scholarly journals MEMS' Rocky Road

2002 ◽  
Vol 124 (06) ◽  
pp. 38-41 ◽  
Author(s):  
John DeGaspari
Keyword(s):  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Trade Association ◽  
Absolute Pressure ◽  
Mems Devices ◽  
Hard Drives ◽  
Industry Group ◽  
Group A ◽  
Potential Demand ◽  
Mems Process

This article highlights that there is potential demand for microelectromechanical systems (MEMS) devices across a range of industries. In 2002, the five leading applications of MEMS will use 21.5 million disposable blood pressure sensors, 28.7 million manifold absolute pressure sensors for engines, 85 million packaged airbag accelerometers, 425 million inkjet printer heads, and a whopping 1.58 billion read/write magnetic heads for computer hard drives. In MEMS, process is driven by design, so it is important for companies seeking to commercialize a micro device to evaluate the capabilities of a foundry. Industry groups are starting to recognize standardization as an issue, and are focusing on fabrication. The MEMS Industry Group, a trade association based in Pittsburgh, identified standardization as a key challenge in its 2001 annual report. The Group plans to issue a report on foundries and fabrication sooner.

MEMS Fabrication on LTCC Substrates for RF Applications: Challenges and Perspectives

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000089-000094
Author(s):  
Dorra Bahloul ◽  
Achraf Ben Amar ◽  
Ammar B. Kouki
Keyword(s):  
Microelectromechanical Systems ◽  
Mems Devices ◽  
Surface Polishing ◽  
Mems Fabrication ◽  
Successful Solution ◽  
Radar Applications ◽  
Pre Treatment ◽  
Final Surface Finish ◽  
Mems Process ◽  
Mechanical Surface

Abstract Microelectromechanical Systems (MEMS) are often used in transceiver modules, especially for telecommunication and radar applications. In this paper, we present recent progress in the development on a MEMS-on-LTCC process. We focus on the Low Temperature Co-fired Ceramic (LTCC) substrate issues and we present a successful solution for overcoming the substrate challenges through surface pre-treatment using a chemical mechanical surface polishing (CMP) process which allows us to reach the required smoothness for the fabrication of MEMS devices. We discuss various process parameters such as slurry type, rotating pad and rotation speed, and show their impact on the final surface finish. With an optimized process, the maximum roughness was decreased from more than 10μm to less than 0.5 μm over a 640 × 640 μm2 LTCC sample. Also, we present the various MEMS process steps starting with the deposition and patterning of various layers to a prototype switch highlighting the validated steps and the challenges encountered. A brief discussion of the perspectives for the integration of MEMS and LTCC technologies is also presented.

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

2003 ◽  
Vol 125 (4) ◽  
pp. 470-474 ◽  
Author(s):  
J. Albert Chiou ◽  
Steven Chen ◽  
Jinbao Jiao
Keyword(s):  
Pressure Sensor ◽  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Anodic Bonding ◽  
Absolute Pressure ◽  
Stress Effect ◽  
Induced Voltage ◽  
Voltage Shift ◽  
Mems Pressure Sensors ◽  
Vacuum Cavity

The pressure sensor is one of the major applications of microelectromechanical systems (MEMS). An absolute pressure sensor utilizes anodic bonding to create a vacuum cavity between the silicon diaphragm and glass substrate. The manifold absolute pressure (MAP) sensing elements from a new supplier have exhibited negative voltage shifts after exposure to humidity. A hypothesis has been established that poor anodic bonding causes an angstrom-level gap between the silicon substrate and glass. Once moisture enters the gap in a vapor form and condenses as water droplets, surface tension can induce a piezoresistive stress effect that causes an unacceptable voltage shift. Finite element analyses were performed to simulate the phenomenon and the results correlated well with experimental observations.

scholarly journals MEMS development focusing on collaboration using common facilities: a retrospective view and future directions

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Masayoshi Esashi
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Tactile Sensor ◽  
Mems Devices ◽  
Future Directions ◽  
Active Matrix ◽  
Large Scale Integration ◽  
Scale Integration

AbstractI have been developing MEMS (microelectromechanical systems) technology and supporting the industry through collaboration. A facility was built in house on a 20 mm square wafer for use in prototyping MEMS and ICs (integrated circuits). The constructed MEMS devices include commercialized integrated capacitive pressure sensors, electrostatically levitated rotational gyroscopes, and two-axis optical scanners. Heterogeneous integration, which is a MEMS on an LSI (large-scale integration), was developed for sophisticated systems using LSI made in a foundry. This technology was applied for tactile sensor networks for safe robots, multi FBAR filters on LSI, active-matrix multielectron emitter arrays, and so on. The facility used to produce MEMS on 4- and 6-inch wafers was developed based on an old semiconductor factory and has been used as an open hands-on access facility by many companies. Future directions of MEMS research are discussed.

