scholarly journals Assessment of the Immunity of Unshielded Multi-Core Integrated Circuits to Near-Field Injection

2009 ◽  
Author(s):  
Ali Alaeldine ◽  
Thomas Ordas ◽  
Richard Perdriau ◽  
Philippe Maurine ◽  
Mohamed Ramdani ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Near Field

scholarly journals A Survey of NFC Sensors Based on Energy Harvesting for IoT Applications

Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 3746 ◽  
Author(s):  
Antonio Lazaro ◽  
Ramon Villarino ◽  
David Girbau
Keyword(s):  
Energy Harvesting ◽  
Integrated Circuits ◽  
Radio Frequency Identification ◽  
Low Cost ◽  
Near Field ◽  
Wearable Sensors ◽  
Cold Chain ◽  
Iot Applications ◽  
Wide Range ◽  
Frequency Identification

In this article, an overview of recent advances in the field of battery-less near-field communication (NFC) sensors is provided, along with a brief comparison of other short-range radio-frequency identification (RFID) technologies. After reviewing power transfer using NFC, recommendations are made for the practical design of NFC-based tags and NFC readers. A list of commercial NFC integrated circuits with energy-harvesting capabilities is also provided. Finally, a survey of the state of the art in NFC-based sensors is presented, which demonstrates that a wide range of sensors (both chemical and physical) can be used with this technology. Particular interest arose in wearable sensors and cold-chain traceability applications. The availability of low-cost devices and the incorporation of NFC readers into most current mobile phones make NFC technology key to the development of green Internet of Things (IoT) applications.

Notice of Retraction: Near Field Shielding Performances of Absorbing Materials for Integrated Circuits (IC) Applications Part I: Lateral Excitation

2018 ◽  
Vol 60 (1) ◽  
pp. 188-195 ◽  
Author(s):  
Stefano Piersanti ◽  
Antonio Orlandi ◽  
Francesco de Paulis ◽  
Sam Connor ◽  
Mohammad Ali Khorrami ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Near Field ◽  
Absorbing Materials ◽  
Lateral Excitation

High-resolution Terahertz near-field reflection measurements for complementary non-destructive inspection of integrated circuits

2021 ◽  
Author(s):  
Alexander Michalski ◽  
Simon Sawallich ◽  
John True ◽  
Navid Asadizanjani ◽  
Michael Nagel
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Near Field ◽  
Non Destructive

scholarly journals Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

2020 ◽  
Vol 10 (3) ◽  
pp. 748
Author(s):  
Dipesh Kapoor ◽  
Cher Ming Tan ◽  
Vivek Sangwan
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Electromagnetic Interference ◽  
High Speed ◽  
High Performance ◽  
Near Field ◽  
Three Dimensional ◽  
3D Ic ◽  
Three Dimensional Integrated Circuit ◽  
The Impact

Advancements in the functionalities and operating frequencies of integrated circuits (IC) have led to the necessity of measuring their electromagnetic Interference (EMI). Three-dimensional integrated circuit (3D-IC) represents the current advancements for multi-functionalities, high speed, high performance, and low-power IC technology. While the thermal challenges of 3D-IC have been studied extensively, the influence of EMI among the stacked dies has not been investigated. With the decreasing spacing between the stacked dies, this EMI can become more severe. This work demonstrates the potential of EMI within a 3D-IC numerically, and determines the minimum distance between stack dies to reduce the impact of EMI from one another before they are fabricated. The limitations of using near field measurement for the EMI study in stacked dies 3D-IC are also illustrated.

Characterisation of electromagnetic susceptibility of integrated circuits using near-field scan

2007 ◽  
Vol 43 (1) ◽  
pp. 15 ◽  
Author(s):  
A. Boyer ◽  
S. Bendhia ◽  
E. Sicard
Keyword(s):  
Integrated Circuits ◽  
Near Field

scholarly journals High-isolation antenna array using SIW and realized with a graphene layer for sub-terahertz wireless applications

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Mohammad Alibakhshikenari ◽  
Bal S. Virdee ◽  
Shahram Salekzamankhani ◽  
Sonia Aïssa ◽  
Chan H. See ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Antenna Arrays ◽  
Integrated Circuit ◽  
Mutual Coupling ◽  
Near Field ◽  
Dielectric Substrate ◽  
Patch Antennas ◽  
Reference Array ◽  
Radiation Properties ◽  
Array Structures

