A computational fluid dynamics analysis of the wave soldering process

2015 ◽  
Vol 25 (5) ◽  
pp. 1231-1247 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor ◽  
M. Mazlan ◽  
A.M. Iqbal ◽  
...  
Keyword(s):  
Flow Behavior ◽  
Three Dimensional ◽  
Flow Profile ◽  
Content Type ◽  
Fountain Flow ◽  
Soldering Process ◽  
Wave Soldering ◽  
Computational Fluid Dynamics Analysis ◽  
Filling Time ◽  
Propeller Blades

Purpose – The purpose of this paper is to present a three-dimensional finite volume-based analysis on the effects of propeller blades on fountain flow in a wave soldering process and performs an experimental validation. Design/methodology/approach – Solder pot models with various numbers of propeller blades were developed and meshed by using hybrid elements and simulated by using the FLUENT fluid flow solver. The characteristics of the fountain, such as flow profile, velocity vector, filling time, and fountain advancement, were investigated. Molten solder (Sn63Pb37) material, a temperature of 250°C, and a propeller speed of 830 rpm were applied in the simulation. The predicted results were validated by the experimental fountain profile. Findings – The use of a six-blade propeller in a solder pot increased the fountain thickness profile and reduced the filling time. Moreover, a six-blade propeller design resulted in a stable fountain profile and was considered the best choice for current wave soldering processes. Practical implications – This study provides a better understanding of the effects of propeller blades on the fountain flow in the wave soldering process. Originality/value – The study explores the fountain flow behavior and provides a reference to the engineers and designers in order to improve the fountain flow of the wave soldering.

Experimental measurements of the shear force on surface mount components simulating the wave soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deep Understanding ◽  
Critical Issue ◽  
Circuit Boards ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Wave Soldering ◽  
Pull Out ◽  
Minimum Force

Purpose This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

scholarly journals COMPUTATIONAL MODELING OF RTM AND LRTM PROCESSES APPLIED TO COMPLEX GEOMETRIES

2012 ◽  
Vol 11 (1-2) ◽  
pp. 93 ◽  
Author(s):  
J. Da S. Porto ◽  
M. Letzow ◽  
E. D. Dos Santos ◽  
S. C. Amico ◽  
J. A. Souza ◽  
...  
Keyword(s):  
Porous Medium ◽  
Flow Behavior ◽  
Resin Transfer Molding ◽  
Three Dimensional ◽  
Complex Geometries ◽  
Resin Flow ◽  
Transfer Molding ◽  
Rtm Process ◽  
General Terms ◽  
Filling Time

Light Resin Transfer Molding (LRTM) is a variation of the conventional manufacturing process known as Resin Transfer Molding (RTM). In general terms, these manufacturing processes consist of a closed mould with a preplaced fibrous preform through which a polymeric resin is injected, filling the mold completely, producing parts with complex geometries (in general) and good finish. Those processes differ, among other aspects, in the way that injection occurs. In the RTM process the resin is injected through discrete points whereas in LRTM it is injected into an empty channel (with no porous medium) which surrounds the entire mold perimeter. There are several numerical studies involving the RTM process but LRTM has not been explored enough by the scientific community. Based on that, this work proposes a numerical model developed in the FLUENT package to study the resin flow behavior in the LRTM process. Darcy’s law and Volume of Fluid method (VOF) are used to treat the interaction between air and resin during the flow in the porous medium, i.e. the mold filling problem. Moreover, two three-dimensional geometries were numerically simulated considering the RTM and LRTM processes. It was possible to note the huge differences about resin flow behavior and filling time between these processes to manufacture the same parts.

Thermal decomposition of solder flux activators under simulated wave soldering conditions

2017 ◽  
Vol 29 (3) ◽  
pp. 133-143 ◽  
Author(s):  
Kamila Piotrowska ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Thermal Treatment ◽  
Heat Exposure ◽  
Copper Surface ◽  
Substrate Material ◽  
Content Type ◽  
Soldering Process ◽  
Wave Soldering ◽  
Solder Flux ◽  
Solder Mask ◽  
The Impact

Purpose The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base titration method as a function of temperature, time of exposure and the substrate material used. Findings The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic-based solutions at highest test temperatures than for adipic acid. Less left residue was found on the laminate surface with solder mask (∼5-20 per cent of initial amount at 350°C) and poorest acid evaporation was noted for glass substrates (∼15-90 per cent). Practical implications The findings are attributed to the chemistry of WOAs typically used as solder flux activators. The results show the importance WOA type in relation to its melting/boiling points and the impact on the residual amount of contamination left after soldering process. Originality/value The results show that the evaporation of the flux residues takes place only at significantly high temperatures and longer exposure times are needed compared to the temperature range used for the wave soldering process. The extended time of thermal treatment and careful choice of fluxing technology would ensure obtaining more climatically reliable product.

