Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Gui-sheng Gan ◽  
Liujie Jiang ◽  
Shiqi Chen ◽  
Yongqiang Deng ◽  
Donghua Yang ◽  
...  
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Brittle Fracture ◽  
Copper Substrate ◽  
Joint Interface ◽  
Ambient Atmosphere ◽  
Content Type ◽  
Soldering Process ◽  
Micron Size ◽  
Ultrasonic Assisted

Purpose Low-Ag SAC solder will lead to a series of problems, such as increased the melting range and declined the solderability and so on. These research studies do not have too much impact on the improvement of solders’ performance but were difficult to achieve satisfactory results. It is urgent to develop new soldering technology to avoid the bottleneck of lead-free solder. low-temperature-stirring soldering and ultrasonic-assisted soldering was developed in the authors’ early work, but slag inclusion and pore would gather and grow up to lead decreasing of the shear strength. In this paper, Cu/SAC0307 +Zn power/Cu joints with ultrasonic-assisted at low-temperature was successfully achieved. Design/methodology/approach 45um Zn-powder and SAC0307 No.4 solder powder were mixed to fill the Cu-Cu joint, and the content of Zn-powder were 0 and 5%, 7.5% and 10%, 12.5% and 15% respectively. During the soldering process under ambient atmosphere %252C the heating platform provided a constant 220%253 F and the ultrasonic vibrator applied a constant pressure of 4 MPa to the copper substrate. The soldering process was completed after holding 70 s at 300 W. Findings The Zn particles made the IMC at the joint interface and in the soldering seam from scallop-type Cu6Sn5 to flat-type Cu5Zn8. The shear strength of joints without Zn was only 12.43 MPa, the shear strength of joints with 10% Zn reached a peak of 34.25 MPa, and the shear strength of joints containing 10% Zn was 63.71% higher than that of joints without zinc particles, and then the shear strength decreased. In addition, with the increase of zinc content, the fracture mode of the joint changed from the brittle fracture of the original layered tears to the mixed tough and brittle fracture. Originality/value A new method that Zn micron-size powders and SAC0307 micron-size powders was mixed to fill the joint, and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted without flux at low-temperature.

Solder joint quality evaluation based on heating factor

Circuit World ◽  
2018 ◽  
Vol 44 (1) ◽  
pp. 37-44 ◽  
Author(s):  
Petr Veselý ◽  
Eva Horynová ◽  
Jiří Starý ◽  
David Bušek ◽  
Karel Dušek ◽  
...  
Keyword(s):  
Shear Strength ◽  
Solder Alloy ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Strength Increase ◽  
Technological Parameters ◽  
Content Type ◽  
Soldering Process ◽  
Before And After ◽  
Joint Quality

Purpose The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

2019 ◽  
Vol 32 (2) ◽  
pp. 73-81
Author(s):  
Yun Liu ◽  
Weiyuan Yu ◽  
Xuemin Sun ◽  
Fengfeng Wang
Keyword(s):  
Shear Strength ◽  
Ultrasonic Vibration ◽  
Grain Morphology ◽  
Electronics Packaging ◽  
Dispersion Strengthening ◽  
Shear Tests ◽  
Content Type ◽  
Ultrasonic Assisted ◽  
Surface Microstructures ◽  
Soldered Joint

Purpose This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples. Design/methodology/approach The Ni/Sn/Ni joints were obtained through ultrasonic-assisted soldering. The formation of IMCs, their composition, grain morphology and the fractured-surface microstructures from shear tests were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy. Findings Without USV, a planar interfacial Ni3Sn4 layer was formed at the Ni/Sn interface, and a few Ni3Sn4 grains were distributed in the soldered joint. The morphology of these grains was needle-shaped. With USV, several grooves were formed at the interfacial Ni3Sn4 layer due to ultrasonic cavitation. Some deepened grooves led to “neck” connections at the roots of the Ni3Sn4 grains, which accelerated the strong detachment of Ni3Sn4 from the substrate. In addition, two types of Ni3Sn4 grains, needle-shaped and granular-shaped, were observed at the interface. Furthermore, the shear strength increased with longer USV time, which was attributed to the thinning of the interfacial IMC layers and dispersion strengthening from the Ni3Sn4 particles distributed evenly in the joint. Originality/value The novelty of the paper is the detailed study of the effect of USV on the morphology, size changes of interfacial IMC and joint strength. This provides guidance for the application of ultrasonic-assisted soldering in electronics packaging.

Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xu Han ◽  
Xiaoyan Li ◽  
Peng Yao ◽  
Dalong Chen
Keyword(s):  
Design Methodology ◽  
Solder Joints ◽  
Nucleation And Growth ◽  
Content Type ◽  
Reaction Stage ◽  
Interfacial Imcs ◽  
Soldering Process ◽  
Liquid Reaction ◽  
Ultrasonic Assisted ◽  
Solid Liquid

Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm. Findings Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s. Originality/value The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.

Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Yang Liu ◽  
Yuxiong Xue ◽  
Min Zhou ◽  
Rongxing Cao ◽  
Xianghua Zeng ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Low Temperature ◽  
Solder Joint ◽  
Design Methodology ◽  
Solder Joints ◽  
Fracture Morphology ◽  
Content Type ◽  
Before And After ◽  
Mechanical Performances

Purpose The purpose of this paper is to investigate the effects of Sn-Ag-x leveling layers on the mechanical properties of SnBi solder joints. Four Sn-Ag-x (Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.5 Bi-0.05Ni and Sn-3.0Ag-3.0 Bi-3.0In) leveling layers were coated on Cu pads to prepare SnBi/Sn-Ag-x/Cu solder joints. The microstructure, hardness, shear strength and fracture morphology of solder joints before and after aging were studied. Design/methodology/approach The interfacial brittleness of the SnBi low-temperature solder joint is a key problem affecting its reliability. The purpose of this study is to improve the mechanical properties of the SnBi solder joint. Findings Owing to the addition of the leveling layers, the grain size of the ß-Sn phase in the SnBi/Sn-Ag-x/Cu solder joint is significantly larger than that in the SnBi/Cu eutectic solder joint. Meanwhile, the hardness of the solder bulk in the SnBi/Cu solder joint shows a decrease trend because of the addition of the leveling layers. The SnBi/Cu solder joint shows obvious strength drop and interfacial brittle fracture after aging. Through the addition of the Sn-Ag-x layers, the brittle failure caused by aging is effectively suppressed. In addition, the Sn-Ag-x leveling layers improve the shear strength of the SnBi/Cu solder joint after aging. Among them, the SnBi/SACBN/Cu solder joint shows the highest shear strength. Originality/value This work suppresses the interfacial brittleness of the SnBi/Cu solder joint after isothermal aging by adding Sn-Ag-x leveling layers on the Cu pads. It provides a way to improve the mechanical performances of the SnBi solder joint.

Mechanical reliability of self-aligned chip assembly after reflow soldering process

2020 ◽  
Vol 33 (1) ◽  
pp. 9-17
Author(s):  
Mohd Najib Ali Mokhtar ◽  
M.Z. Abdullah ◽  
Abdullah Aziz Saad ◽  
Fakhrozi Cheani
Keyword(s):  
Shear Strength ◽  
Statistical Analysis ◽  
Solder Joint ◽  
Silver Content ◽  
The Self ◽  
Mechanical Reliability ◽  
Reflow Soldering ◽  
Content Type ◽  
Strength Assessment ◽  
Soldering Process

