How can chip technology realize electronic sensing of viruses?

2021 ◽  
Author(s):  
Hiroshi Watanabe ◽  
Che-An Lee
Keyword(s):  
Chip Technology ◽  
Electronic Sensing

Thin-Die Flip Chip Physical-FA Process Flow

2002 ◽  
Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Fault Isolation ◽  
Preparation Methods ◽  
Chip Technology ◽  
Isolation Test ◽  
Sample Preparation Methods

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

Multiprocessor transport surveillance video system based on "system on chip" technology

2020 ◽  
Author(s):  
Ш.С. Фахми ◽  
Н.В. Шаталова ◽  
В.В. Вислогузов ◽  
Е.В. Костикова
Keyword(s):  
System On Chip ◽  
Reference Points ◽  
Surveillance Video ◽  
Video Information ◽  
Chip Technology ◽  
Intelligent Video Surveillance System ◽  
Speed Up ◽  
Algorithmic Analysis ◽  
Computational Procedures ◽  
On Chip

В данной работе предлагаются математический аппарат и архитектура многопроцессорной транспортной системы на кристалле (МПТСнК). Выполнена программно-аппаратная реализация интеллектуальной системы видеонаблюдения на базе технологии «система на кристалле» и с использованием аппаратного ускорителя известного метода формирования опорных векторов. Архитектура включает в себя сложно-функциональные блоки анализа видеоинформации на базе параллельных алгоритмов нахождения опорных точек изображений и множества элементарных процессоров для выполнения сложных вычислительных процедур алгоритмов анализа с использованием средств проектирования на базе реконфигурируемой системы на кристалле, позволяющей оценить количество аппаратных ресурсов. Предлагаемая архитектура МПТСнК позволяет ускорить обработку и анализ видеоинформации при решении задач обнаружения и распознавания чрезвычайных ситуаций и подозрительных поведений. In this paper, we propose the mathematical apparatus and architecture of a multiprocessor transport system on a chip (MPTSoC). Software and hardware implementation of an intelligent video surveillance system based on the "system on chip" technology and using a hardware accelerator of the well-known method of forming reference vectors. The architecture includes complex functional blocks for analyzing video information based on parallel algorithms for finding image reference points and a set of elementary processors for performing complex computational procedures for algorithmic analysis. using design tools based on a reconfigurable system on chip that allows you to estimate the amount of hardware resources. The proposed MPTSoC architecture makes it possible to speed up the processing and analysis of video information when solving problems of detecting and recognizing emergencies and suspicious behaviors

Development and Prospect of Cell-electrofusion Chip Technology

2012 ◽  
Vol 40 (3) ◽  
pp. 331
Author(s):  
Zhen-Yu WANG ◽  
Jun YANG ◽  
Ning HU ◽  
Xiao-Lin ZHENG ◽  
Zhong YANG
Keyword(s):  
Chip Technology ◽  
Cell Electrofusion

Label-Free Electrochemical Detection of DNA Hybridization Related to Anthrax Lethal Factor by using Carbon Nanotube Modified Sensors

2019 ◽  
Vol 15 (4) ◽  
pp. 502-510 ◽  
Author(s):  
Hakan Karadeniz ◽  
Arzum Erdem
Keyword(s):  
Detection Limit ◽  
Dna Hybridization ◽  
Lethal Factor ◽  
Modified Electrodes ◽  
Label Free ◽  
Carbon Paste ◽  
Chip Technology ◽  
Anthrax Lethal Factor ◽  
Hybridization Time ◽  
Electrochemical Monitoring