Key Reliability Factors for IC and MEMS Packaging

2000 ◽  
Author(s):  
Reza Ghaffarian
Keyword(s):  
Microelectromechanical Systems ◽  
Technology Development ◽  
High Reliability ◽  
Pressure Sensors ◽  
Cost Savings ◽  
Industrial Applications ◽  
Current Status ◽  
Mems Devices ◽  
Mems Packaging ◽  
Commercial Off The Shelf

Abstract During the last decade, research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications including automobile and medical purposes. For example, accelerometers are widely used for air bag in automobile and pressure sensors for various industrial applications. Some of the MEMS devices have potential to become the commercial-off-the-shelf (COTS) components. While high reliability/harsh environmental applications including aerospace require much more sophisticated technology development, they would achieve significant cost savings if they could utilize COTS components in their systems. This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

scholarly journals Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 414
Author(s):  
Marta Maria Kluba ◽  
Jian Li ◽  
Katja Parkkinen ◽  
Marcus Louwerse ◽  
Jaap Snijder ◽  
...  
Keyword(s):  
Complex Geometry ◽  
Pressure Sensors ◽  
Silicon On Insulator ◽  
Test Case ◽  
Mems Devices ◽  
Device Layer ◽  
Mems Fabrication ◽  
Silicon Islands ◽  
Design Freedom ◽  
Deep Brain

Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a novel cavity buried oxide (BOX) SOI substrate (cavity-BOX) that contains a patterned BOX layer. The patterned BOX can form a buried microchannels network, or serve as a stop layer and a buried hard-etch mask, to accurately pattern the device layer while etching it from the backside of the wafer using the cleanroom microfabrication compatible tools and methods. The use of the cavity-BOX as a buried hard-etch mask is demonstrated by applying it for the fabrication of a deep brain stimulation (DBS) demonstrator. The demonstrator consists of a large flexible area and precisely defined 80 µm-thick silicon islands wrapped into a 1.4 mm diameter cylinder. With cavity-BOX, the process of thinning and separating the silicon islands was largely simplified and became more robust. This test case illustrates how cavity-BOX wafers can advance the fabrication of various MEMS devices, especially those with complex geometry and added functionality, by enabling more design freedom and easing the optimization of the fabrication process.

The Demographics of Trade-Affected Services and Manufacturing Workers (1987–1990): A Comparative Analysis

1995 ◽  
Vol 23 (4) ◽  
pp. 43-67
Author(s):  
Bartholomew Armah
Keyword(s):  
Manufacturing Industry ◽  
Service Sector ◽  
Manufacturing Sector ◽  
College Education ◽  
Service Industries ◽  
Highly Educated ◽  
Black And White ◽  
Industry Group ◽  
White Males ◽  
Group A

Using input-output data for 1987 and 1990, this study identifies the demographic characteristics of trade-affected workers in U.S. manufacturing and service industries. Trade-affected workers are defined as employees in industries that experienced a change (positive or negative) in net total (direct and indirect) trade-related employment between 1987 and 1990. For the period 1987–1990, three industry categories were examined: (a) industries that experienced an increase in positive net trade-related employment; (b) industries that experienced a decline in positive net trade-related employment; and (c) industries that suffered net trade-related employment losses in both years yet experienced an improvement over the period. The study finds that, while manufacturing industry workers in the most favorably affected industry group (i.e., group “a”) were more likely to be highly skilled (i.e., scientists & engineers), highly educated (i.e., over four years of college education), unionized, married and white males, corresponding service sector workers were predominantly unskilled (laborers), less educated, non-unionized, young (i.e., aged 16–24) and male (black and white). Furthermore, the service sector was associated with greater mean trade-related employment and output gains and lower mean employment and output losses than was the manufacturing sector.

