Lifetime estimation of tantalum capacitor for mobile applications using empirical and experimental techniques: a DOE approach

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Cherry Bhargava ◽  
Pardeep Kumar Sharma ◽  
Ketan Kotecha
Keyword(s):  
Mobile Applications ◽  
Empirical Method ◽  
Circuit Board ◽  
Experimental Techniques ◽  
Residual Lifetime ◽  
Content Type ◽  
Accelerated Life ◽  
Tantalum Capacitor ◽  
Faulty Component ◽  
The Military

PurposeCapacitors are one of the most common passive components on a circuit board. From a tiny toy to substantial satellite, a capacitor plays an important role. Untimely failure of a capacitor can destruct the entire system. This research paper targets the reliability assessment of tantalum capacitor, to reduce e-waste and enhance its reusable capability.Design/methodology/approachThe residual lifetime of a tantalum capacitor is estimated using the empirical method, i.e. military handbook MILHDBK2017F, and validated using an experimental approach, i.e. accelerated life testing (ALT). The various influencing acceleration factors are explored, and experiments are designed using Taguchi's approach. Empirical methods such as the military handbook is used for assessing the reliability of a tantalum capacitor, for ground and mobile applications.FindingsAfter exploring the lifetime of a tantalum capacitor using empirical and experimental techniques, an error analysis is conducted, which shows the validity of empirical technique, with an accuracy of 95.21%.Originality/valueThe condition monitoring and health prognostics of tantalum capacitors, for ground and mobile applications, are explored using empirical and experimental techniques, which warns the user about its residual lifetime so that the faulty component can be replaced in time.

Statistical and intelligent reliability analysis of multi-layer ceramic capacitor for ground mobile applications using Taguchi’s approach

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Cherry Bhargava ◽  
Pardeep Kumar Sharma
Keyword(s):  
Regression Analysis ◽  
Electronic Device ◽  
Back Propagation ◽  
Empirical Method ◽  
Residual Lifetime ◽  
Content Type ◽  
Feed Forward Back Propagation ◽  
Intelligent Technique ◽  
Global Issue ◽  
Faulty Component

PurposeAlthough Multi-Layer Ceramic Capacitors (MLCC) are known for its better frequency performance and voltage handling capacity, but under various environmental conditions, its reliability becomes a challenging issue. In modern era of integration, the failure of one component can degrade or shutdown the whole electronic device. The lifetime estimation of MLCC can enhance the reuse capability and furthermore, reduces the e-waste, which is a global issue.Design/methodology/approachThe residual lifetime of MLCC is estimated using empirical method i.e. Military handbook MILHDBK2017F, statistical method i.e. regression analysis using Minitab18.1 as well as intelligent technique i.e. artificial neural networks (ANN) using MATLAB2017b. ANN Feed-Forward Back-Propagation learning with sigmoid transfer function [3–10–1–1] is considered using 73% of available data for training and 27% for testing and validation. The design of experiments is framed using Taguchi’s approach L16 orthogonal array.FindingsAfter exploring the lifetime of MLCC, using empirical, statistical and intelligent techniques, an error analysis is conducted, which shows that regression analysis has 97.05% accuracy and ANN has 94.07% accuracy.Originality/valueAn intelligent method is presented for condition monitoring and health prognostics of MLCC, which warns the user about its residual lifetime so that faulty component can be replaced in time.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Ethical listening to employees during a pandemic: new approaches, barriers and lessons

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Marlene S. Neill ◽  
Shannon A. Bowen
Keyword(s):  
Mobile Applications ◽  
Feedback Loop ◽  
Ethical Considerations ◽  
Communication Management ◽  
Content Type ◽  
Building Relationships ◽  
Global Pandemic ◽  
Management Professionals ◽  
Depth Interviews ◽  
Practical Implications

