Microfabrication of Si3N4-polyimide membrane for thermo-pneumatic actuator

2015 ◽  
Vol 32 (1) ◽  
pp. 18-24 ◽  
Author(s):  
Norihan Abdul Hamid ◽  
J. Yunas ◽  
B. Yeop Majlis ◽  
A.A. Hamzah ◽  
B. Bais
Keyword(s):  
Thin Film ◽  
Temperature Increase ◽  
Adhesive Bonding ◽  
Nitride Layer ◽  
Pneumatic Actuator ◽  
Heat Condition ◽  
Micro Electro Mechanical Systems ◽  
Content Type ◽  
Lab On Chip ◽  
Polyimide Membrane

Purpose – The purpose of this paper is to discuss the fabrication technology and test of thermo-pneumatic actuator utilizing Si3N4-polyimide thin film membrane. Thin film polyimide membrane capped with Si3N4 thin layer is used as actuator membrane which is able to deform through thermal forces inside an isolated chamber. The fabricated membrane will be suitable for thermo-pneumatic-based membrane actuation for lab-on-chip application. Design/methodology/approach – The actuator device consisting of a micro-heater, a Si-based micro-chamber and a heat-sensitive square-shaped membrane is fabricated using surface and bulk-micromachining process, with an additional adhesive bonding process. The polyimide membrane is capped with a thin silicon nitride layer that is fabricated by using etch stop technique and spin coating. Findings – The deformation property of the membrane depend on the volumetric expansion of air particles in the heat chamber as a result of temperature increase generated from the micro-heater inside the chamber. Preliminary testing showed that the fabricated micro-heater has the capability to generate heat in the chamber with a temperature increase of 18.8 °C/min. Analysis on membrane deflection against temperature increase showed that heat-sensitive thin polyimide membrane can perform the deflection up to 65 μm for a temperature increase of 57°C. Originality/value – The dual layer polyimide capped with Si3N4 was used as the membrane material. The nitride layer allowed the polyimide membrane for working at extreme heat condition. The process technique is simple implementing standard micro-electro-mechanical systems process.

Highly selective piezoresistive sensor for mercury (Hg2+) ions detection using mercaptosuccinic acid-functionalized microcantilevers with cross-linked pyridinedicarboxylic acid

Sensor Review ◽  
2020 ◽  
Vol 40 (5) ◽  
pp. 543-558 ◽  
Author(s):  
Dinesh Ramkrushna Rotake ◽  
Anand Darji ◽  
Nitin S. Kale
Keyword(s):  
Thin Film ◽  
Limit Of Detection ◽  
Human Life ◽  
Microfluidic System ◽  
Micro Electro Mechanical Systems ◽  
Content Type ◽  
Mercaptosuccinic Acid ◽  
Piezoresistive Sensor ◽  
Field Investigations ◽  
Pyridinedicarboxylic Acid

Purpose This paper aims to report an insightful portable microfluidic system for rapid and selective sensing of Hg2+ in the picomolar (pM) concentration using microcantilever-based piezoresistive sensor. The detection time for various laboratory-based techniques is generally 12–24 h. The majority of modules used in the proposed platform are battery oriented; therefore, they are portable and handy to carry-out on-field investigations. Design/methodology/approach In this study, the authors have incorporated the benefit of three technologies, i.e. thin-film, nanoparticles (NPs) and micro-electro-mechanical systems, to selectively capture the Hg2+ at the pM concentration. The morphology and topography of the proposed sensor are characterized using field emission scanning electron microscopy and verification of the experimental results using energy dispersive X-ray. Findings The proposed portable microfluidic system is able to perform the detection in 5 min with a limit of detection (LOD) of 0.163 ng (0.81 pM/mL) for Hg2+, which perfectly describes its excellent performance over other reported techniques. Research limitations/implications A microcantilever-based technology is perfect for on-site detection, and a LOD of 0.163 ng (0.81 pM/mL) is outstanding compared to other techniques, but the fabrication of microcantilever sensor is complex. Originality/value Many researchers used NPs for heavy metal ions sensing, but the excess usage and industrialization of NPs are rapidly expanding harmful consequences on the human life and nature. Also, the LOD of the NPs-based method is limited to nanomolar concentration. The suggested microfluidic system used the benefit of thin-film and microcantilever devices to provide advancement over the NPs-based approach and it has a selective sensing in pM concentration.

scholarly journals Experimental Study on the Thickness-Dependent Hardness of SiO2 Thin Films Using Nanoindentation