Background: Anthrax Lethal Factor (ANT) is the dominant virulence factor produced by B. anthracis and is the major cause of death of infected animals. In this paper, pencil graphite electrodes GE were modified with single-walled and multi-walled carbon nanotubes (CNTs) for the detection of hybridization related to the ANT DNA for the first time in the literature. Methods: The electrochemical monitoring of label-free DNA hybridization related to ANT DNA was explored using both SCNT and MCNT modified PGEs with differential pulse voltammetry (DPV). The performance characteristics of ANT-DNA hybridization on disposable GEs were explored by measuring the guanine signal in terms of optimum analytical conditions; the concentration of SCNT and MCNT, the concentrations of probe and target, and also the hybridization time. Under the optimum conditions, the selectivity of probe modified electrodes was tested and the detection limit was calculated. Results: The selectivity of ANT probes immobilized onto MCNT-GEs was tested in the presence of hybridization of probe with NC no response was observed and with MM, smaller responses were observed in comparison to full-match DNA hybridization case. Even though there are unwanted substituents in the mixture samples containing both the target and NC in the ratio 1:1 and both the target and MM in the ratio 1:1, it has been found that ANT probe immobilized CNT modified graphite sensor can also select its target by resulting with 20.9% decreased response in comparison to the one measured in the case of full-match DNA hybridization case Therefore, it was concluded that the detection of direct DNA hybridization was performed by using MCNT-GEs with an acceptable selectivity. Conclusion: Disposable SCNT/MCNT modified GEs bring some important advantages to our assay including easy use, cost-effectiveness and giving a response in a shorter time compared to unmodified PGE, carbon paste electrode and glassy carbon electrode developed for electrochemical monitoring of DNA hybridization. Consequently, the detection of DNA hybridization related to the ANT DNA by MCNT modified sensors was performed by using lower CNT, probe and target concentrations, in a shorter hybridization time and resulting in a lower detection limit according to the SCNT modified sensors. In conclusion, MCNT modified sensors can yield the possibilities leading to the development of nucleic acid sensors platforms for the improvement of fast and cost-effective detection systems with respect to DNA chip technology.

scholarly journals Synthesis of Nanogels: Current Trends and Future Outlook

Gels ◽  
2021 ◽  
Vol 7 (2) ◽  
pp. 36
Author(s):  
Emanuele Mauri ◽  
Sara Maria Giannitelli ◽  
Marcella Trombetta ◽  
Alberto Rainer
Keyword(s):  
3D Printing ◽  
Ad Hoc ◽  
Sol Gel ◽  
Controlled Polymerization ◽  
Current Trends ◽  
Chip Technology ◽  
Physico Chemical ◽  
Physical Interactions ◽  
Sol Gel Transition ◽  
Gel Transition

Nanogels represent an innovative platform for tunable drug release and targeted therapy in several biomedical applications, ranging from cancer to neurological disorders. The design of these nanocarriers is a pivotal topic investigated by the researchers over the years, with the aim to optimize the procedures and provide advanced nanomaterials. Chemical reactions, physical interactions and the developments of engineered devices are the three main areas explored to overcome the shortcomings of the traditional nanofabrication approaches. This review proposes a focus on the current techniques used in nanogel design, highlighting the upgrades in physico-chemical methodologies, microfluidics and 3D printing. Polymers and biomolecules can be combined to produce ad hoc nanonetworks according to the final curative aims, preserving the criteria of biocompatibility and biodegradability. Controlled polymerization, interfacial reactions, sol-gel transition, manipulation of the fluids at the nanoscale, lab-on-a-chip technology and 3D printing are the leading strategies to lean on in the next future and offer new solutions to the critical healthcare scenarios.

scholarly journals Design and Switching Characteristics of Flip-Chip GaN Half-Bridge Modules Integrated with Drivers

2021 ◽  
Vol 11 (15) ◽  
pp. 7057
Author(s):  
Lin Wang ◽  
Zhe Cheng ◽  
Zhi-Guo Yu ◽  
De-Feng Lin ◽  
Zhe Liu ◽  
...  
Keyword(s):  
Flip Chip ◽  
High Electron Mobility Transistors ◽  
Wire Bonding ◽  
High Electron ◽  
Parasitic Inductance ◽  
Switching Performance ◽  
Turn On ◽  
Electron Mobility Transistors ◽  
Chip Technology ◽  
Switching Characteristics

