SyLMAND: a microfabrication beamline with wide spectral and beam power tuning range at the Canadian Light Source

2019 ◽  
Vol 26 (2) ◽  
pp. 565-570 ◽  
Author(s):  
Garth Wells ◽  
Sven Achenbach ◽  
Venkat Subramanian ◽  
Michael Jacobs ◽  
David Klymyshyn ◽  
...  
Keyword(s):  
Light Source ◽  
Rf Mems ◽  
Rotating Disk ◽  
Power Reduction ◽  
Beam Power ◽  
User Program ◽  
Micro Electro Mechanical Systems ◽  
Micro Fluidics ◽  
Gas Atmosphere ◽  
Polymer Microstructures

SyLMAND, the Synchrotron Laboratory for Micro and Nano Devices, is a recently commissioned microfabrication bend magnet beamline with ancillary cleanroom facilities at the Canadian Light Source. The synchrotron radiation is applied to pattern high-aspect-ratio polymer microstructures used in the area of micro-electro-mechanical systems (MEMS). SyLMAND particularly focuses on spectral and beam power adjustability and large exposable area formats in an inert gas atmosphere; a rotating-disk intensity chopper allows for independent beam-power reduction, while continuous spectral tuning between 1–2 keV and >15 keV photon energies is achieved using a double-mirror system and low-atomic-number filters. Homogeneous exposure of samples up to six inches in diameter is performed in the experimental endstation, a vertically scanning precision stage (scanner) with tilt and rotation capabilities under 100 mbar helium. Commissioning was completed in late 2017, and SyLMAND is currently ramping up its user program, mostly in the areas of RF MEMS, micro-fluidics/life sciences and micro-optics.

scholarly journals A Miniature Optical Force Dual-Axis Accelerometer Based on Laser Diodes and Small Particles Cavities

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1375
Author(s):  
Junji Pu ◽  
Kai Zeng ◽  
Yulie Wu ◽  
Dingbang Xiao
Keyword(s):  
Light Source ◽  
Optical System ◽  
High Sensitivity ◽  
Measurement Range ◽  
Optical Force ◽  
Zero Bias ◽  
Micro Electro Mechanical Systems ◽  
Force Effect ◽  
High Measurement ◽  
Mems Technology

In recent years, the optical accelerometer based on the optical trapping force effect has gradually attracted the attention of researchers for its high sensitivity and high measurement accuracy. However, due to its large size and the complexity of optical path adjustment, the optical force accelerometers reported are only suitable for the laboratory environment up to now. In this paper, a miniature optical force dual-axis accelerometer based on the miniature optical system and a particles cavity which is prepared by Micro-Electro-Mechanical Systems (MEMS) technology is proposed. The overall system of the miniature optical levitation including the miniature optical system and MEMS particles cavity is a cylindrical structure with a diameter of about 10 mm and a height of 33 mm (Φ 10 mm × 33 mm). Moreover, the size of this accelerometer is 200 mm × 100 mm × 100 mm. Due to the selected light source being a laser diode light source with elliptical distribution, it is sensitive to the external acceleration in both the long axis and the short axis. This accelerometer achieves a measurement range of ±0.17 g–±0.26 g and measurement resolution of 0.49 mg and 1.88 mg. The result shows that the short-term zero-bias stability of the two orthogonal axes of the optical force accelerometer is 4.4 mg and 9.2 mg, respectively. The main conclusion that can be drawn is that this optical force accelerometer could provide an effective solution for measuring acceleration with an optical force effect for compact engineering devices.

