Circuit hot carrier reliability simulation in advanced CMOS process technology development

2002 ◽  
Author(s):  
Peng Fang ◽  
P.C. Li ◽  
J.T. Yue
Keyword(s):  
Technology Development ◽  
Cmos Process ◽  
Process Technology ◽  
Hot Carrier

Analysis of 6T SRAM Cell in Different Technologies

2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda
Keyword(s):  
Low Power ◽  
Data Storage ◽  
Low Voltage ◽  
Random Access ◽  
Storage Device ◽  
Cmos Process ◽  
Process Technology ◽  
Digital Devices ◽  
Noise Margin ◽  
Sram Cell

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).

scholarly journals A Study on the Variable Inductor Design by Switching the Main Paths and the Coupling Coils

Electronics ◽  
2021 ◽  
Vol 10 (15) ◽  
pp. 1856
Author(s):  
Yen-Chung Chiang ◽  
Juo-Chen Chen ◽  
Yu-Hsin Chang
Keyword(s):  
Design Method ◽  
The Other ◽  
Cmos Process ◽  
Mos Transistors ◽  
Quality Factors ◽  
Process Technology ◽  
Variation Versus ◽  
Variable Inductor ◽  
Metal Layers ◽  
Coupled Coils

In a radio frequency (RF) system, it is possible to use variable inductors for providing tunable or selective frequency range. Variable inductors can be implemented by the microelectromechanical system (MEMS) process or by using transistors as switches to change the routing of coils or coupling quantities. In this paper, we investigated the design method of a variable inductor by using MOS transistors to switch the main coil paths and the secondary coupled coils. We observed the effects of different metal layers, turn numbers, and layout arrangements for secondary-coupled coils and compared their characteristics on the inductances and quality factors. We implemented two chips in the 0.18 m CMOS process technology for each kind of arrangement for verification. One inductor can achieve inductance values from about 300 pH to 550 pH, and the other is between 300 pH and 575 pH, corresponding to 59.3% and 62.5%, respectively, inductance variation range at 4 GHz frequency. Additionally, their fine step sizes of the switched inductances are from 0.5% to 6% for one design, and 1% to 12.5% for the other. We found that both designs achieved a large inductance tuning range and moderate inductance step sizes with a slight difference behavior on the inductance variation versus frequency.

scholarly journals A Low-Power 12-Bit 20 MS/s Asynchronously Controlled SAR ADC for WAVE ITS Sensor Based Applications

Sensors ◽  
2021 ◽  
Vol 21 (7) ◽  
pp. 2260
Author(s):  
Khuram Shehzad ◽  
Deeksha Verma ◽  
Danial Khan ◽  
Qurat Ul Ain ◽  
Muhammad Basim ◽  
...  
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Intelligent Transportation System ◽  
Cmos Process ◽  
Process Technology ◽  
Back Issue ◽  
Digital To Analog Converter ◽  
Analog To Digital ◽  
Switching Method

A low power 12-bit, 20 MS/s asynchronously controlled successive approximation register (SAR) analog-to-digital converter (ADC) to be used in wireless access for vehicular environment (WAVE) intelligent transportation system (ITS) sensor based application is presented in this paper. To optimize the architecture with respect to power consumption and performance, several techniques are proposed. A switching method which employs the common mode charge recovery (CMCR) switching process is presented for capacitive digital-to-analog converter (CDAC) part to lower the switching energy. The switching technique proposed in our work consumes 56.3% less energy in comparison with conventional CMCR switching method. For high speed operation with low power consumption and to overcome the kick back issue in the comparator part, a mutated dynamic-latch comparator with cascode is implemented. In addition, to optimize the flexibility relating to the performance of logic part, an asynchronous topology is employed. The structure is fabricated in 65 nm CMOS process technology with an active area of 0.14 mm2. With a sampling frequency of 20 MS/s, the proposed architecture attains signal-to-noise distortion ratio (SNDR) of 65.44 dB at Nyquist frequency while consuming only 472.2 µW with 1 V power supply.

scholarly journals A 219-µW ultra-low power low-noise amplifier for IEEE 802.15.4 based battery powered, portable, wearable IoT applications

