Structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) thick film ceramics

2016 ◽  
Vol 33 (1) ◽  
pp. 9-14 ◽  
Author(s):  
R.P. Pawar ◽  
Vijaya Puri
Keyword(s):  
Electrical Resistivity ◽  
Thick Film ◽  
Microwave Absorption ◽  
Thick Films ◽  
Alumina Substrate ◽  
Microwave Properties ◽  
Frequency Range ◽  
Content Type ◽  
Dc Electrical Resistivity ◽  
Permittivity And Permeability

Purpose – This paper aims to study the structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) thick-film ceramics. Design/methodology/approach – The thick films of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) on the alumina substrate have been delineated using screen printing technique. The structural analysis was carried out using an X-ray diffraction method and scanning electron microscopy. The direct current (DC) electrical resistivity is measured using a two-probe method. Microwave absorption was studied in the 8-18 GHz frequency range by using the Waveguide Reflectometer Method. The permittivity and permeability in the 8-18 GHz frequency range were measured by using Voltage Standing Wave Ratio slotted section method. Findings – The thick films have orthorhombic perovskite structure with dominant (020) plane. By using first-principle calculation method, theoretical and experimental lattice parameter and cell volume of (Sr0.6Ca0.4) (CoyMn1−y) O3 are matched with each other. The cobalt content changes the morphology from plates to needles. The DC electrical resistivity increases with increase in Co content and decreases with increase in temperature. (Sr0.6Ca0.4) (CoyMn1−y) O3 thick film shows 75 per cent microwave absorption both in the X band and Ku band. The microwave permittivity and permeability decreases with increase in frequency and Co content. Originality/value – Structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0). Thick film ceramics on alumina substrate is reported for the first time.

Electric, magnetic and high frequency properties of screen printed ferrite-ferroelectric composite thick films on alumina substrate

2015 ◽  
Vol 32 (1) ◽  
pp. 25-31 ◽  
Author(s):  
N. Patil ◽  
N.B. Velhal ◽  
R. Pawar ◽  
Vijaya Puri
Keyword(s):  
Microwave Absorption ◽  
Thick Films ◽  
Alumina Substrate ◽  
Ferrite Content ◽  
Frequency Range ◽  
X Ray Diffraction ◽  
Content Type ◽  
X Ray ◽  
Scanning Electron ◽  
Screen Printed

Purpose – The purpose of this article is to study the effect of ferrite content on electric, magnetic and microwave properties of screen-printed y(Ni0.4Co0.2Cd0.4Fe2O4) + (1 − y)Pb(Zr0.52Ti0.48)O3 (y = 0.0, 0.15, 0.30, 0.45, 1.0) thick films on alumina. Design/methodology/approach – Thick films of ferrite–ferroelectric composite on alumina substrate have been delineated using screen printing technique. The structural analysis was carried out using X-ray diffraction method and scanning electron microscopy. The DC electrical resistivity was measured using the two-probe method. The magnetic measurement was carried out using a vibrating sample magnetometer. Microwave absorption was studied in the 8-18 GHz frequency range by using the vector network analyzer (N5230A). The permittivity in the 8-18 GHz frequency range was measured by using voltage standing wave ratio slotted section method. Findings – The formation of two individual ferrite–ferroelectric phases in composite thick films was confirmed by the X-ray diffraction patterns. The scanning electron microscope morphologies show the growth of cobalt-substituted nickel cadmium ferrite grains which are well dispersed in lead zirconium titanate matrix. The DC electrical resistivity increases with increase in ferrite content and decreases with increase in temperature. The present ferrite shows ferromagnetic nature and it increases saturation magnetization and coercivity of the composite thick films. Tuning properties are observed in the Ku-band and broadband X-band microwave absorption is observed in the composite thick films. The imaginary part of permittivity increases with an increase in ferrite content, which increases microwave absorption. The real part of microwave permittivity varied from 17 to around 22 with an increase in ferrite content and it decreases with frequency. The microwave conductivity, which increases with an increase in ferrite content, reveals the loss of polaron conduction, which supports the dielectric loss in the microwave region. Originality/value – Electric, magnetic and microwave properties of screen-printed y(Ni0.4Co0.2Cd0.4Fe2O4) + (1 − y)Pb(Zr0.52Ti0.48)O3 (y = 0.0, 0.15, 0.30, 0.45, 1.0) composite thick films on alumina substrate is reported for the first time.