Scope of RF MEMS Technology for Microwave Circuits and Systems

2021 ◽  
pp. 1-22
Author(s):  
Kanthamani Sundharajan
Keyword(s):  
Rf Mems ◽  
Low Cost ◽  
Microwave Circuits ◽  
Micro Electro Mechanical Systems ◽  
Mems Switches ◽  
Phased Array Antennas ◽  
Array Antennas ◽  
Rf Mems Switches ◽  
Mems Technology ◽  
Key Issues

Micro-electro mechanical systems (MEMS) technology has facilitated the need for innovative approaches in the design and development of miniaturized, effective, low-cost radio frequency (RF) microwave circuits and systems. This technology is expected to have significant role in today's 5G applications for the development of reconfigurable architectures. This chapter presents an overview of the evolution of MEMS-based subsystems and devices, especially switches and phased array antennas. This chapter also discusses the key issues in design and analysis of RF MEMS-based devices, particularly with primary emphasis on RF MEMS switches and antennas.

RF-MEMS Based Oscillators

2012 ◽  
pp. 120-155
Author(s):  
Anis Nurashikin Nordin
Keyword(s):  
Acoustic Wave ◽  
Rf Mems ◽  
Low Cost ◽  
Individual Characteristics ◽  
Bulk Acoustic Wave ◽  
Mems Devices ◽  
Device Structure ◽  
Micro Electro Mechanical Systems ◽  
Wireless Transceiver ◽  
Film Bulk

Today’s high-tech consumer market demand complex, portable personal wireless consumer devices that are low-cost and have small sizes. Creative methods of combining mature integrated circuit (IC) fabrication techniques with innovative radio-frequency micro-electro-mechanical systems (RF-MEMS) devices has given birth to wireless transceiver components, which operate at higher frequencies but are manufactured at the low-cost of standard ICs. Oscillators, RF bandpass filters, and low noise amplifiers are the most critical and important modules of any wireless transceiver. Their individual characteristics determine the overall performance of a transceiver. This chapter illustrates RF-oscillators that utilize MEMS devices such as resonators, varactors, and inductors for frequency generation. Emphasis will be given on state of the art RF-MEMS components such as film bulk acoustic wave, surface acoustic wave, flexural mode resonators, lateral and vertical varactors, and solenoid and planar inductors. The advantages and disadvantages of each device structure are described, with reference to the most recent work published in the field.

A fabrication process based on structural layer formation using Au–Au thermocompression bonding for RF MEMS capacitive switches and their performance

2014 ◽  
Vol 6 (5) ◽  
pp. 473-480 ◽  
Author(s):  
Cagri Cetintepe ◽  
Ebru Sagiroglu Topalli ◽  
Simsek Demir ◽  
Ozlem Aydin Civi ◽  
Tayfun Akin
Keyword(s):  
Transmission Lines ◽  
Rf Mems ◽  
Mechanical Design ◽  
Sacrificial Layer ◽  
Fabrication Process ◽  
Worst Case ◽  
Micro Electro Mechanical Systems ◽  
Wave Measurements ◽  
Thermocompression Bonding ◽  
Structural Layer

This paper presents a radio frequency micro-electro-mechanical-systems (RF MEMS) fabrication process based on a stacked structural layer and Au–Au thermocompression bonding, and reports on the performance of a sample RF MEMS switch design implemented with this process. The structural layer consists of 0.1 µm SiO2/0.2 µm SixNy/1 µm Cr–Au layers with a tensile stress less than 50 MPa deposited on a silicon handle wafer. The stacked layer is bonded to a base wafer where the transmission lines and the isolation dielectric of the capacitive switch are patterned. The process flow does not include a sacrificial layer; a recess etched in the base wafer provides the air gap instead. The switches are released by thinning and complete etching of the silicon handle wafer by deep reactive ion etching (DRIE) and tetramethylammonium hydroxide (TMAH) solution, respectively. Millimeter-wave measurements of the fabricated RF MEMS switches demonstrate satisfactory up-state performance with the worst-case return and insertion losses of 13.7 and 0.38 dB, respectively; but the limited isolation at the down-state indicates a systematic problem with these first-generation devices. Optical profile inspections and retrospective electromechanical analyses not only confirm those measurement results; but also identify the problem as the curling of the MEMS bridges along their width, which can be alleviated in the later fabrication runs through proper mechanical design.

