Investigation of The Flow Behaviors for Capillary Underfill Process in Flip-Chip Packaging

2021 ◽  
Author(s):  
Shih Kun Lo ◽  
Tzu Chieh Chien ◽  
Hui Chung Liu ◽  
Lu Ming ◽  
Lai ◽  
...  
Keyword(s):  
Flip Chip ◽  
Flip Chip Packaging ◽  
Capillary Underfill

A High-Linearity 76–85-GHz 16-Element 8-Transmit/8-Receive Phased-Array Chip With High Isolation and Flip-Chip Packaging

2014 ◽  
Vol 62 (10) ◽  
pp. 2337-2356 ◽  
Author(s):  
Bon-Hyun Ku ◽  
Ozgur Inac ◽  
Michael Chang ◽  
Hyun-Ho Yang ◽  
Gabriel M. Rebeiz
Keyword(s):  
Flip Chip ◽  
Phased Array ◽  
High Isolation ◽  
High Linearity ◽  
Flip Chip Packaging

The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging

2011 ◽  
Vol 462-463 ◽  
pp. 1194-1199
Author(s):  
Zainudin Kornain ◽  
Azman Jalar ◽  
Rozaidi Rashid ◽  
Shahrum Abdullah
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Process Time ◽  
Curing Process ◽  
Curing Time ◽  
Hold Temperature ◽  
Flip Chip Packaging ◽  
Time Cycle ◽  
The Impact

Underfilling is the vital process to reduce the impact of the thermal stress that results from the mismatch in the co-efficient of thermal expansion (CTE) between the silicon chip and the substrate in Flip Chip Packaging. This paper reported the pattern of underfill’s hardness during curing process for large die Ceramic Flip Chip Ball Grid Array (FC-CBGA). A commercial amine based underfill epoxy was dispensed into HiCTE FC-CBGA and cured in curing oven under a new method of two-step curing profile. Nano-identation test was employed to investigate the hardness of underfill epoxy during curing steps. The result has shown the almost similar hardness of fillet area and centre of the package after cured which presented uniformity of curing states. The total curing time/cycle in production was potentially reduced due to no significant different of hardness after 60 min and 120 min during the period of second hold temperature.

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