Development of Glass-Free Metal Electrically Conductive Thick Films

2000 ◽  
Vol 123 (1) ◽  
pp. 64-69 ◽  
Author(s):  
Zongrong Liu ◽  
D. D. L. Chung
Keyword(s):  
Electrical Resistivity ◽  
Titanium Alloy ◽  
Thick Film ◽  
Thick Films ◽  
Pure Titanium ◽  
Glass Frit ◽  
Alumina Substrate ◽  
Electrically Conductive ◽  
Active Metal ◽  
Free Metal

Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution, and consequently, better wetting and bonding are expected by using active metal particles of a smaller size.

scholarly journals A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

2000 ◽  
Vol 23 (3) ◽  
pp. 163-173 ◽  
Author(s):  
Sunit Rane ◽  
Vijaya Puri
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Line Width ◽  
Firing Temperature ◽  
Thick Films ◽  
Alumina Substrate ◽  
Thin Film Technology ◽  
Binder Composition ◽  
Cu Thin Film ◽  
Ku Band

The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.

Microwave Properties of CuO Doped (Ba0.5,Sr0.5)TiO3 Thick-film Interdigital Capacitor on Alumina Substrate

2011 ◽  
Vol 59 (3(1)) ◽  
pp. 2457-2461 ◽  
Author(s):  
Seok-Woo Yun ◽  
Ku-Tak Lee ◽  
Kyoung-Soo Lee ◽  
Song-Min Nam ◽  
Jung-Hyuk Koh ◽  
...  
Keyword(s):  
Thick Film ◽  
Alumina Substrate ◽  
Microwave Properties ◽  
Interdigital Capacitor

Influence of Sn4+ on Structural and DC Electrical Resistivity of Ni-Zn Ferrite Thick Films

2016 ◽  
Vol 46 (3) ◽  
pp. 1427-1438 ◽  
Author(s):  
S. P. Dalawai ◽  
T. J. Shinde ◽  
A. B. Gadkari ◽  
N. L. Tarwal ◽  
J. H. Jang ◽  
...  
Keyword(s):  
Electrical Resistivity ◽  
Thick Films ◽  
Dc Electrical Resistivity ◽  
Zn Ferrite

Porous thick-film silver metallisation for thermally mismatched brazing operations in tokamak magnetic sensor

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000234-000238 ◽  
Author(s):  
Caroline Jacq ◽  
Thomas Maeder ◽  
Lucas Güniat ◽  
Adrien Corne ◽  
Duccio Testa ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Shear Stress ◽  
Electrical Resistivity ◽  
Thick Film ◽  
High Frequency ◽  
Graphite Powder ◽  
Alumina Substrate ◽  
Ceramic Technology ◽  
Maximal Stress ◽  
Sufficient Degree

A novel sensor based on thick-film + LTCC (low-temperature cofired ceramic) technology has been recently developed for sensing high-frequency 3D magnetic fields in tokamak fusion devices. For integration within the walls of the tokamak, the sensor has to be connected to the mineral-insulated cabling, which is carried out by brazing to ensure sufficient thermal stability. However, thermal mismatch stresses between the braze and the cable vs. the alumina substrate may cause local cracking of the latter during cooling, as the basic dense silver metallisation of the alumina does not provide a sufficient degree of stress decoupling. To address this issue, a series of porous metallisations have been formulated by incorporation of a mix of silver and fugitive graphite powder into a thick-film paste. To allow co-firing of thick, multi-layered prints. Such porous metallisations have allowed successful brazing operations, without cracking of the alumina substrate. Metallisations were assessed by measuring their electrical resistivity and shear stress have been realised as preliminary results to measure the influence of the porosity on the maximal stress before cracking.

