Transient Thermal Effects and Heat Partition in Sliding Contacts

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
R. Bosman ◽  
M. B. de Rooij
Keyword(s):  
Steady State ◽  
Thermal Effects ◽  
Continuity Condition ◽  
Contact Temperature ◽  
Maximum Temperature ◽  
Transient Temperature ◽  
Heat Partition ◽  
Transient Thermal ◽  
State Assumption ◽  
Good Agreement

In tribological applications, calculating the contact temperature between contacting surfaces makes it possible to estimate lubricant failure and effectiveness, material failure, and other phenomena. The contact temperature can be divided into two scales: the macroscopic and the microscopic scales. In this article, a semi-analytical transient temperature model is presented, which can be used at both scales. The general theory is presented here and used to calculate the contact temperatures of single micro- and macrocontacts. For the steady state situation, the results obtained are in good agreement with those found in literature. Further, it is shown that the simplification of modeling a microcontact as an equivalent square uniform heat source to simplify the calculation of the maximum temperature is justified in the fully plastic regime. The partition is calculated by setting a continuity condition on the temperature field over the contact. From the results, it can be concluded that at low sliding velocities the steady state assumption, which is often used for microcontacts, is correct. However, at higher sliding velocities, the microcontact is not in the steady state and transient calculation methods are advised.

Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders

2021 ◽  
Author(s):  
Zihao Yuan ◽  
Tao Zhang ◽  
Jeroen Van Duren ◽  
Ayse K. Coskun
Keyword(s):  
Steady State ◽  
Real World ◽  
High Performance ◽  
Silicon Layer ◽  
Maximum Temperature ◽  
Cooling Performance ◽  
Thermal Models ◽  
Heat Spreaders ◽  
Transient Simulations ◽  
Transient Thermal

Abstract Lab-grown diamond heat spreaders are becoming attractive solutions compared to traditional copper heat spreaders due to their high thermal conductivity, the ability to directly bond them on silicon, and allow for an ultra-thin silicon layer. Researchers have developed various thermal models and prototypes of lab-grown diamond heat spreaders to evaluate their cooling performance and heat spreading ability. The majority of existing thermal models are built using finite-element method (FEM) based simulators such as COMSOL and ANSYS. However, such commercial simulators are computationally expensive and lead to long solution times along with large memory requirements. These limitations make commercial simulators unsuitable for evaluating numerous design alternatives or runtime scenarios for real-world high-performance processors. Because of this modeling challenge, none of the existing works have evaluated the thermal behavior of lab-grown diamond heat spreaders on real-world high-performance processors running realistic application benchmarks. Recently, we have developed a parallel compact thermal simulator, PACT, that is able to carry out fast and accurate steady-state and transient thermal simulations and can be extended to support emerging integration and cooling technologies. In this paper, we use PACT to evaluate the steady-state and transient cooling performance of lab-grown diamond heat spreaders against traditional copper heat spreaders on various real-world high-performance processors (e.g., Intel i7 6950X, IBM Power9, and PicoSoC). By using PACT with architectural performance and power simulators such as Sniper and McPAT, we are able to run transient simulations with realistic benchmarks. Simulation results show that lab-grown diamond heat spreaders achieve maximum temperature and thermal gradient reductions of up to 26.73 °C and 13.75 °C when compared to traditional copper heat spreaders, respectively. The maximum steady-state and transient simulation times of PACT for the real-world high-performance chips and realistic applications used in our experiments are 259 s and 22 min, respectively.