2021 ◽  
Vol 3 (4) ◽  
Author(s):  
S. Chrisben Gladson ◽  
Adith Hari Narayana ◽  
V. Thenmozhi ◽  
M. Bhaskar
Keyword(s):  
Low Power ◽  
Ieee 802.15.4 ◽  
Low Voltage ◽  
Low Noise ◽  
Low Noise Amplifier ◽  
Cmos Process ◽  
Process Technology ◽  
Ultra Low Power ◽  
Power Mode ◽  
Noise Amplifier

AbstractDue to the increased processing data rates, which is required in applications such as fifth-generation (5G) wireless networks, the battery power will discharge rapidly. Hence, there is a need for the design of novel circuit topologies to cater the demand of ultra-low voltage and low power operation. In this paper, a low-noise amplifier (LNA) operating at ultra-low voltage is proposed to address the demands of battery-powered communication devices. The LNA dual shunt peaking and has two modes of operation. In low-power mode (Mode-I), the LNA achieves a high gain ($$S21$$ S 21 ) of 18.87 dB, minimum noise figure ($${NF}_{min.}$$ NF m i n . ) of 2.5 dB in the − 3 dB frequency range of 2.3–2.9 GHz, and third-order intercept point (IIP3) of − 7.9dBm when operating at 0.6 V supply. In high-power mode (Mode-II), the achieved gain, NF, and IIP3 are 21.36 dB, 2.3 dB, and 13.78dBm respectively when operating at 1 V supply. The proposed LNA is implemented in UMC 180 nm CMOS process technology with a core area of $$0.40{\mathrm{ mm}}^{2}$$ 0.40 mm 2 and the post-layout validation is performed using Cadence SpectreRF circuit simulator.

scholarly journals Novel Design of Low-Power High-Speed Hybrid Full Adder Design using Gate Diffusion Input (GDI) Technique

2020 ◽  
Vol 9 (12) ◽  
pp. 323-328
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
High Speed ◽  
Critical Path ◽  
Circuit Simulation ◽  
Full Adder ◽  
Cmos Process ◽  
Path Delay ◽  
Process Technology ◽  
Xnor Gate

VLSI technology become one of the most significant and demandable because of the characteristics like device portability, device size, large amount of features, expenditure, consistency, rapidity and many others. Multipliers and Adders place an important role in various digital systems such as computers, process controllers and signal processors in order to achieve high speed and low power. Two input XOR/XNOR gate and 2:1 multiplexer modules are used to design the Hybrid Full adders. The XOR/XNOR gate is the key punter of power included in the Full adder cell. However this circuit increases the delay, area and critical path delay. Hence, the optimum design of the XOR/XNOR is required to reduce the power consumption of the Full adder Cell. So a 6 New Hybrid Full adder circuits are proposed based on the Novel Full-Swing XOR/XNOR gates and a New Gate Diffusion Input (GDI) design of Full adder with high-swing outputs. The speed, power consumption, power delay product and driving capability are the merits of the each proposed circuits. This circuit simulation was carried used cadence virtuoso EDA tool. The simulation results based on the 90nm CMOS process technology model.

Progress on Ongoing Waste form HIP projects at ANSTO

MRS Advances ◽  
2018 ◽  
Vol 3 (20) ◽  
pp. 1059-1064 ◽  
Author(s):  
Eric R. Vance ◽  
Dorji T. Chavara ◽  
Daniel J. Gregg
Keyword(s):  
Spent Nuclear Fuel ◽  
Technology Development ◽  
Hot Isostatic Pressing ◽  
Waste Form ◽  
Process Technology ◽  
Ceramic Waste ◽  
Waste Forms ◽  
Produce Glass ◽  
Form Development ◽  
Year 2000

Abstract:Since the year 2000, Synroc has evolved from the titanate full-ceramic waste forms developed in the late 1970s to a hot isostatic pressing (HIP) technology platform that can be applied to produce glass, glass–ceramic, and ceramic waste forms and where there are distinct advantages over vitrification in terms of, for example, waste loading and suppressing volatile losses. This paper describes recent progress on waste form development for intermediate-level wastes from 99Mo production at ANSTO, spent nuclear fuel, fluoride pyroprocessing wastes and 129I. The microstructures and aqueous dissolution results are presented where applicable. This paper provides perspective on Synroc waste forms and recent process technology development in the nuclear waste management industry.

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