An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system
Keyword(s):
2003 ◽
Vol 42
(Part 2, No. 7B)
◽
pp. L852-L855
◽
2013 ◽
Vol 2013
◽
pp. 1-8
◽
2016 ◽
Vol 120
(22)
◽
pp. 11938-11946
◽
Keyword(s):
2008 ◽
Vol 8
(6)
◽
pp. 2996-3002
◽
Keyword(s):
2006 ◽
Vol 49
(6)
◽
pp. 849-854
◽
2017 ◽
Vol 118
(12)
◽
pp. 4203-4209
◽