RF-MEMS Application to RF Tuneable Circuits

2016 ◽  
Vol 100 ◽  
pp. 100-108
Author(s):  
Roberto Sorrentino ◽  
Paola Farinelli ◽  
Alessandro Cazzorla ◽  
Luca Pelliccia
Keyword(s):  
Communication Systems ◽  
Satellite Communication ◽  
Rf Mems ◽  
Low Loss ◽  
Micro Electro Mechanical Systems ◽  
Mems Switches ◽  
High Linearity ◽  
Technological Developments ◽  
Intermodulation Distortions ◽  
Complex Circuits

The bursting wireless communication market, including 5G, advanced satellite communication systems and COTM (Communication On The Move) terminals, require ever more sophisticated functions, from multi-band and multi-function operations to electronically steerable and reconfigurable antennas, pushing technological developments towards the use of tunable microwave components and circuits. Reconfigurability allows indeed for reduced complexity and cost of the apparatuses. In this context, RF MEMS (Micro-Electro-Mechanical-Systems) technology has emerged as a very attractive solution to realize both tunable devices (e.g. variable capacitors, inductors and micro-relays), as well as complex circuits (e.g. tunable filters, reconfigurable matching networks and reconfigurable beam forming networks for phased array antennas). High linearity, low loss and high miniaturization are the typical advantages of RF MEMS over conventional technologies. Micromechanical components fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, switching and frequency generation allow for miniaturized wireless front-ends via higher levels of integration. In addition, the inherent high linearity of the MEMS switches enables carrier aggregations without introducing intermodulation distortions. This paper will review the recent advances in the development of the RF MEMS to RF tunable circuits and systems.

Fabrication Technology of Involute Micro Gear Based on Two-Photon of Femtosecond Laser

2010 ◽  
Vol 44-47 ◽  
pp. 670-674 ◽  
Author(s):  
Shu Feng Sun
Keyword(s):  
Femtosecond Laser ◽  
Light Source ◽  
Single Photon ◽  
Three Dimensional ◽  
Photon Absorption ◽  
Micro Electro Mechanical Systems ◽  
Excitation Light ◽  
Two Photon ◽  
Machining System ◽  
Set Up

Microfabrication is a kind of critical technology for the development of Micro Electro-Mechanical Systems (MEMS). The frequently-used microfabrication technologies are electric discharge machining, photoetching, LIGA and laser fabrication, et al. Micro structures may be fabricated by these technologies. The polymerization principle of two-photon of femtosecond laser is different from that of single-photon. Photoinitiator of photosensing material absorbs two photons simultaneously to accomplish energy level transition and to induce the material to occur photochemical reaction. For the material absorbing two photons, the energy of each photon is equivalent to half of the energy that needed by the material transiting from ground state to excited state. It is also equal to half of the energy needed by the material occurring single-photon absorption. Therefore, the photonic frequency of two-photon excitation light source is half of the single-photon light source. According to two-photon fabrication principle, machining system of two-photon of femtosecond laser is set up. Which includes light path transmission equipment, three dimensional micro displacement scanning stage and control software, et al. Involute micro gear is fabricated by two-photon of femtosecond laser generated by the system.

Power Handling Capability Improvement of Metal-Contact RF MEMS Switches by Optimized Array Configuration Design of Contact Dimples

2014 ◽  
Vol 609-610 ◽  
pp. 1417-1421
Author(s):  
Chen Xu Zhao ◽  
Xin Guo ◽  
Tao Deng ◽  
Ling Li ◽  
Ze Wen Liu
Keyword(s):  
Rf Mems ◽  
Contact Point ◽  
Metal Contact ◽  
Micro Electro Mechanical Systems ◽  
Mems Switches ◽  
Array Configuration ◽  
Power Handling ◽  
Novel Approach ◽  
Rf Mems Switches ◽  
Power Handling Capability

This paper presents a novel approach to enhancing power-handling capability of metal-contact radio-frequency micro-electro-mechanical systems (RF MEMS) switches based on an Optimized Array Configured (OAC) contact dimples design. The simulation results reveal that this strategy can distribute the RF current more uniformly through each contact of the switch than traditional multiple parallel-configured contacts design, thus leading to a more effective reduction of current through each contact. Therefore, probability of micromelding and adhesion at metal contact point owing to localized high current induced Joule heating, which limits the power handling capability of the metal-contact RF MEMS switch, can be effectively reduced by the proposed approach. Comparing with previously fabricated switch, power-handling capability of the switch with OAC contact dimples can be dramatically improved over 390%.