Coatings ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 23
Author(s):  
Weiguang Zhang ◽  
Jijun Li ◽  
Yongming Xing ◽  
Xiaomeng Nie ◽  
Fengchao Lang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Grain Size ◽  
Integrated Circuits ◽  
Film Thickness ◽  
Depth Range ◽  
Micro Electro Mechanical Systems ◽  
Si Substrates ◽  
Sio2 Thin Film ◽  
Average Grain Size

SiO2 thin films are widely used in micro-electro-mechanical systems, integrated circuits and optical thin film devices. Tremendous efforts have been devoted to studying the preparation technology and optical properties of SiO2 thin films, but little attention has been paid to their mechanical properties. Herein, the surface morphology of the 500-nm-thick, 1000-nm-thick and 2000-nm-thick SiO2 thin films on the Si substrates was observed by atomic force microscopy. The hardnesses of the three SiO2 thin films with different thicknesses were investigated by nanoindentation technique, and the dependence of the hardness of the SiO2 thin film with its thickness was analyzed. The results showed that the average grain size of SiO2 thin film increased with increasing film thickness. For the three SiO2 thin films with different thicknesses, the same relative penetration depth range of ~0.4–0.5 existed, above which the intrinsic hardness without substrate influence can be determined. The average intrinsic hardness of the SiO2 thin film decreased with the increasing film thickness and average grain size, which showed the similar trend with the Hall-Petch type relationship.

Freestanding Fully Porous Polyimide Membrane for Thin Film Microextraction

2021 ◽  
Author(s):  
Xinyue Ma ◽  
Xiaohui Yan ◽  
Yi Wu ◽  
Qiankun Qiu ◽  
Yanshuo Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Polyimide Membrane

scholarly journals Silicon-Quartz Microcapillary Opto-Fluidic Platform Obtained by CMOS-Compatible Die to Wafer 200 mm Dual Bonding Process

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1018
Author(s):  
Giuseppe Fiorentino ◽  
Ben Jones ◽  
Sophie Roth ◽  
Edith Grac ◽  
Murali Jayapala ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
System Analysis ◽  
Quartz Substrate ◽  
Microfluidic System ◽  
Bonding Process ◽  
Microfluidic Channels ◽  
Fully Integrated ◽  
Lab On Chip ◽  
Human Blood Cells ◽  
On Chip

A composite, capillary-driven microfluidic system suitable for transmitted light microscopy of cells (e.g., red and white human blood cells) is fabricated and demonstrated. The microfluidic system consists of a microchannels network fabricated in a photo-patternable adhesive polymer on a quartz substrate, which, by means of adhesive bonding, is then connected to a silicon microfluidic die (for processing of the biological sample) and quartz die (to form the imaging chamber). The entire bonding process makes use of a very low temperature budget (200 °C). In this demonstrator, the silicon die consists of microfluidic channels with transition structures to allow conveyance of fluid utilizing capillary forces from the polymer channels to the silicon channels and back to the polymer channels. Compared to existing devices, this fully integrated platform combines on the same substrate silicon microfluidic capabilities with optical system analysis, representing a portable and versatile lab-on-chip device.

Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors

Circuit World ◽  
2014 ◽  
Vol 40 (1) ◽  
pp. 7-12 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Grazyna Koziol ◽  
Tomasz Serzysko
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Electrical Resistance ◽  
Printed Circuit Boards ◽  
Base Material ◽  
Forming Process ◽  
Content Type ◽  
Thin Film Resistors ◽  
Embedded Resistors ◽  
The Impact

Purpose – The purpose of this paper is to investigate the influence of parameters of embedded resistive elements manufacturing process as well as the influence of environmental factors on their electrical resistance. The investigations were made in comparison to the similar constructions of discrete chip resistors assembled to standard printed circuit boards (PCBs). Design/methodology/approach – The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon-silver inks as well as chip resistors in 0402 and 0603 packages. The polymer thick-film resistive films were screen-printed on the several types finishing materials of contact terminations such as copper, silver, and gold. To determine the sensitivity of embedded resistors versus standard assembled chip resistors on environmental exposure, the climatic chamber was used. The measurements of resistance were carried out periodically during the tests, and after the exposure cycles. Findings – The results show that the change of electrical resistance of embedded resistors, in dependence of construction and base material, is different and mainly not exceed the range of 3 per cent. The achieved results in reference to thin-film resistors are comparable with results for standard chip resistors. However, the results that were obtained for thick-film resistors with Ag and Ni/Au contacts are similar. It was not found the big differences between resistors with and without conformal coating. Research limitations/implications – The studies show that embedded resistors can be used interchangeably with chip resistors. It allows to save the area on the surface of PCB, occupied by these passive elements, for assembly of active elements (ICs) and thus enable to miniaturization of electronic devices. But embedding of passive elements into PCB requires to tackle the effect of each forming process steps on the operational properties. Originality/value – The technique of passive elements embedding into PCB is generally known; however, there are no detailed reports on the impact of individual process steps and environmental conditions on the stability of their electrical resistance. The studies allow to understand the importance of each factor process and the mechanisms of operational properties changes depending on the used materials.