AbstractThis paper presents the results of a study on developing an effective technique to increase the performance characteristics of antenna arrays for sub-THz integrated circuit applications. This is essential to compensate the limited power available from sub-THz sources. Although conventional array structures can provide a solution to enhance the radiation-gain performance however in the case of small-sized array structures the radiation properties can be adversely affected by mutual coupling that exists between the radiating elements. It is demonstrated here the effectiveness of using SIW technology to suppress surface wave propagations and near field mutual coupling effects. Prototype of 2 × 3 antenna arrays were designed and constructed on a polyimide dielectric substrate with thickness of 125 μm for operation across 0.19–0.20 THz. The dimensions of the array were 20 × 13.5 × 0.125 mm3. Metallization of the antenna was coated with 500 nm layer of Graphene. With the proposed technique the isolation between the radiating elements was improved on average by 22.5 dB compared to a reference array antenna with no SIW isolation. The performance of the array was enhanced by transforming the patch to exhibit metamaterial characteristics. This was achieved by embedding the patch antennas in the array with sub-wavelength slots. Compared to the reference array the metamaterial inspired structure exhibits improvement in isolation, radiation gain and efficiency on average by 28 dB, 6.3 dBi, and 34%, respectively. These results show the viability of proposed approach in developing antenna arrays for application in sub-THz integrated circuits.

scholarly journals Broadband Terahertz Photonic Integrated Circuit with Integrated Active Photonic Devices

Photonics ◽  
2021 ◽  
Vol 8 (11) ◽  
pp. 492
Author(s):  
Amlan kusum Mukherjee ◽  
Mingjun Xiang ◽  
Sascha Preu
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Near Field ◽  
Single Mode ◽  
Silicon On Insulator ◽  
High Resistivity ◽  
Active Components ◽  
Photonic Integrated Circuit ◽  
Active Devices ◽  
Frequency Coverage

Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage beyond 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth and miniaturisation capabilities without sacrificing their extreme frequency coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including active components (e.g., THz receivers) as well as passive components (couplers/splitters, bends, resonators) investigated over a frequency range of 0.5–1.6 THz. The waveguides have a single mode bandwidth between 0.5–0.75 THz; however, above 1 THz, these waveguides can be operated in the overmoded regime offering lower loss than commonly implemented hollow metal waveguides, operated in the fundamental mode. Supported by quartz and polyethylene substrates, the platform for Terahertz photonic integrated circuits (Tera-PICs) is mechanically stable and easily integrable. Additionally, we demonstrate several key components for Tera-PICs: low loss bends with radii ∼2 mm, a Vivaldi antenna-based efficient near-field coupling to active devices, a 3-dB splitter and a filter based on a whispering gallery mode resonator.

scholarly journals Radiationless anapole states in on-chip photonics

2021 ◽  
Vol 10 (1) ◽  
Author(s):  
Evelyn Díaz-Escobar ◽  
Thomas Bauer ◽  
Elena Pinilla-Cienfuegos ◽  
Ángela I. Barreda ◽  
Amadeu Griol ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Near Field ◽  
Field Measurements ◽  
High Index ◽  
Field Energy ◽  
Far Field ◽  
Interference Effects ◽  
Strong Reduction ◽  
On Chip ◽  
Integrated Circuitry

AbstractHigh-index nanoparticles are known to support radiationless states called anapoles, where dipolar and toroidal moments interfere to inhibit scattering to the far field. In order to exploit the striking properties arising from these interference conditions in photonic integrated circuits, the particles must be driven in-plane via integrated waveguides. Here, we address the excitation of electric anapole states in silicon disks when excited on-chip at telecom wavelengths. In contrast to normal illumination, we find that the anapole condition—identified by a strong reduction of the scattering—does not overlap with the near-field energy maximum, an observation attributed to retardation effects. We experimentally verify the two distinct spectral regions in individual disks illuminated in-plane from closely placed waveguide terminations via far-field and near-field measurements. Our finding has important consequences concerning the use of anapole states and interference effects of other Mie-type resonances in high-index nanoparticles for building complex photonic integrated circuitry.

Sign in / Sign up

Export Citation Format

Share Document