon substrate. These defects can act as nonradiative recombination centers that can degrade the optical and electrical properties of the epitaxially grown GaAs. For this reason, it is important to optimize epilayer growth conditions in order to minimize resulting dislocation densities. The purpose of this paper is to provide an indication of the quality of the epitaxially grown GaAs layers by using transmission electron microscopy (TEM) to examine dislocation type and density as a function of various growth conditions. In this study an intermediate Ge layer was used to avoid nucleation difficulties observed for GaAs growth directly on Si substrates. GaAs/Ge epilayers were grown by molecular beam epitaxy (MBE) on Si substrates in a manner similar to that described previously.

Transmission Electron Microscopy characterization of epitaxial III-V semiconductor thin films grown on Si(100) by ion-assisted deposition

1990 ◽  
Vol 48 (4) ◽  
pp. 686-687
Author(s):  
L. Hultman ◽  
C.-H. Choi ◽  
R. Kaspi ◽  
R. Ai ◽  
S.A. Barnett
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Ion Irradiation ◽  
High Energy ◽  
Nucleation Mechanism ◽  
Layer By Layer ◽  
Extended Defect ◽  
Island Formation ◽  
Si Substrates ◽  
Transmission Electron

III-V semiconductor films nucleate by the Stranski-Krastanov (SK) mechanism on Si substrates. Many of the extended defects present in the films are believed to result from the island formation and coalescence stage of SK growth. We have recently shown that low (-30 eV) energy, high flux (4 ions per deposited atom), Ar ion irradiation during nucleation of III-V semiconductors on Si substrates prolongs the 1ayer-by-layer stage of SK nucleation, leading to a decrease in extended defect densities. Furthermore, the epitaxial temperature was reduced by >100°C due to ion irradiation. The effect of ion bombardment on the nucleation mechanism was explained as being due to ion-induced dissociation of three-dimensional islands and ion-enhanced surface diffusion.For the case of InAs grown at 380°C on Si(100) (11% lattice mismatch), where island formation is expected after ≤ 1 monolayer (ML) during molecular beam epitaxy (MBE), in-situ reflection high-energy electron diffraction (RHEED) showed that 28 eV Ar ion irradiation prolonged the layer-by-layer stage of SK nucleation up to 10 ML. Otherion energies maintained layer-by-layer growth to lesser thicknesses. The ion-induced change in nucleation mechanism resulted in smoother surfaces and improved the crystalline perfection of thicker films as shown by transmission electron microscopy and X-ray rocking curve studies.

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