Designing Operational Transconductance Amplifiers For Low Voltage Operation

Author(s):  
P.J. Crawley ◽  
C.W. Roberts
Electronics ◽  
2020 ◽  
Vol 9 (9) ◽  
pp. 1410
Author(s):  
Luis Henrique Rodovalho ◽  
Orazio Aiello ◽  
Cesar Ramos Rodrigues

This paper proposes topological enhancements to increase voltage gain of ultra-low-voltage (ULV) inverter-based OTAs. The two proposed improvements rely on adoption of composite transistors and forward-body-biasing. The impact of the proposed techniques on performance figures is demonstrated through simulations of two OTAs. The first OTA achieves a 39 dB voltage gain, with a power consumption of 600 pW and an active area of 447 μm2. The latter allies the forward-body-bias approach with the benefit of the independently biased composite transistors. By combining both solutions, voltage gain is raised to 51 dB, consuming less power (500 pW) at the cost of an increased area of 727 μm2. The validation has been performed through post-layout simulations with the Cadence Analog Design Environment and the TSMC 180 nm design kit, with the supply voltage ranging from 0.3 V to 0.6 V.


Electronics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 983 ◽  
Author(s):  
Pedro Toledo ◽  
Paolo Crovetti ◽  
Hamilton Klimach ◽  
Sergio Bampi

The calibration of the effects of process variations and device mismatch in Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifiers (DB-OTAs) is addressed in this paper. For this purpose, two dynamic calibration techniques, intended to dynamically vary the effective strength of critical gates by different modulation strategies, i.e., Digital Pulse Width Modulation (DPWM) and Dyadic Digital Pulse Modulation (DDPM), are explored and compared to classic static calibration. The effectiveness of the calibration approaches as a mean to recover acceptable performance in non-functional samples is verified by Monte-Carlo (MC) post-layout simulations performed on a 300 mV power supply, nW-power DB-OTA in 180 nm CMOS. Based on the same MC post-layout simulations, the impact of each calibration strategy on silicon area, power consumption, and OTA performance is discussed.


2017 ◽  
Vol 27 (05) ◽  
pp. 1750077 ◽  
Author(s):  
Mohammad Rafiq Dar ◽  
Nasir Ali Kant ◽  
Farooq Ahmad Khanday

In this paper, electronic implementation of fractional-order Rössler system using operational transconductance amplifiers (OTAs) is presented which until now was only being investigated through numerical simulations. The realization offers the benefits of low-voltage implementation, integrability and electronic tunability. In addition, the proposed circuit is a MOS only design (as no BJTs have been used) which contains only grounded components and is therefore suitable for monolithic VLSI design. The chaotic behavior of the fractional-order Rössler system in consideration with the incommensurate orders has been demonstrated which finds many applications in several fields. The theoretical predictions of the proposed implementation have been verified through experimentation and HSPICE simulator using Austrian Micro System (AMS) 0.35[Formula: see text][Formula: see text]m CMOS process and the obtained results have been found in good agreement with the Matlab simulink theoretical results obtained using FOMCON simulink toolbox. Besides, a secure message communication system has been considered to demonstrate fully the usefulness of the chaotic system.


Author(s):  
Klaus-Ruediger Peters

A new generation of high performance field emission scanning electron microscopes (FSEM) is now commercially available (JEOL 890, Hitachi S 900, ISI OS 130-F) characterized by an "in lens" position of the specimen where probe diameters are reduced and signal collection improved. Additionally, low voltage operation is extended to 1 kV. Compared to the first generation of FSEM (JE0L JSM 30, Hitachi S 800), which utilized a specimen position below the final lens, specimen size had to be reduced but useful magnification could be impressively increased in both low (1-4 kV) and high (5-40 kV) voltage operation, i.e. from 50,000 to 200,000 and 250,000 to 1,000,000 x respectively.At high accelerating voltage and magnification, contrasts on biological specimens are well characterized1 and are produced by the entering probe electrons in the outmost surface layer within -vl nm depth. Backscattered electrons produce only a background signal. Under these conditions (FIG. 1) image quality is similar to conventional TEM (FIG. 2) and only limited at magnifications >1,000,000 x by probe size (0.5 nm) or non-localization effects (%0.5 nm).


Author(s):  
Arthur V. Jones

With the introduction of field-emission sources and “immersion-type” objective lenses, the resolution obtainable with modern scanning electron microscopes is approaching that obtainable in STEM and TEM-but only with specific types of specimens. Bulk specimens still suffer from the restrictions imposed by internal scattering and the need to be conducting. Advances in coating techniques have largely overcome these problems but for a sizeable body of specimens, the restrictions imposed by coating are unacceptable.For such specimens, low voltage operation, with its low beam penetration and freedom from charging artifacts, is the method of choice.Unfortunately the technical dificulties in producing an electron beam sufficiently small and of sufficient intensity are considerably greater at low beam energies — so much so that a radical reevaluation of convential design concepts is needed.The probe diameter is usually given by


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