Design of a 32nm independent gate FinFET based SRAM cell with improved noise margin for low power application

Author(s):  
Mirwaiz Rahaman ◽  
Rajat Mahapatra
2019 ◽  
Vol 8 (2) ◽  
pp. 2434-2438

In ultra-Low power application the supply volt- age in the circuit is as minimum as possible to correct perform the operation. Reducing the supply voltage below the threshold Voltage of transistor is known as sub threshold voltage that affects the delay as well as stability parameter of the Circuit. In this paper body biased technique is applied at standard 6T SRAM which improve the static Current Noise Margin(SINM) and Write trip Current by the factor of 4.15 times and 4.7 times respectively from the Conventional (conv) 6T SRAM. SINM defined the read stability whereas WTI are write ability Parameters of the circuit. In the Sub threshold region delay parameter of the circuit increased, but in this paper delay and power of the proposed circuit are going to be degrades 2.34 times and 4.39 times from the conv. 6T SRAM at different Process Corner i.e. the Performance of the device get increased. In this paper conventional (Conv.)6T and Proposed(PP) 6T both have same W/L ratio at supply voltage of 400mv


In the digital world, Static Random Access Memory (SRAM) is one of the efficient core component for electronics design, it consumes huge amount of power and die area. In this research, the SRAM design analysis in terms of read margin, write margin and Static Noise Margin (SNM) for low power application is considered. In SRAM memory, both read and write operation affect by noise margin. So, read and write noise margins are considered as the significant challenges in designing SRAM cell. In this research, robust 6T-SRAM cell is designed to decrease the power utilization. The Auto Awake Mode is developed to control the entire 6T-SRAM cell design. The proposed 6T-SRAM- Auto Awake Mode (6T-SRAM-AAM) was implemented to reduce power utilization of understand and write down operation inside the 20 nm FinFET library. The experimental results showed the proposed 6T-SRAM-AAM design reduced power consumption of read & write operation up to 25% to 33.33% compared to existing Static RAM cells design


2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).


2021 ◽  
Vol 7 ◽  
pp. 22-34
Author(s):  
Vinod Kumar ◽  
Ram Murti Rawat

A paper that examines the factors thataffect the Static Noise Margin (SNM) of a StaticRandom Access memories. At an equivalent time,they specialise in optimizing Read and Writeoperation of 8T SRAM cell which is best than 6TSRAM cell Using Swing Restoration Dual NodeVoltage. The read and Write operation and improveStability analysis. This SRAM technique on thecircuit or architecture level is required to improveread and write operation. during this paperComparative Analysis of 6T and 8T SRAM Cellswith Improved Read and Write Margin is completedfor 180 nm Technology with Cadence Virtuososchematics Tool.This Paper is organized as follows: thecharacteristics of 6T SRAM cell are described arerepresented in section VIII. In section IX, proposed8T SRAM cell is described. In section X, Standard8T SRAM cell is described. Section XI includes thesimulation results which give comparison of variousparameters of 6T and 8T SRAM cells. In Section XIISimulation Results and DC analysis and sectionXIII conclusion the work.


Circuit World ◽  
2019 ◽  
Vol 45 (4) ◽  
pp. 196-207
Author(s):  
Shilpi Birla

Purpose Major area of a die is consumed in memory components. Almost 60-70% of chip area is being consumed by “Memory Circuits”. The dominant memory in this market is SRAM, even though the SRAM size is larger than embedded DRAM, as SRAM does not have yield issues and the cost is not high as compared to DRAM. At the same time, the other attractive feature for the SRAM is speed, and it can be used for low power applications. CMOS SRAM is the crucial component in microprocessor chips and applications, and as the said major portion of the area is dedicated to SRAM arrays, CMOS SRAM is considered to be the stack holders in the memory market. Because of the scaling feature of CMOS, SRAM had its hold in the market over the past few decades. In recent years, the limitations of the CMOS scaling have raised so many issues like short channel effects, threshold voltage variations. The increased thrust for alternative devices leads to FinFET. FinFET is emerging as one of the suitable alternatives for CMOS and in the region of memory circuits. Design/methodology/approach In this paper, a new 11 T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6 T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power. Findings The cell shows improvement in RSNM (read static noise margin) with LP8T by 2.39× at sub-threshold voltage 2.68× with D6T SRAM cell, 5.5× with TG8T. The WSNM (write static noise margin) and HM (hold margin) of the SRAM cell at 0.9 V is 306 mV and 384  mV. It shows improvement at sub-threshold operation also. The leakage power is reduced by 0.125× with LP8T, 0.022× with D6T SRAM cell, TG8T and SE8T. The impact of process variation on cell stability is also discussed. Research limitations/implications The FinFet has been used in place of CMOS even though the FinFet has been not been a matured technology; therefore, pdk files have been used. Practical implications SRAM cell has been designed which has good stability and reduced leakage by which we can make an array and which can be used as SRAM array. Social implications The cell can be used for SRAM memory for low power consumptions. Originality/value The work has been done by implementing various leakage techniques to design a stable and improved SRAM cell. The advantage of this work is that the cell has been working for low voltage without degrading the stability factor.


Author(s):  
M. Elangovan

The design of low power memory cells is the dream of engineers in memory design. A Darlington-based 8T CNTFET SRAM cell is suggested in this paper. It is called the proposed P_CNTFET Darlington 8T SRAM Cell. Compared with that of the traditional 6T and 8T CNTFET SRAM cells, the power and noise performances of the proposed SRAM cell are comparable. Compared to the traditional SRAM cells, the write, hold, read and dynamic power consumption of the proposed cell is much lower. The CNTFET parameters are optimized to boost the noise margin performance of the suggested bit cell. For optimized parameters, the power consumption and SNM of the proposed cell are compared with conventional cells. In contrast to the conventional cells, the HSNM and WSNM of the proposed cell are improved by 6.25% and 66.6%. The proposed cell’s RSNM is 38% greater than the traditional 6T SRAM cell. The proposed cell’s RSNM is 3.33% less than the traditional 8T SRAM cell. MOSFET is also used to implement the proposed SRAM cell and its noise margin and power performance are compared with traditional MOSFET-based SRAM cells. As with the conventional cells, the MOSFET-based implementation of the proposed cell power and SNM performance is also very good. The simulation is done with the HSPICE simulation tool using the Stanford University 32[Formula: see text]nm CNTFET model.


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