A self-developed indoor three-dimensional pedestrian localization platform based on MEMS sensors

Sensor Review ◽  
2015 ◽  
Vol 35 (2) ◽  
pp. 157-167 ◽  
Author(s):  
Shengbo Sang ◽  
Ruiyong Zhai ◽  
Wendong Zhang ◽  
Qirui Sun ◽  
Zhaoying Zhou
Keyword(s):  
Low Cost ◽  
Angular Rate ◽  
Three Dimensional ◽  
Dead Reckoning ◽  
Rate Data ◽  
Mems Sensors ◽  
Micro Electro Mechanical Systems ◽  
Content Type ◽  
Position Errors ◽  
Low Performance

Purpose – This study aims to design a new low-cost localization platform for estimating the location and orientation of a pedestrian in a building. The micro-electro-mechanical systems (MEMS) sensor error compensation and the algorithm were improved to realize the localization and altitude accuracy. Design/methodology/approach – The platform hardware was designed with common low-performance and inexpensive MEMS sensors, and with a barometric altimeter employed to augment altitude measurement. The inertial navigation system (INS) – extended Kalman filter (EKF) – zero-velocity updating (ZUPT) (INS-EKF-ZUPT [IEZ])-extended methods and pedestrian dead reckoning (PDR) (IEZ + PDR) algorithm were modified and improved with altitude determined by acceleration integration height and pressure altitude. The “AND” logic with acceleration and angular rate data were presented to update the stance phases. Findings – The new platform was tested in real three-dimensional (3D) in-building scenarios, achieved with position errors below 0.5 m for 50-m-long route in corridor and below 0.1 m on stairs. The algorithm is robust enough for both the walking motion and the fast dynamic motion. Originality/value – The paper presents a new self-developed, integrated platform. The IEZ-extended methods, the modified PDR (IEZ + PDR) algorithm and “AND” logic with acceleration and angular rate data can improve the high localization and altitude accuracy. It is a great support for the increasing 3D location demand in indoor cases for universal application with ordinary sensors.

Polymer mechanics and tribology

2018 ◽  
Vol 70 (4) ◽  
pp. 764-772 ◽  
Author(s):  
Nikolai K. Myshkin ◽  
Alexander Kovalev
Keyword(s):  
Polymer Composites ◽  
Contact Mechanics ◽  
Tribological Behavior ◽  
Tribological Performance ◽  
Memory Storage ◽  
Polymer Mechanics ◽  
Micro Electro Mechanical Systems ◽  
Content Type ◽  
Storage Devices ◽  
Functional Additives

Purpose The purpose of this paper is to review the advances in mechanics and tribology of polymers and polymer-based materials. It is focused on the understanding of the correlation of contact mechanics and the tribological behavior of polymers and polymer composites by taking account of surface forces and adhesion in the contact. Design/methodology/approach Mechanical behavior of polymers is considered a viscoelasticity. Tribological performance is estimated while considering the parts of deformation and adhesion in friction arising in the contact. Surface energy, roughness, load and temperature effects on the tribological behavior of polymers are evaluated. Polymer composites produced by reinforcing and by the addition of functional additives are considered as materials for various applications in tribology. Particular attention is given to polymer-based nanocomposites. Findings A review of studies in tribology has shown that polymer-based materials can be most successfully used as self-lubricating components of sliding bearings. The use of the fillers provides changes in the tribological performance of neat polymers and widens their areas of application in the industry. Thin polymer films were found to be prospective lubricants for memory storage devices, micro-electro-mechanical systems and precision mechanisms. Further progress in polymer tribology should be achieved on solving the problems of contact mechanics, surface physics and tribochemistry by taking account of the scale factor. Originality/value The review is based on the experience of the authors in polymer mechanics and tribology, their research data and on data of many other literature sources published in this area. It can be useful for specialists in polymer research and industrial engineers working in tribology and industrial lubrication.

scholarly journals Microfluidic and Micromachined/MEMS Devices for Separation, Discrimination and Detection of Airborne Particles for Pollution Monitoring

Micromachines ◽  
2019 ◽  
Vol 10 (7) ◽  
pp. 483 ◽  
Author(s):  
Daniel Puiu Poenar
Keyword(s):  
Optical Scattering ◽  
Pollution Monitoring ◽  
Detection Methods ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Lab On Chip ◽  
Inorganic Particles ◽  
Advantages And Disadvantages ◽  
Air Quality Assessment ◽  
On Chip