Half-bridge modules with integrated GaN high electron mobility transistors (HEMTs) and driver dies were designed and fabricated in this research. Our design uses flip-chip technology for fabrication, instead of more generally applied wire bonding, to reduce parasitic inductance in both the driver-gate and drain-source loops. Modules were prepared using both methods and the double-pulse test was applied to evaluate and compare their switching characteristics. The gate voltage (Vgs) waveform of the flip-chip module showed no overshoot during the turn-on period, and a small oscillation during the turn-off period. The probabilities of gate damage and false turn-on were greatly reduced. The inductance in the drain-source loop of the module was measured to be 3.4 nH. The rise and fall times of the drain voltage (Vds) were 12.9 and 5.8 ns, respectively, with an overshoot of only 4.8 V during the turn-off period under Vdc = 100 V. These results indicate that the use of flip-chip technology along with the integration of GaN HEMTs with driver dies can effectively reduce the parasitic inductance and improve the switching performance of GaN half-bridge modules compared to wire bonding.

scholarly journals Review of Electrochemical DNA Biosensors for Detecting Food Borne Pathogens

Sensors ◽  
2019 ◽  
Vol 19 (22) ◽  
pp. 4916 ◽  
Author(s):  
Qiaoyun Wu ◽  
Yunzhe Zhang ◽  
Qian Yang ◽  
Ning Yuan ◽  
Wei Zhang
Keyword(s):  
Pathogen Detection ◽  
Low Cost ◽  
Electrochemical Techniques ◽  
Ease Of Use ◽  
Detection Methods ◽  
Future Research ◽  
Dna Biosensors ◽  
Food Borne Pathogens ◽  
Chip Technology ◽  
Food Borne

The vital importance of rapid and accurate detection of food borne pathogens has driven the development of biosensor to prevent food borne illness outbreaks. Electrochemical DNA biosensors offer such merits as rapid response, high sensitivity, low cost, and ease of use. This review covers the following three aspects: food borne pathogens and conventional detection methods, the design and fabrication of electrochemical DNA biosensors and several techniques for improving sensitivity of biosensors. We highlight the main bioreceptors and immobilizing methods on sensing interface, electrochemical techniques, electrochemical indicators, nanotechnology, and nucleic acid-based amplification. Finally, in view of the existing shortcomings of electrochemical DNA biosensors in the field of food borne pathogen detection, we also predict and prospect future research focuses from the following five aspects: specific bioreceptors (improving specificity), nanomaterials (enhancing sensitivity), microfluidic chip technology (realizing automate operation), paper-based biosensors (reducing detection cost), and smartphones or other mobile devices (simplifying signal reading devices).

scholarly journals Testing Lab-on-a-Chip Technology for Culturing Human Melanoma Cells under Simulated Microgravity

Cancers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 402
Author(s):  
Dawid Przystupski ◽  
Agata Górska ◽  
Olga Michel ◽  
Agnieszka Podwin ◽  
Patrycja Śniadek ◽  
...  
Keyword(s):  
Simulated Microgravity ◽  
Lab On A Chip ◽  
Human Keratinocytes ◽  
Melanoma Cells ◽  
Short Exposure ◽  
Biological Research ◽  
Cell Physiology ◽  
Caspase Activity ◽  
Chip Technology ◽  
Cells Cultured

The dynamic development of the space industry makes space flights more accessible and opens up new opportunities for biological research to better understand cell physiology under real microgravity. Whereas specialized studies in space remain out of our reach, preliminary experiments can be performed on Earth under simulated microgravity (sµg). Based on this concept, we used a 3D-clinostat (3D-C) to analyze the effect of short exposure to sµg on human keratinocytes HaCaT and melanoma cells A375 cultured on all-glass Lab-on-a-Chip (LOC). Our preliminary studies included viability evaluation, mitochondrial and caspase activity, and proliferation assay, enabling us to determine the effect of sµg on human cells. By comparing the results concerning cells cultured on LOCs and standard culture dishes, we were able to confirm the biocompatibility of all-glass LOCs and their potential application in microgravity research on selected human cell lines. Our studies revealed that HaCaT and A375 cells are susceptible to simulated microgravity; however, we observed an increased caspase activity and a decrease of proliferation in cancer cells cultured on LOCs in comparison to standard cell cultures. These results are an excellent basis to conduct further research on the possible application of LOCs systems in cancer research in space.

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