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

2015 ◽  
Vol 27 (1) ◽  
pp. 31-44 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
Molten Solder ◽  
Circuit Boards ◽  
Fluid Structure ◽  
Content Type ◽  
Thermally Induced ◽  
C Language ◽  
Soldering Process ◽  
Wave Soldering

Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach – The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings – Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications – This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value – This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

2020 ◽  
Vol 32 (3) ◽  
pp. 147-156
Author(s):  
Muhammad Naqib Nashrudin ◽  
Zhong Li Gan ◽  
Aizat Abas ◽  
M.H.H. Ishak ◽  
M. Yusuf Tura Ali
Keyword(s):  
Solder Joint ◽  
Numerical Method ◽  
Flip Chip ◽  
Solder Joints ◽  
Experimental Studies ◽  
Three Dimensional ◽  
Cross Sectional ◽  
Content Type ◽  
Filling Time ◽  
Encapsulation Process

Purpose In line with the recent development of flip-chip reliability and underfill process, this paper aims to comprehensively investigate the effect of different hourglass shape solder joint on underfill encapsulation process by mean of experimental and numerical method. Design/methodology/approach Lattice Boltzmann method (LBM) numerical was used for the three-dimensional simulation of underfill process. The effects of ball grid arrays (BGA) encapsulation process in terms of filling time of the fluid were investigated. Experiments were then carried out to validate the simulation results. Findings Hourglass shape solder joint has shown the shortest filling time for underfill process compared to truncated sphere. The underfill flow obtained from both simulation and experimental results are found to be in good agreement for the BGA model studied. The findings have also shown that the filling time of Hourglass 2 with parabolic shape gives faster filling time compared to the Hourglass 1 with hemisphere angle due to bigger cross-sectional area of void between the solder joints. Practical implications This paper provides reliable insights to the effect of hourglass shape BGA on the encapsulation process that will benefit future development of BGA packages. Originality/value LBM numerical method was implemented in this research to study the flow behaviour of an encapsulation process in term of filling time of hourglass shape BGA. To date, no research has been found to simulate the hourglass shape BGA using LBM.

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

2019 ◽  
Vol 32 (2) ◽  
pp. 93-103
Author(s):  
Kamila Piotrowska ◽  
Feng Li ◽  
Rajan Ambat
Keyword(s):  
Binary Mixture ◽  
Binary Mixtures ◽  
Proper Time ◽  
Scanning Calorimetry ◽  
Binary Blends ◽  
Content Type ◽  
Soldering Process ◽  
Wave Soldering ◽  
Decomposition Behavior ◽  
The Impact

Purpose The purpose of this paper is to investigate the decomposition behavior of binary mixtures of organic activators commonly used in the no-clean wave flux systems upon their exposure to thermal treatments simulating wave soldering temperatures. The binary blends of activators were studied at varying ratios between the components. Design/methodology/approach Differential scanning calorimetry and thermogravimetric analysis were used to study the characteristics of weak organic acid (WOA) mixtures degradation as a function of temperature. The amount of residue left on the surface after the heat treatments was estimated by gravimetric measurements as a function of binary mixture type, temperature and exposure time. Ion chromatography analysis was used for understanding the relative difference between decomposition of activators in binary blends. The aggressivity of the left residue was assessed using the acidity indication gel test, and effect on reliability was investigated by DC leakage current measurement performed under varying humidity and potential bias conditions. Findings The results show that the typical range of temperatures experienced by electronics during the wave soldering process is not sufficient for the removal of significant activator amounts. If the residues contain binary mixture of WOAs, the final ratio between the components, the residue level and the corrosive effects depend on the relative decomposition behavior of individual components. Among the WOA investigated under the conventional wave soldering temperature, the evaporation and removal of succinic acid is more dominant compared to adipic and glutaric acids. Practical implications The findings are attributed to the chemistry of WOAs typically used as flux activators for wave soldering purposes. The results show the importance of controlling the WOA content and ratio between activating components in a flux formulation in relation to its tendencies for evaporation during soldering and the impact of its residues on electronics reliability. Originality/value The results show that the significant levels of flux residues can only be removed at significantly higher temperatures and longer exposure times compared to the conventional temperature range used for the wave soldering process. The potential corrosion issues related to insufficient flux residues removal will be determined by the residue amount, its composition and ratio between organic components. The proper time of thermal treatment and careful choice of fluxing formulation could ensure more climatically reliable product.