PurposeThe purpose of this study was to identify new challenges to organizational listening posed by a global pandemic and how organizations are overcoming those barriers.Design/methodology/approachThe researchers conducted 30 in-depth interviews with US communication management professionals.FindingsCommunication management professionals value listening, but do not always make it the priority that it merits. They listed lack of desire of senior management, time, and trust of employees as barriers to effective organizational listening. The global COVID pandemic has made it more challenging to connect to employees working remotely and to observe nonverbal cues that are essential in communication. Organizations are adapting by using more frequent pulse surveys, video conferencing technology and mobile applications. Most importantly, this pandemic has enhanced moral sensitivity and empathy leading organizations to make decisions based on ethical considerations.Research limitations/implicationsThe researchers examined organizational listening applying employee-organization relationships (EOR) theory and found that trust is essential. Trust can be enhanced through building relationships with employees, ethical listening and closing the feedback loop by communicating how employers are using the feedback received by employees to make a positive change.Practical implicationsCommunication managers need to place a higher priority on listening to employees. Their listening efforts need to be authentic, morally autonomous or open-minded, and empathetic to respect the genuine concerns of employees and how organizational decisions will affect them. Listening is essential to serving as an ethical and effective strategic counselor.Originality/valueThe study examines organizational listening in the context of a global pandemic.

A high-power PCCM LED driver based on GaN eHEMT with hybrid dimming modes

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xixian Lin ◽  
Yuming Zhang ◽  
Yimeng Zhang ◽  
Guangjian Rong
Keyword(s):  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Circuit Board ◽  
Switching Frequency ◽  
Led Driver ◽  
Power Circuit ◽  
Content Type ◽  
Wide Range ◽  
Circuit Function ◽  
Pwm Dimming

Purpose The purpose of this study is to design a more flexible and larger range of the dimming circuit that achieves the independence of multiple LED strings drive and can time-multiplex the power circuit. Design/methodology/approach The state-space method is used to model the BUCK circuit working in Pseudo continuous conduction mode, analyze the frequency characteristics of the system transfer function and design the compensation network. Build a simulation platform on the Orcad PSPICE platform and verify the function of the designed circuit through the simulation results. Use Altium Designer 16 to draw the printed circuit board, complete the welding of various components and use the oscilloscope, direct current (DC) power supply and a signal generator to verify the circuit function. Findings A prototype of the proposed LED driver is fabricated and tested. The measurement results show that the switching frequency can be increased to 1 MHz, Power inductance is 2.2 µH, which is smaller than current research. The dimming ratio can be set from 10% to 100%. The proposed LED driver can output more than 48 W and achieve a peak conversion efficiency of 91%. Originality/value The proposed LED driver adopts pulse width modulation (PWM) dimming at a lower dimming ratio and adopts DC dimming at a larger dimming ratio to realize switching PWM dimming to analog dimming. The control strategy can be more precise and have a wide range of dimming.

Cienfuegos affair threatens Mexico-US security ties

2021 ◽  
Keyword(s):  
Human Rights ◽  
Political Influence ◽  
The Political ◽  
Security Cooperation ◽  
Content Type ◽  
The Military ◽  
Trump Administration

Significance The situation has highlighted several issues of concern around the influence of the Mexican military, the government’s reliance on it and the challenges Mexico and its security agencies face in trying to meet US demands while addressing domestic threats. Impacts Mexican militarisation was facilitated by Trump administration apathy on human rights; this will change under President Joe Biden. Increased US-bound migration, encouraged by Biden’s more humane rhetoric, will heighten the need for bilateral security cooperation. Future Mexican administrations will struggle to reverse the political influence the military has obtained.

Robotic system design and development for automated dismantling of PCB waste

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ioan Doroftei ◽  
Daniel Chirita ◽  
Ciprian Stamate ◽  
Stelian Cazan ◽  
Carlos Pascal ◽  
...  
Keyword(s):  
Design Methodology ◽  
Printed Circuit Board ◽  
Vision System ◽  
Electronic Waste ◽  
Robotic System ◽  
Circuit Board ◽  
Short Introduction ◽  
Content Type ◽  
Printed Circuit ◽  
System A

Purpose The mass electronics sector is one of the most critical sources of waste, in terms of volume and content with dangerous effects on the environment. The purpose of this study is to provide an automated and accurate dismantling system that can improve the outcome of recycling. Design/methodology/approach Following a short introduction, the paper details the implementation layout and highlights the advantages of using a custom architecture for the automated dismantling of printed circuit board waste. Findings Currently, the amount of electronic waste is impressive while manual dismantling is a very common and non-efficient approach. Designing an automatic procedure that can be replicated, is one of the tasks for efficient electronic waste recovery. This paper proposes an automated dismantling system for the advanced recovery of particular waste materials from computer and telecommunications equipment. The automated dismantling architecture is built using a robotic system, a custom device and an eye-to-hand configuration for a stereo vision system. Originality/value The proposed approach is innovative because of its custom device design. The custom device is built using a programmable screwdriver combined with an innovative rotary dismantling tool. The dismantling torque can be tuned empirically.

Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint

2015 ◽  
Vol 27 (1) ◽  
pp. 52-58 ◽  
Author(s):  
Peter K. Bernasko ◽  
Sabuj Mallik ◽  
G. Takyi
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Layer Thickness ◽  
Solder Joints ◽  
Ageing Time ◽  
Circuit Board ◽  
Intermetallic Compound Layer ◽  
Content Type ◽  
Surface Mount

Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints. Design/methodology/approach – To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester). Findings – It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids. Research limitations/implications – A proper correlation between shear strength and fracture mode is required. Practical implications – The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint. Originality/value – The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Circuit World ◽  
2017 ◽  
Vol 43 (2) ◽  
pp. 45-55 ◽  
Author(s):  
Vadimas Verdingovas ◽  
Salil Joshy ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Electronic Device ◽  
Early Stage ◽  
Circuit Simulation ◽  
Circuit Board ◽  
Insulation Resistance ◽  
Electronic Circuits ◽  
Content Type ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input data for the circuit analysis. The SIR data were compared to the surface resistance values observable on a real device printed circuit board assembly. SIR issues at the component and circuit levels were analysed on the basis of parasitic circuit effects owing to the formation of a water layer as an electrical conduction medium. Findings This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic circuits. The effect of contamination and humidity is expressed as drift from the nominal resistance values of the resistors, self-discharge of the capacitors and the errors in the circuits due to parasitic leakage currents (reduction of SIR). Practical/implications The methodology of the analysis of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime. Originality/value Examples provide a basic link between the combined effect of humidity and contamination and the performance of electronic circuits. The methodology shown provides the possibility of addressing the climatic reliability of an electronic device at the early stage of device design by using typical SIR data representing the possible climate exposure.

Optimum time-censored simple ramp-stress accelerated life test sampling plan for the log-logistic distribution

2015 ◽  
Vol 21 (1) ◽  
pp. 112-132 ◽  
Author(s):  
Preeti Wanti Srivastava ◽  
Deepmala Sharma
Keyword(s):  
Sample Size ◽  
Asymptotic Variance ◽  
Sampling Plan ◽  
Accelerated Life Test ◽  
Test Plan ◽  
Life Test ◽  
Life Distribution ◽  
Optimal Test ◽  
Content Type ◽  
Accelerated Life

Purpose – Acceptance sampling plans are designed to decide about acceptance or rejection of a lot of products on the basis of sample drawn from it. Accelerating the life test helps in obtaining information about the lifetimes of high reliability products quickly. The purpose of this paper is to formulate an optimum time censored acceptance sampling plan based on ramp-stress accelerated life test (ALT) for items having log-logistic life distribution. The log-logistic life distribution has been found appropriate for highly reliable components such as power system components and insulating materials. Design/methodology/approach – The inverse power relationship has been used to model stress-life relationship. It is meant for analyzing data for which the accelerated stress is nonthermal in nature, and frequently used as an accelerating stress for products such as capacitors, transformers, and insulators. The method of maximum likelihood is used for estimating design parameters. The optimal test plan is obtained by minimizing variance of test-statistic that decides on acceptability or rejectibility of lot. The optimal test plan finds optimal sample size, stress rates, sample proportion allocated to each stress and lot acceptability constant such that producer’s risk and consumer’s risk is satisfied. Findings – Asymptotic variance plays a pivotal role in determining the sample size required for a sampling plan for deciding the acceptance/rejection of a lot. The sample size is minimized by optimally designing a ramp-stress ALT so that the asymptotic variance is minimized. Originality/value – The model suggested is of use to quality control and reliability engineers dealing with highly reliable items.

Guzman's death highlights legacy of terrorism in Peru

2021 ◽  
Keyword(s):  
Content Type ◽  
The Military

Significance Allegations about ‘terrorist’ and ‘communist’ leanings played a leading part in the polarising elections that brought new President Pedro Castillo to power. Impacts Sporadic armed attacks by SL remnants in the VRAEM area will persist. SL will remain a divisive influence within the left. The military will oppose attempts to bring SL within the compass of formal politics.

Sign in / Sign up

Export Citation Format

Share Document