Electrical, Dielectrical and Magnetic Properties of Zr-Mn Doped Nano-Ferrites

2012 ◽  
Vol 510-511 ◽  
pp. 301-306
Author(s):  
K. Khan ◽  
Ashari Maqsood
Keyword(s):  
Activation Energy ◽  
Electrical Resistivity ◽  
Drift Mobility ◽  
Nominal Composition ◽  
Frequency Range ◽  
Energy Increase ◽  
Dielectric Parameters ◽  
Dc Electrical Resistivity ◽  
Low Field ◽  
Mn Doped

We measured the dc electrical resistivity as a function of temperature and dielectric parameters in the frequency range 100 Hz to 3 MHz of nanosized Zr-Mn spinel ferrites with nominal composition CoFe2-2xZrxMnxO4(0.1x0.4). The dc electrical resistivity decreased with the rise in temperature for all the samples, showing a semiconductor like behavior. From the dc electrical resistivity the activation energy and drift mobility are determined. Both the drift mobility and activation energy increase with a rise inx. The dielectric constant, dielectric (losses) and ac electrical resistivity as a function of frequency are also reported. The low field ac magnetic susceptibility measurement showed that the ferrimagentic transition temperature is in the range of 4395 K to 6585 K.

Microwave wide band absorption by carbon from Corn cob-1

2016 ◽  
Vol 12 (2) ◽  
pp. 4204-4212 ◽  
Author(s):  
Maheshwar Sharon ◽  
Ritesh Vishwakarma ◽  
Abhijeet Rajendra Phatak ◽  
Golap Kalita ◽  
Nallin Sharma ◽  
...  
Keyword(s):  
Microwave Absorption ◽  
Agricultural Waste ◽  
Wide Band ◽  
Nickel Nitrate ◽  
Equivalent Amount ◽  
Frequency Range ◽  
Corn Cob ◽  
Different Temperatures ◽  
Band Absorption ◽  
5 Ghz

Corn cob, an agricultural waste, is paralyzed at different temperatures (700oC, 800oC and 900oC). Microwave absorption of carbon in the frequency range of 2 GHz to 8 GHz is reported. Carbon activated  with 5%  nickel nitrate showed more than 90% absorption of microwave in the frequency range from 6 GHz to 8 GHz, while carbon activated  with 10% Nickel nitrate treated corn cob showed 90% absorption  in the frequency range of 2.5 GHz to 5 GHz. Carbon showing the best absorption are characterized by XRD, Raman spectra and SEM . It is suggested that corn cob treatment   alone with KOH did not improve the microwave absorption, whereas treatment along with nickel nitrate improved the absorption property much better. It is proposed that treatment with nickel nitrate helps in creating suitable pores in carbon   which improved the absorption behavior because while treating carbon with 1N HCl helps to leach out nickel creating equivalent amount of pores in the carbon.

scholarly journals Piezoelectric Thick Film Deposition via Powder/Granule Spray in Vacuum: A Review

Actuators ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 59
Author(s):  
Deepak Rajaram Patil ◽  
Venkateswarlu Annapureddy ◽  
J. Kaarthik ◽  
Atul Thakre ◽  
Jun Akedo ◽  
...  
Keyword(s):  
Thick Film ◽  
Thick Films ◽  
Cost Effective ◽  
Aerosol Deposition ◽  
Ceramic Coatings ◽  
Film Deposition ◽  
Energy Harvesters ◽  
Ceramic Films ◽  
Dense Ceramic ◽  
Processing Techniques

Conventional thin-film processing techniques remain inadequate for obtaining superior dense ceramic thick films. The incompatibility of ceramic films prepared via other methods, such as screen printing, spin coating, and sputtering, is a major obstacle in the fabrication of thick film-based ceramic electronic components. The granule spray in vacuum (GSV) processes and aerosol deposition (AD) are important coating approaches for forming dense ceramic thick films featuring nanoscale crystallite structures at room temperature, which offer excellent material properties and facilitate cost-effective production. AD ceramic coatings require the acceleration of solid-state submicron ceramic particles via gas streams with a velocity of a few hundred meters per second, which are then wedged onto a substrate. This process is economical and particularly useful for the fabrication of piezoelectric thick film-based microactuators, energy harvesters, sensors, and optoelectronic devices. More recently, the GSV technique was improved to achieve more uniform and homogeneous film deposition after AD. This review article presents a detailed overview of the AD and GSV processes for piezoelectric thick films in terms of recent scientific and technological applications.

Effect of Cu substitution on magnetic and DC electrical resistivity properties of Ni–Zn nanoferrites

2021 ◽  
Author(s):  
K. Chandramouli ◽  
P. Anantha Rao ◽  
B. Suryanarayana ◽  
Vemuri Raghavendra ◽  
Shaik Jesus Mercy ◽  
...  
Keyword(s):  
Electrical Resistivity ◽  
Dc Electrical Resistivity ◽  
Cu Substitution
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