Thermal Simulation Benchmark of Graphic Module Under Installed, Operating Conditions

2005 ◽  
Author(s):  
Fariborz Forghan ◽  
Gregory J. Kowalski ◽  
Mansour Zenouzi ◽  
Hameed Metghalchi
Keyword(s):  
Steady State ◽  
Computer Games ◽  
Electronic Device ◽  
Thermal Response ◽  
Thermal Simulation ◽  
Operating Conditions ◽  
Maximum Temperature ◽  
Software Environment ◽  
Transient Thermal ◽  
Graphic Module

The thermal performance of a graphic module on graphic card is theoretically and experimentally investigated. Unlike prior benchmark studies, this study involves a practical electronic device operating in a real software environment. The temperatures at five locations on the module and at one point on the board are measured as a function of time during the operation of a series of computer games. The theoretical model is developed using Flotherm to simulate the transient thermal response. There is close agreement from 3% to 10% between the numerical steady state case prediction and test data. The calculated transient trends using Flotherm model closely agree with experimental results and demonstrate the rapid increase in temperature as the number of module operations increases during the games. The results for the maximum temperature are directly linked to the software operation and exhibit a superposition type behavior in which the observed maximum operating temperature can exceed that estimated by steady state conditions. As expected, the results demonstrate that a carefully constructed thermal simulation can accurately predict the thermal response of a module under actual operating conditions.

Thermomechanical Coupled Analysis of Multidisc Friction Pairs in Hydro-Viscous Drive

2014 ◽  
Vol 941-944 ◽  
pp. 2500-2503
Author(s):  
Jian Zhong Cui ◽  
Cun Tang Wang ◽  
Fang Wei Xie
Keyword(s):  
Normal Pressure ◽  
Maximum Temperature ◽  
Coupled Analysis ◽  
Transient Temperature ◽  
Single Pair ◽  
The Finite Element Method ◽  
Operation Conditions ◽  
Soft Start ◽  
Transient Thermal ◽  
Force Equilibrium

A transient temperature-stress coupled analysis is performed to investigate the thermomechanical coupled analysis of multidisc friction pairs in Hydro-viscous drive under simulated operation conditions. The normal pressure on all the surfaces are obtained from the principle of force equilibrium and then the heat flux acting on the related surface are also deduced. Based on the finite element method, the 3-D transient thermal and thermomechanical models of single pair are established as the typical one. The distribution of thermal and thermomechanical behavior during the soft-start can be studied. The results show that the maximum temperature occurs at the center of each subregion, where hot spots can be observed. The minimum hoop stress distribution can be observed in the separator disk.

scholarly journals Observation and modelling of HO<sub>x</sub> radicals in a boreal forest

2013 ◽  
Vol 13 (11) ◽  
pp. 28561-28629 ◽  
Author(s):  
K. Hens ◽  
A. Novelli ◽  
M. Martinez ◽  
J. Auld ◽  
R. Axinte ◽  
...  
Keyword(s):  
Steady State ◽  
Boreal Forest ◽  
Hydroxyl Radicals ◽  
Chemical Ionization ◽  
Box Model ◽  
Ionization Mass ◽  
Organic Precursor ◽  
Mixing Ratios ◽  
State Assumption ◽  
Good Agreement

Abstract. Measurements of OH and HO2 radicals were conducted in a~pine dominated forest in Southern Finland during the HUMPPA-COPEC-2010 (Hyytiälä United Measurements of Photochemistry and Particles in Air – Comprehensive Organic Precursor Emission and Concentration study) field campaign in summer 2010. Simultaneous side-by-side measurements of hydroxyl radicals were conducted with two instruments using chemical ionization mass spectrometry (CIMS) and laser-induced fluorescence (LIF), indicating good agreement. Subsequently, the LIF instrument was moved to the top of a 20 m tower, just above the canopy, to investigate the radical chemistry at the ecosystem–atmosphere interface. Comprehensive measurements including observations of many VOCs and the total OH reactivity were conducted and analysed using steady-state calculations as well as an observationally constrained box model. Production rates of OH calculated from measured OH precursors are consistent with those derived from the steady state assumption and measured total OH loss under conditions of moderate OH reactivity. The primary photolytic sources of OH contribute up to one third to the total OH production. OH recycling, which occurs mainly by HO2 reacting with NO and O3, dominates the total hydroxyl radical production in this boreal forest. Box model simulations agree with measurements for hydroxyl radicals (OHmod./OHobs. = 1.04 ± 0.16), while HO2 mixing ratios are significantly underpredicted (HO2mod./HO2obs. = 0.3 ± 0.2) and simulated OH reactivity does not match the observed OH reactivity. The simultaneous underprediction of HO2 and OH reactivity in periods in which OH concentrations were simulated well, suggests that the missing OH reactivity is an unaccounted source of HO2. Detailed analysis of the HOx production, loss, and recycling pathways suggests that in periods of high total OH reactivity there are additional recycling processes forming OH directly, not via reaction of HO2 with NO or O3. Nevertheless, a major fraction of the OH recycling occurs via the reaction of HO2 with NO and O3 in this terpene dominated environment.

