Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
S. B. Park ◽  
Rahul Joshi ◽  
Izhar Ahmed ◽  
Soonwan Chung
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Severe Condition ◽  
Experimental Stress Analysis ◽  
Computational Fluid Dynamics Analysis ◽  
Accelerated Thermal Cycling ◽  
Ball Grid Array Packages

Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC simulation, computational fluid dynamics analysis and finite element analysis are performed. The assembly deformations in numerical simulation are compared with those obtained by Moiré images. It is confirmed that for a certain organic package PC can be a more severe condition that causes solder interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always.

The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging

2010 ◽  
Vol 148-149 ◽  
pp. 1108-1111 ◽  
Author(s):  
A. Jalar ◽  
Zainudin Kornain ◽  
Rozaidi Rasid ◽  
Saifollah Abdullah ◽  
Norinsan Kamil Othman
Keyword(s):  
Flip Chip ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Parameters Optimization ◽  
Dynamic Mechanical Analyzer ◽  
Element Analysis ◽  
Ceramic Ball ◽  
Die Stress ◽  
Flip Chip Packaging ◽  
Edge Cracking

The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

2007 ◽  
Author(s):  
X. Long ◽  
I. Dutta ◽  
R. Guduru ◽  
R. Prasanna ◽  
M. Pacheco
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Fatigue Reliability ◽  
Element Analysis ◽  
Mechanical Cycling ◽  
Experimental Apparatus ◽  
Dependent Strain ◽  
Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

On the Multiscale Finite Element Analysis for Interfacial Fracture in Cu/Low-K Interconnects

2007 ◽  
Author(s):  
Tz-Cheng Chiu ◽  
Huang-Chun Lin
Keyword(s):  
Thin Film ◽  
Fracture Mechanics ◽  
Interface Crack ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Thermal Loading ◽  
Global Analysis ◽  
Crack Problem ◽  
Element Analysis ◽  
Low K

The interface crack problem in integrated circuit devices was considered by using global and local modeling approach. In the global analysis the thin film interconnect was modeled by a homogenized layer with material constants obtained from representative volume element (RVE) analysis. Local analyses were then considered to determine fracture mechanics parameters. It was shown that the multiscale model with RVE approach gives accurate fracture mechanics parameters for an interface crack under either thermal or mechanical loads; while significant error was observed when the thin film layers are ignored in the global analysis. The problem of an interface crack between low-k dielectric and etch-stop thin film in a flip-chip package under thermal loading was also investigated as an application example of the multiscale modeling.

Thermal Stress Analysis of Thermally-Enhanced Plastic Ball Grid Array Electronic Packaging

2002 ◽  
Vol 18 (1) ◽  
pp. 9-16 ◽  
Author(s):  
Meng-Kao Yeh ◽  
Kuo-Ning Chiang ◽  
Jiann-An Su
Keyword(s):  
Thermal Stress ◽  
Thermal Cycling ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Ball Grid Array ◽  
Geometric Parameters ◽  
Heat Sinks ◽  
Shear Stresses ◽  
Adhesive Layers

ABSTRACTThe thermally enhanced ball grid array (TEBGA) electronic packaging under thermal cycling and thermal loading was investigated numerically. Two-dimensional finite element analysis by ANSYS was used for calculating the temperature distribution and thermal stress on the symmetric and diagonal cross sections of TEBGA. The thermal failure based on the peel and shear stresses at interfaces of TEBGA took place at the interface between the heat sink and epoxy moulding compound. The Tasi-Hill failure criterion was modified to predict the failure at various interfaces in TEBGA package. The TEBGA geometric parameters, including the thickness of the heat sink, the thickness of the adhesive layer between the heat sink and the die, and the thickness of the reinforcing copper ring, were varied to assess their effects on the failure mode of TEBGA. The results showed that for a TEBGA under thermal cycling, the stress values were reduced for thicker adhesive layers and thinner heat sinks; for a TEBGA under thermal loading, the die-to-ambient thermal resistance of TEBGA decreased for thinner adhesive layers and thicker heat sinks. The slimmer heat sink of extruded plate type can dissipate more heat and can reduce the stress values. Proper choice of geometric parameters of TEBGA package can prevent its failure at interfaces and furthermore, improve the reliability of electronic packaging.

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