Quantification of Uncertainty in Creep Failure in RF-MEMS Switches

2012 ◽  
Author(s):  
Peter A. Kolis ◽  
Marisol Koslowski ◽  
Anil K. Bajaj
Keyword(s):  
Rf Mems ◽  
Beam Model ◽  
Creep Failure ◽  
Micro Electro Mechanical Systems ◽  
Modal Expansion ◽  
Mems Switches ◽  
Electrostatically Actuated ◽  
Mems Switch ◽  
Rf Mems Switches

We present simulations of the dynamic response of radio frequency micro-electro-mechanical-systems (RF-MEMS) switches undergoing creep deformation. The model includes a microscale-informed Coble creep formulation incorporated in a beam model of an electrostatically actuated RF-MEMS switch, and it is solved using a Ritz-Galerkin based modal expansion. The resulting effects on the long-term device behavior as well as the implications of uncertainty in the device geometry and material parameters are studied. We find that the addition of creep to the beam model results in an undesired degradation of the device performance, as evidenced by decreases in the closing and release voltages.

A correlation of capacitive RF-MEMS reliability to AlN dielectric film spontaneous polarization

2009 ◽  
Vol 1 (1) ◽  
pp. 43-47 ◽  
Author(s):  
Eleni Papandreou ◽  
George Papaioannou ◽  
Tomas Lisec
Keyword(s):  
Electrical Properties ◽  
Spontaneous Polarization ◽  
Degradation Rate ◽  
Rf Mems ◽  
Dielectric Film ◽  
Capacitive Switches ◽  
Metal Insulator ◽  
Micro Electro Mechanical Systems ◽  
Metal Insulator Metal ◽  
Life Tests

This paper investigates the effect of spontaneous polarization of magnetron-sputtered aluminum nitride on the electrical properties and reliability of Radio Frequency – Micro-Electro-Mechanical Systems capacitive switches. The assessment is performed with the aid of application of thermally stimulated polarization currents in metal-insulator-metal capacitors and temperature dependence of device capacitance. The study reveals the presence of a surface charge, which is smaller than that expected from material spontaneous polarization, but definitely is responsible for the low degradation rate under certain bias polarization life tests.

Design and characterization of an active recovering mechanism for high-performance RF MEMS redundancy switches

2011 ◽  
Vol 3 (5) ◽  
pp. 539-546 ◽  
Author(s):  
Francesco Solazzi ◽  
Augusto Tazzoli ◽  
Paola Farinelli ◽  
Alessandro Faes ◽  
Viviana Mulloni ◽  
...  
Keyword(s):  
High Performance ◽  
Rf Mems ◽  
Time To Failure ◽  
Micro Electro Mechanical Systems ◽  
Mems Switch ◽  
Rf Measurement ◽  
Switch Time ◽  
Measurement Results ◽  
Better Than

This paper presents the design and characterization of an active push/pull toggle RF micro-electro-mechanical systems (MEMS) switch for satellite redundancy networks. The actively controlled pull-up mechanism allows for extended restoring capabilities of the switch in case of ON-state stiction. As a proof of concept an active push/pull MEMS capacitive switch was modeled, designed, and manufactured in shunt configuration on a 50 Ω coplanar transmission line. RF measurement results show a return loss better than 15 dB in the 0.1–40 GHz range and an insertion loss better than 0.5 dB over the same range. The restoring capability of the switch was experimentally proved up to 9 h, and a predictive model was proposed for the estimation of the switch time to failure.

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