Low-dielectric-constant novel periodic mesoporous organosilica thin film for interlayer dielectric

2016 ◽  
Author(s):  
Jiawei Zhang ◽  
Guoping Zhang ◽  
Rong Sun ◽  
S. W. Ricky Lee ◽  
C. P. Wong
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Periodic Mesoporous Organosilica ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Mesoporous Organosilica

Vacuum-Assisted Aerosol Deposition of a Low-Dielectric-Constant Periodic Mesoporous Organosilica Film

2010 ◽  
Vol 22 (1) ◽  
pp. 99-102 ◽  
Author(s):  
Wendong Wang ◽  
Daniel Grozea ◽  
Ara Kim ◽  
Douglas D. Perovic ◽  
Geoffrey A. Ozin
Keyword(s):  
Dielectric Constant ◽  
Aerosol Deposition ◽  
Low Dielectric Constant ◽  
Periodic Mesoporous Organosilica ◽  
Low Dielectric ◽  
Mesoporous Organosilica

Investigations of The Low Dielectric Constant Fluorinated Polyimide for Use as The Interlayer Dielectric in ULSI

1995 ◽  
Vol 381 ◽  
Author(s):  
Y.K. Lee ◽  
S.P. Murarka ◽  
S. -P. Jeng ◽  
B. Auman
Keyword(s):  
Thin Film ◽  
Dielectric Constant ◽  
Effect Of Temperature ◽  
Low Dielectric Constant ◽  
Flat Band ◽  
Flat Band Voltage ◽  
Interlayer Dielectric ◽  
Integrated Electronics ◽  
Low Dielectric ◽  
Fluorinated Polyimide

AbstractLow dielectric constant interlayer dielectric ( ILD) materials are required for the advanced silicon integrated electronics such as those in the ULSI era[3, 10]. We have investigated several such materials. In this paper the results of our investigations of the materials and electrical properties, processing ( to form ILD ), and applicability of a DuPont fluorinated polyimide are described and discussed. Weight loss, FTIR, and ellipsometric measurements have been carried out. The DuPont fluorinated polyimide thin film was observed to be thermally stable up to 450°C, which is monitored by using dynamic TGA with a ramping rate of 10°C/min or 5°C/min in N2 Ambient. Also MIPOS capacitor characterization, effect of temperature and moisture on these properties have been determined. The dielectric constant was observed to be as low as 2.5 and the refractive index is around 1.63, both being stable up to 450°C. However, the DuPont Fluorinated polyimide exhibited a flat band voltage shift on C-V curve after 400°C annealing in vacuum environments for 1 hr. Compatibility with copper as the interconnecting metal has been determined and discussed[8]. It is concluded that this polymer is a possible candidate for ILD application.

The characterization and preparation of porous low dielectric films using various cyclodextrins as template materials

2003 ◽  
Vol 766 ◽  
Author(s):  
Jin-Heong Yim ◽  
Jung-Bae Kim ◽  
Hyun-Dam Jeong ◽  
Yi-Yeoul Lyu ◽  
Sang Kook Mah ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Dielectric Constant ◽  
Pore Structure ◽  
Pore Diameter ◽  
Dielectric Films ◽  
Low Dielectric Constant ◽  
Cyclodextrin Derivatives ◽  
Low Dielectric ◽  
Low K

AbstractPorous low dielectric films containing nano pores (∼20Å) with low dielectric constant (<2.2), have been prepared by using various kinds of cyclodextrin derivatives as porogenic materials. The pore structure such as pore size and interconnectivity can be controlled by changing functional groups of the cyclodextrin derivatives. We found that mechanical properties of porous low-k thin film prepared with mCSSQ (modified cyclic silsesquioxane) precursor and cyclodextrin derivatives were correlated with the pore interconnection length. The longer the interconnection length of nanopores in the thin film, the worse the mechanical properties of the thin film (such as hardness and modulus) even though the pore diameter of the films were microporous (∼2nm).

Intrinsic low dielectric behaviour of a highly thermally stable Sr-based metal–organic framework for interlayer dielectric materials

2014 ◽  
Vol 2 (19) ◽  
pp. 3762-3768 ◽  
Author(s):  
Muhammad Usman ◽  
Cheng-Hua Lee ◽  
Dung-Shing Hung ◽  
Shang-Fan Lee ◽  
Chih-Chieh Wang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Metal Organic Framework ◽  
Dielectric Materials ◽  
Low Dielectric Constant ◽  
Water Molecules ◽  
Compound A ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
Metal Organic ◽  
Organic Framework

A Sr-based metal–organic framework exhibits an intrinsic low dielectric constant after removing the water molecules. A low dielectric constant and high thermal stability make this compound a candidate for use as a low-k material.

Siloxane Polymers as Low Dielectric Materials for Microelectronics

1995 ◽  
Vol 390 ◽  
Author(s):  
C. P. Wong
Keyword(s):  
Dielectric Constant ◽  
Three Dimensional ◽  
Signal Propagation ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Dimensional Structure ◽  
Low Dielectric Constant ◽  
Interlayer Dielectric ◽  
Low Dielectric ◽  
High Dielectric

ABSTRACTA modem VLSI device is a complicated three-dimensional structure that consists of multilayer metallization conductor lines which are separated with interlayer-dielectrics as insulation. This VLSI technology drives the IC device into sub-micron feature size that operates at ultra-fast speed (in excess of > 100 MHz). Passivation and interlayer dielectric materials are critical to the device performance due to the conductor signal propagation delay of the high dielectric constant of the material. Low dielectric constant materials are the preferred choice of materials for this reasons. These materials, such as Teflon® and siloxanes (silicones), are desirable because of their low dielectric constant (∈1) = 2.0, 2.7, respectively. This paper describes the use of a low dielectric constant siloxane polymer (silicone) as IC devices passivation layer material, its chemistry, material processes and reliability testing.

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