Fiber management on a printed circuit board: Ensuring long-term reliability

2013 ◽  
Author(s):  
Jocelyn Lauzon ◽  
Edith Talbot ◽  
Nicolas Belanger ◽  
Lorrain Leduc
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Ultra-compact capacitively loaded evanescent half-mode SIW filters for LTE applications

2014 ◽  
Vol 6 (5) ◽  
pp. 487-490 ◽  
Author(s):  
Tinus Stander ◽  
Saurabh Sinha
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Center Frequency ◽  
Fractional Bandwidth ◽  
Third Order ◽  
Printed Circuit ◽  
Term Evolution ◽  
Waveguide Filter ◽  
Capacitive Loading

This paper presents a novel miniaturized substrate integrated waveguide filter by combining both half-mode resonators and capacitive loading on a conventional two-layer printed circuit board (PCB) process. The resulting synthesis is successfully demonstrated in an long-term evolution application by means of a third-order filter of <225 mm2in size while featuring 2.3 dB insertion loss over a 5.5% fractional bandwidth at 3.7 GHz. Good first-iteration agreement between simulated and measured results, both in center frequency and bandwidth, are achieved.

scholarly journals Evaluation of printed-circuit boards materials for high temperature operation

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000057-000062
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

ABSTRACT This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190 °C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling.

scholarly journals ARREGLO DE ANTENAS CON BAJO ACOPLAMIENTO MUTUO PARA SISTEMAS DE COMUNICACIONES INALÁMBRICAS MIMO-LTE

2017 ◽  
Vol 1 (27) ◽  
Author(s):  
Eduardo Rodríguez Araque ◽  
Roberto G. Rojas-Teran
Keyword(s):  
Printed Circuit Board ◽  
Multiple Input Multiple Output ◽  
Long Term Evolution ◽  
Circuit Board ◽  
Printed Circuit ◽  
Term Evolution ◽  
Multiple Input ◽  
Input Multiple Output

Este trabajo trata de un arreglo de antenas MIMO (multiple-input-multiple-output) que opera en la banda de 2.6 GHz, una banda de Long Term Evolution (LTE), para sistemas de comunicaciones móviles inalámbricas 4G. El arreglo de antenas consiste de 4 antenas compactas tipo patch sobre un substrato dieléctrico (PCB) de 125 mm x 62.5 mm x 1.27 mm. Modificaciones del plano de tierra (GND) junto con la ubicación sistemática y orientación de cada antena en la cara posterior al plano de tierra del PCB (Printed Circuit Board) juegan un rol muy importante en la reducción sustancial del acoplamiento mutuo, esto generalmente afecta el desempeño de los arreglos MIMO.Palabras clave: Arreglo de antenas, modos característicos, correlación espacial, multiple-input-multiple-output (MIMO), acoplamiento mutuo.

scholarly journals Evaluation of Printed-Circuit Board Materials for High-Temperature Operation

2017 ◽  
Vol 14 (4) ◽  
pp. 166-171
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Board ◽  
Epoxy Composite ◽  
Circuit Board ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

This article presents the long-term (1,000 h) behavior of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190°C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials when stored in nitrogen. On the contrary, the board stored in air shows the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 w, because of large swelling.

Long-term stability of resistors embedded in printed circuit board

2011 ◽  
Author(s):  
Damian Nowak ◽  
Pawel Winiarski ◽  
Adam Klossowicz ◽  
Andrzej Dziedzic ◽  
Wojciech Steplewski ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Term Stability ◽  
Long Term Stability

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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