Purpose This paper focuses on the reliability of the solder joint after the self-alignment phenomenon during reflow soldering. The aim of this study is to analyse the joint quality of the self-alignment assemblies of SnAg alloy solder joints with varying silver content. Design/methodology/approach The shear strength assessment was conducted in accordance with the JIS Z3 198-7 standard. The standard visual inspection of IPC-A-610G was also performed to inspect the self-alignment features of the solder joint samples. Statistical analysis was conducted to determine the probabilistic relationship of shear strength of the misalignment components. Findings The results from the mechanical reliability study indicate that there were decreasing trends in the shear strength value as misalignment offset increased. For shift mode configuration in the range of 0-300 µm, the resulting chip assembly inspection after the reflow process was in line with the IPC-A-610G standard. The statistical analysis shows that the solder type variation was insignificant to the shear strength of the chip resistor. The study concluded that the fracture occurred partially in the termination metallization at the lower part of the chip resistor. The copper content of the joint on that area shows that the crack occurred in the solder joint, and high silver content on the selected zone indicated that the fracture happened partially in the termination structure, as the termination structure of the lead-free chip resistor consists of an inner layer of silver and an outer layer of tin. Practical implications This study’s findings provide valuable guidelines and references to engineers and integrated circuit designers during the reflow soldering process in the microelectronics industry. Originality/value Studies on the effect of component misalignment on joint mechanical reliability are still limited, and studies on solder joint reliability involving the effect of differing contents of silver on varying chip component offset are rarely reported. Thus, this study is important to effectively bridge the research gap and yield appropriate guidelines in the potential industry.

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

2017 ◽  
Vol 29 (3) ◽  
pp. 121-132 ◽  
Author(s):  
Roman Kolenak
Keyword(s):  
Shear Strength ◽  
Bond Formation ◽  
Copper Substrate ◽  
Metallic Materials ◽  
Ultrasonic Activation ◽  
Content Type ◽  
Lower Shear ◽  
Sic Ceramics ◽  
Cu Substrates ◽  
Ultrasonic Soldering

Purpose This paper aims to investigate the effect of solder alloying with a small amount of La and Y on bond formation with the Si and Cu substrates. Design/methodology/approach Bi2La and Bi2Y solders were studied. Soldering was performed using a fluxless method in air and with ultrasonic activation. Findings It was found that in the process of ultrasonic soldering, the La and Y were distributed at the interface with Si and Cu substrates, which enhanced the bond formation. Addition of La or Y elements in a Bi-based solder also ensured wetting of non-metallic materials such as Si, Al2O3 and SiC ceramics. Originality/value The addition of lanthanides offers a method for ensuring wetting of non-metallic materials. The bond with Si was of an adhesive character without the formation of a new contact interlayer. This resulted in lower shear strength of the bond with Si (8-10 MPa). The shear strength of the bond with a Cu substrate was 22-30 MPa.

AMPCOLOY 495

Alloy Digest ◽  
1966 ◽  
Vol 15 (11) ◽  
Keyword(s):  
Fracture Toughness ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
Low Temperature ◽  
Physical Properties ◽  
High Strength ◽  
Heat Treating ◽  
Aluminum Bronze ◽  
High Manganese ◽  
Temperature Performance

Abstract AMPCOLOY 495 is a high manganese type of aluminum bronze recommended where high strength and corrosion resistance are required along with good weldability. It is recommended for marine equipment and ship propellers. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive and shear strength as well as fracture toughness, creep, and fatigue. It also includes information on low temperature performance and corrosion resistance as well as casting, forming, heat treating, machining, and joining. Filing Code: Cu-171. Producer or source: Ampco Metal Inc..

AWHF STEEL

Alloy Digest ◽  
1972 ◽  
Vol 21 (6) ◽  
Keyword(s):  
Fracture Toughness ◽  
Corrosion Resistance ◽  
Shear Strength ◽  
Low Temperature ◽  
Physical Properties ◽  
Heat Treating ◽  
Steel Company ◽  
Cold Forming ◽  
Temperature Performance ◽  
Minimum Yield

Abstract AWHF STEEL is a high-formability steel produced regularly at minimum yield strengths of 45,000 and 50,000 psi and for special applications at 55,000 and 60,000 psi. It is recommended for difficult cold-forming applications that involve bending or drawing and it has good weldability. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and compressive and shear strength as well as fracture toughness and fatigue. It also includes information on low temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: SA-275. Producer or source: Alan Wood Steel Company.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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