Simulation for Composite Forming Infusion from both inside and outside at same Time

2013 ◽  
Vol 329 ◽  
pp. 153-156
Author(s):  
Wei Xiao Du ◽  
Zhong De Shan ◽  
Feng Liu
Keyword(s):  
Fiber Volume Fraction ◽  
Volume Fraction ◽  
Flow Behavior ◽  
Three Dimensional ◽  
Fiber Volume ◽  
New Approach ◽  
High Fiber ◽  
Composite Forming ◽  
Filling Time ◽  
Infusion Method

Impregnation quality is vital to the whole composite. To improve it a new approach-infusion from both inside and outside at same time is supposed. Some comparison simulation studies, based on PAM-RTM software, are performed in this paper about the new composite forming method and traditional infusion method including flow behavior and filling time. Filling time via the two methods are compared, and the following results are obtained-It takes less time to fill the mold with infusion from both inside and outside at same time than traditional one; higher fiber volume fraction is, more favorable the new forming method is. The new infusion method is proved to be an effective and novel forming method about parts with high-thickness or high fiber content in composite forming area. The results will contribute to researches on the whole composite forming and bring prospect to provide more usages of three dimensional composites in high rank field.

Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad Hafifi Hafiz Ishak ◽  
Mohd Sharizal Abdul Aziz ◽  
Farzad Ismail ◽  
M.Z. Abdullah
Keyword(s):  
Flip Chip ◽  
Fluid Dynamic ◽  
Reflow Process ◽  
Reflow Soldering ◽  
Content Type ◽  
Soldering Process ◽  
Cu Pillar ◽  
Computational Fluid Dynamics Analysis ◽  
Flip Chip Packaging ◽  
The Impact

Purpose The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering. Design/methodology/approach In this work, solidification/melting modelling and volume of fluid modelling were used. Reflow soldering process of Cu pillar type FC was modelled using computational fluid dynamic software (FLUENT). The experimental results have been validated with the simulation results to prove the accuracy of the numerical method. Findings The findings of this study reveal that solder volume is the most important element influencing reflow soldering. The solder cap volume reduces as the Cu pillar bump diameter lowers, making the reflow process more difficult to establish a good solder union, as less solder is allowed to flow. Last but not least, the solder cap height for the reflow process must be optimized to enable proper solder joint formation. Practical implications This study provides a basis and insights into the impact of copper pillar bump structure on flip chip packaging during reflow soldering that will be advancing the future design of 3D stack package. This study also provides a superior visualization and knowledge of the melting and solidification phenomenon during the reflow soldering process. Originality/value The computational fluid dynamics analysis of copper pillar bump structure on flip chip packaging during reflow soldering is scant. To the authors’ best knowledge, no research has been concentrated on copper pillar bump size configurations in a thorough manner. Without the in-depth study, copper pillar bump size might have the impact of copper pillar bump structure on flip chip packaging during reflow soldering. Five design of parameter of flip chip IC package model was proposed for the investigation of copper pillar bump structure on flip chip packaging during reflow soldering.

Contamination profile on typical printed circuit board assemblies vs soldering process

2014 ◽  
Vol 26 (4) ◽  
pp. 194-202 ◽  
Author(s):  
Helene Conseil ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Content Type ◽  
Contamination Control ◽  
Conformal Coating ◽  
Printed Circuit ◽  
Soldering Process ◽  
Wave Soldering ◽  
Solder Flux ◽  
Set Up

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels. Originality/value – Although it is generally known that different soldering processes can introduce contamination on the PCBA surface, compromising its cleanliness, no systematic work is reported investigating the relative levels of residue introduced by various soldering processes and its effect on corrosion reliability.

scholarly journals Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering

2014 ◽  
Vol 6 ◽  
pp. 275735 ◽  
Author(s):  
M. S. Abdul Aziz ◽  
M. Z. Abdullah ◽  
C. Y. Khor ◽  
Z. M. Fairuz ◽  
A. M. Iqbal ◽  
...  
Keyword(s):  
Capillary Flow ◽  
Flow Behavior ◽  
Fluid Structure Interaction ◽  
Molten Solder ◽  
Circuit Board ◽  
Fluid Structure ◽  
Structure Interaction ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 < d/ D < 0.97) were studied through a simulation modeling. The use of ratio d/ D = 0.2 yielded a balanced filling profile and low thermal stress. Results revealed that filling level, temperature, and displacement exhibited polynomial behavior to d/ D. Stress of pin varied quadratically with the d/ D. The predicted molten solder profile was validated by experimental results. The simulation results are expected to provide better visualization and understanding of the wave soldering process by considering the aspects of thermal FSI.

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