Most of the microfluidics-related literature describes devices handling liquids, with only a small part dealing with gas-based applications, and a much smaller number of papers are devoted to the separation and/or detection of airborne inorganic particles. This review is dedicated to this rather less known field which has become increasingly important in the last years due to the growing attention devoted to pollution monitoring and air quality assessment. After a brief introduction summarizing the main particulate matter (PM) classes and the need for their study, the paper reviews miniaturized devices and/or systems for separation, detection and quantitative assessment of PM concentration in air with portable and easy-to-use platforms. The PM separation methods are described first, followed by the key detection methods, namely optical (scattering) and electrical. The most important miniaturized reported realizations are analyzed, with special attention given to microfluidic and micromachined or micro-electro-mechanical systems (MEMS) chip-based implementations due to their inherent capability of being integrated in lab-on-chip (LOC) type of smart microsystems with increased functionalities that can be portable and are easy to use. The operating principles and (when available) key performance parameters of such devices are presented and compared, also highlighting their advantages and disadvantages. Finally, the most relevant conclusions are discussed in the last section.

Halochromic optical nose for assessment of spoilage of packed seer fish

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Kesavan Devarayan ◽  
Kopperundevi Sivakami Nagaraju ◽  
Padmavathi Pandiyan
Keyword(s):  
Thin Film ◽  
Real Time ◽  
Design Methodology ◽  
Real Time Monitoring ◽  
Content Type ◽  
Color Changes ◽  
Thin Film Sensors ◽  
Unique Color ◽  
Indicator Dyes ◽  
Seer Fish

Purpose The present study aims to describe the development of halochromic thin film sensors using mixed indicator dyes for monitoring the spoilage of packed seer fish. Design/methodology/approach Thin film was prepared using renewable polysaccharide incorporated with mixed indicator dyes. The thin film was characterized using ultraviolet visible and Fourier transform-infrared spectroscopy. The characteristics of the thin film were studied by analyzing the CIELAB and Red Green Blue values and biodegradability. The thin films were evaluated for real-time monitoring of the spoilage of packed seer fish. Findings The thin film sensors were found to exhibit excellent halochromism. The color changes were visible and distinguishable. The sensors responded efficiently for real-time monitoring of spoilage of fish by showing unique color changes. Originality/value This study provides promising mixed indicator that exhibits different colors in the alkaline pH. Also the present study reveals a potential combination of materials for preparation of halochromic sensors that can be used for monitoring the spoilage of packed seer fish in real time.

Development of Top-Gate Nanocrystalline Si:H Thin Film Transistors

2004 ◽  
Vol 808 ◽  
Author(s):  
Jarrod McDonald ◽  
Vikram L. Dalal ◽  
Max Noack
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Breakdown Strength ◽  
Defect Density ◽  
Hydrogen Plasma ◽  
Interface State ◽  
Nitride Layer ◽  
High Ratio ◽  
X Ray Diffraction ◽  
X Ray

ABSTRACTWe report on the growth and fabrication of top gate thin film transistors at low temperatures in nanocrystalline Si:H. The nanocrystalline Si:H was deposited using a VHF-PECVD plasma process at 45 MHz in a diode reactor. The material was deposited from a mixture of silane and hydrogen at a temperature of 250-300°C. Higher temperatures resulted in a loss of hydrogen from the material. The properties of the nanocrystalline Si:H were studied using x-ray diffraction and Raman spectroscopy. The material showed a high ratio (3.8) between the crystalline and amorphous peaks in the Raman spectrum. X-ray diffraction data showed the films to be predominantly oriented in <111> direction, and the grain size estimated from Scherer's formula was in the range of 12-15 nm. The doping of the material could be changed by introducing ppm levels of Boron or Phosphorus. The as-grown material was generally n type. By adding controlled amounts of B, the material could be made p type. The devices made were n-channel MISFET's with p body. The n+ source and drain layers were made from amorphous Si:H. A systematic investigation of the appropriate oxide/nitride layer to be used was undertaken. The nitride layers were grown at 250-300°C using mixtures of silane and ammonia, with a high degree of dilution by helium. The presence of helium dilution, along with post-deposition passivation by a hydrogen plasma, was found to produce reproducible, low interface defect density nitride materials. Interface state densities were measured using capacitance spectroscopy at different frequencies and temperatures and found to be in the range of 4.5x1011/cm2-eV. The breakdown strength of the nitride was measured and found to be 4 MV/cm. Proof-of-concept TFT devices were fabricated using reactive ion etching. The threshold voltage was in the range of 13-15 V, and the on/off ratio was in the range of 103.

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