Radial and Axial Inlet and Outlet Design for End Winding Cooling of High-Speed Integrated Flux-Switching Motor-Compressor

2021 ◽  
Author(s):  
Leyue Zhang ◽  
Hao Ding ◽  
Ahmed Hembel ◽  
Gregory Nellis ◽  
Bulent Sarlioglu
Keyword(s):  
High Speed ◽  
Flux Switching Motor

Design Studies and Analysis of Single Phase 8S-12P Field Excitation Flux Switching Motor

2014 ◽  
Vol 695 ◽  
pp. 601-604
Author(s):  
Zhafir Aizat Husin ◽  
Erwan Sulaiman ◽  
Faisal Khan ◽  
Mohamed Mubin Aizat Mazlan ◽  
Mohd Fairoz Omar
Keyword(s):  
High Speed ◽  
Single Phase ◽  
Induced Voltage ◽  
Flux Linkage ◽  
Element Analysis ◽  
Design Studies ◽  
Cogging Torque ◽  
Power Characteristics ◽  
Field Excitation ◽  
Flux Switching Motor

This paper presents a new structure of field excitation flux switching motor (FEFSM) as an alternative candidate of non-permanent magnet (PM) machine. The rotor is consisted of only stack of iron and hence, it is reliable and appropriate for high speed operation. Initially, the coil arrangement tests are examined to validate the operating principle of the motor and to identify the zero rotor position. Furthermore, the profile of flux linkage, induced voltage, cogging torque, torque and power characteristics are observed based on 2D finite element analysis (FEA). Initial performances show that 8S-12P FEFSM produce torque and power of 8.79Nm and 1.5kW, respectively with low cogging torque and sinusoidal flux waveform. Further design refinement and optimization will be conducted to improve the performances of the motor.

scholarly journals Cogging Torque Reduction Technique on E-Core Hybrid Flux Switching Motor by Notching and Pole Pairing

2018 ◽  
Vol 9 (2) ◽  
pp. 839
Author(s):  
Jaudah Abd Rani ◽  
Erwan Sulaiman ◽  
Md Zarafi Ahmad ◽  
Mohd Fairoz Omar ◽  
Chockalingam Aravind Vaithilingam
Keyword(s):  
High Speed ◽  
High Performance ◽  
Reduction Technique ◽  
Optimized Design ◽  
Element Analysis ◽  
Cogging Torque ◽  
The Past ◽  
Reduction Techniques ◽  
Geometrical Difference ◽  
Flux Switching Motor

<span>In the past, 4S-10P E-Core Hybrid Flux Switching Motor (HFSM) had been studied. However, the motor suffers high cogging torque but it has high performance in terms of high power and high torque at high speed. Therefore, this paper is proposing the cogging torque reduction techniques to minimize the cogging torque. The high cogging torque gave an undesirable effect during low operating speed of the motor. In order to tackle the issue, the cogging torque mechanism in equation is laid out as a form of reference. Then the reduction techniques employed on the designs and analyzed with Finite Element analysis (FEA) in JMAG. The results show the cogging torque of the optimized design is 44.45% of the motor torque. Besides, the techniques employed to identify which techniques gave the most cogging torque reduction and analyzed the geometrical difference using the cogging torque mechanism. Finally, the analysis is discussed based on the modified geometrics.</span>

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

An atomic-resolution microscope study of Al contracts on GaAs

1986 ◽  
Vol 44 ◽  
pp. 726-727
Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
High Speed ◽  
Schottky Contacts ◽  
Detailed Knowledge ◽  
The Past ◽  
Semiconductor Interfaces ◽  
Deposited Metal ◽  
Microwave Applications ◽  
Free Interfaces ◽  
Potential Use

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions

Scanning x-ray fluorescence microscopy and principal component analysis

1992 ◽  
Vol 50 (2) ◽  
pp. 1752-1753
Author(s):  
Brian Cross
Keyword(s):  
Principal Component Analysis ◽  
Fluorescence Microscopy ◽  
Spatial Resolution ◽  
High Speed ◽  
Image Acquisition ◽  
Principal Component ◽  
Fluorescence Microscope ◽  
Acquisition Rate ◽  
X Ray ◽  
Speed Up

A relatively new entry, in the field of microscopy, is the Scanning X-Ray Fluorescence Microscope (SXRFM). Using this type of instrument (e.g. Kevex Omicron X-ray Microprobe), one can obtain multiple elemental x-ray images, from the analysis of materials which show heterogeneity. The SXRFM obtains images by collimating an x-ray beam (e.g. 100 μm diameter), and then scanning the sample with a high-speed x-y stage. To speed up the image acquisition, data is acquired "on-the-fly" by slew-scanning the stage along the x-axis, like a TV or SEM scan. To reduce the overhead from "fly-back," the images can be acquired by bi-directional scanning of the x-axis. This results in very little overhead with the re-positioning of the sample stage. The image acquisition rate is dominated by the x-ray acquisition rate. Therefore, the total x-ray image acquisition rate, using the SXRFM, is very comparable to an SEM. Although the x-ray spatial resolution of the SXRFM is worse than an SEM (say 100 vs. 2 μm), there are several other advantages.

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