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

2002 ◽  
Vol 124 (4) ◽  
pp. 419-426 ◽  
Author(s):  
Marc Hodes ◽  
Randy D. Weinstein ◽  
Stephen J. Pence ◽  
Jason M. Piccini ◽  
Lou Manzione ◽  
...  
Keyword(s):  
Steady State ◽  
Phase Change ◽  
Thermal Management ◽  
Phase Change Materials ◽  
Maximum Temperature ◽  
Ir Camera ◽  
Steady State Heat ◽  
Steady State Heat Transfer ◽  
Time Required ◽  
Transient Thermal

The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.

scholarly journals Contact Thermal Analysis and Wear Simulation of a Brake Block

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
Nándor Békési ◽  
Károly Váradi
Keyword(s):  
Thermal Effects ◽  
Simulation Method ◽  
Temperature Dependent ◽  
Wear Analysis ◽  
Thermal Wear ◽  
Braking Process ◽  
Transient Thermal ◽  
Brake Block ◽  
Wheel Brake ◽  
Good Agreement

The present paper describes an experimental test and a coupled contact-thermal-wear analysis of a railway wheel/brake block system through the braking process. During the test, the friction, the generated heat, and the wear were evaluated. It was found that the contact between the brake block and the wheel occurs in relatively small and slowly moving hot spots, caused by the wear and the thermal effects. A coupled simulation method was developed including numerical frictional contact, transient thermal and incremental wear calculations. In the 3D simulation, the effects of the friction, the thermal expansion, the wear, and the temperature-dependent material properties were also considered. A good agreement was found between the results of the test and the calculations, both for the thermal and wear results. The proposed method is suitable for modelling the slowly oscillating wear caused by the thermal expansions in the contact area.

Experimental and Theoretical Analysis of Transient Response of Plate Heat Exchangers in Presence of Nonuniform Flow Distribution

2008 ◽  
Vol 130 (5) ◽  
Author(s):  
N. Srihari ◽  
Sarit K. Das
Keyword(s):  
Steady State ◽  
Heat Exchangers ◽  
Sudden Change ◽  
Temperature Response ◽  
Flow Distribution ◽  
Transient Temperature ◽  
Nonuniform Flow ◽  
Flow Rates ◽  
Plate Heat ◽  
Flow Maldistribution

Transient analysis helps us to predict the behavior of heat exchangers subjected to various operational disturbances due to sudden change in temperature or flow rates of the working fluids. The present experimental analysis deals with the effect of flow distribution on the transient temperature response for U-type and Z-type plate heat exchangers. The experiments have been carried out with uniform and nonuniform flow distributions for various flow rates. The temperature responses are analyzed for various transient characteristics, such as initial delay and time constant. It is also possible to observe the steady state characteristics after the responses reach asymptotic values. The experimental observations indicate that the Z-type flow configuration is more strongly affected by flow maldistribution compared to the U-type in both transient and steady state regimes. The comparison of the experimental results with numerical solution indicates that it is necessary to treat the flow maldistribution separately from axial thermal dispersion during modeling of plate heat exchanger dynamics.

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