New Hybrid Methodology for the Development of MEMS Multivariable Sensors

2001 ◽  
Author(s):  
Emily J. Pryputniewicz ◽  
John P. Angelosanto ◽  
Gordon C. Brown ◽  
Cosme Furlong ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Process Control ◽  
Microelectromechanical Systems ◽  
Absolute Pressure ◽  
Single Chip ◽  
Specific Test ◽  
Mems Sensor ◽  
Test Conditions ◽  
Mems Technology ◽  
Functional Operation ◽  
Hybrid Methodology

Abstract Using recent advances in microelectromechanical systems (MEMS) technology, a new multivariable sensor was developed. This MEMS sensor, capable of measuring temperature, absolute pressure, and differential pressure on a single chip, is particularly suitable for applications in process control industry. However, functional operation of the sensor depends on validation of its performance under specific test conditions. We have developed a hybrid methodology, based on analysis and measurements, that allows such validation. In this paper, the MEMS multivariable sensor is described, the hybrid methodology is outlined, and its use is illustrated with representative results.

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

2001 ◽  
Author(s):  
Vijay K. Varadan
Keyword(s):  
Self Assembly ◽  
Communication Systems ◽  
Microelectromechanical Systems ◽  
System Level ◽  
Smart Devices ◽  
Mems Devices ◽  
Wafer Level ◽  
Sensors And Actuators ◽  
Complex Adaptive ◽  
Microelectronics Industry

Abstract The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and MicroElectroMechanical Systems (MEMS). This effort offers the promise of: 1. Increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed for the IC and microelectronics industry. Examples include micro stereo lithographic and micro molding techniques. 2. Developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines. 3. Development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation. 4. Development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems.

Design of Electrostatic Micro Mirrors for Improved Stability Though Surface Contact

1998 ◽  
Author(s):  
Timothy Moulton ◽  
G. K. Ananthasuresh
Keyword(s):  
Design Method ◽  
Electrostatic Force ◽  
Electrostatic Actuation ◽  
Mems Devices ◽  
Complex Dynamic ◽  
Micro Electro Mechanical Systems ◽  
Electrostatically Actuated ◽  
Surface Contact ◽  
Improved Stability ◽  
Mems Process

Abstract There exists a need to stabilize the electrostatic actuation commonly used in Micro-Electro-Mechanical Systems (MEMS). Most electrostatically actuated MEMS devices act as variable capacitors with varying gap between the charged conductors. Electrostatic force in these devices is a nonlinear attractive force between the conductors resulting in a complex dynamic system. These systems are stable for only a small portion of the initial gap. In this paper a design method is presented for electrostatic micro-mirrors with improved stability. Controllable, stable electrostatic actuation can be achieved through surface contact between the two conductors. Once in contact with the surface, the compliance of the structure is used to stabilize the electrostatic actuation over a long range of motion. Beam based variable angle mirrors were designed and fabricated using the Multi-User MEMS Process at MCNC technology center. The design methods for stable electrostatic actuation were tested on these mirrors. Some characteristics are noted and their implementation into future designs is discussed.

Assembly and Testing of Surface Micromachined, Piezoresistive Polysilicon Pressure Sensors

1999 ◽  
Author(s):  
Todd F. Miller ◽  
David J. Monk ◽  
Gary O’Brien ◽  
William P. Eaton ◽  
James H. Smith
Keyword(s):  
Pressure Sensor ◽  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Single Crystal Silicon ◽  
Surface Micromachining ◽  
Process Technology ◽  
Crystal Silicon ◽  
Noise Characteristics ◽  
Testing Techniques ◽  
Piezoresistive Pressure Sensors

Abstract Surface micromachining is becoming increasingly popular for microelectromechanical systems (MEMS) and a new application for this process technology is pressure sensors. Uncompensated surface micromachined piezoresistive pressure sensors were fabricated by Sandia National Labs (SNL). Motorola packaged and tested the sensors over pressure, temperature and in a typical circuit application for noise characteristics. A brief overview of surface micromachining related to pressure sensors is described in the report along with the packaging and testing techniques used. The electrical data found is presented in a comparative manner between the surface micromachined SNL piezoresistive polysilicon pressure sensor and a bulk micromachined Motorola piezoresistive single crystal silicon pressure sensor.

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