Tailorable Thermal Expansion of Lightweight and Robust Dual-Constituent Triangular Lattice Material

2017 ◽  
Vol 84 (10) ◽  
Author(s):  
Kai Wei ◽  
Yong Peng ◽  
Weibin Wen ◽  
Yongmao Pei ◽  
Daining Fang
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Triangular Lattice ◽  
Coefficient Of Thermal Expansion ◽  
Bulk Material ◽  
Structure Design ◽  
Thermally Induced ◽  
Precise Control ◽  
Wide Range ◽  
Lattice Material

Current studies on tailoring the coefficient of thermal expansion (CTE) of materials focused on either exploring the composition of the bulk material or the design of composites which strongly depend on a few negative CTE materials or fibers. In this work, an approach to achieve a wide range of tailorable CTEs through a dual-constituent triangular lattice material is studied. Theoretical analyses explicitly reveal that through rational arrangement of commonly available positive CTE constituents, tailorable CTEs, including negative, zero, and large positive CTEs can be easily achieved. We experimentally demonstrate this approach through CTE measurements of the specimens, which were exclusively fabricated from common alloys. The triangular lattice material fabricated from positive CTE alloys is shown to yield large positive (41.6 ppm/°C), near-zero (1.9 ppm/°C), and negative (−32.9 ppm/°C) CTEs. An analysis of the collapse strength and stiffness ensures the robust mechanical properties. Moreover, hierarchal triangular lattice material is proposed, and with certain constituents, wide range of tailorable CTEs can be easily obtained through the rationally hierarchal structure design. The triangular lattice material presented here integrates tailorable CTEs, lightweight characteristic, and robust mechanical properties, and is very promising for engineering applications where precise control of thermally induced expansion is in urgently needed.

Application of an Epoxy Cap in a Flip-Chip Package Design

1989 ◽  
Vol 111 (1) ◽  
pp. 16-20 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Preliminary Test ◽  
Elastic Stability ◽  
Thermally Induced ◽  
Package Design ◽  
Silicone Gels ◽  
Low Modulus ◽  
Supporting Frame

In order to combine the merits of epoxies, which provide good environmental and mechanical protection, and the merits of silicone gels, resulting in low stresses, one can use an encapsulation version, where a low modulus gel is utilized as a major encapsulant, while epoxy is applied as a protecting cap. Such an encapsulation version is currently under consideration, parallel with a metal cap version, for the Advanced VLSI package design which is being developed at AT&T Bell Laboratories. We recommend that the coefficient of thermal expansion for the epoxy be somewhat smaller than the coefficient of thermal expansion for the supporting frame. In this case the thermally induced displacements would result in a desirable tightness in the cap/frame interface. This paper is aimed at the assessment of stresses, which could arise in the supporting frame and in the epoxy cap at low temperatures. Also, the elastic stability of the cap, subjected to compression, is evaluated. The calculations were executed for the Advanced VLSI package design and for a Solder Test Vehicle (STV), which is currently used to obtain preliminary information regarding the performance of the candidate encapsulants. It is concluded that in order to avoid buckling of the cap, the latter should not be thinner than 15 mils (0.40 mm) in the case of VLSI package design and than 17.5 mils (0.45 mm) in the case of STV. At the same time, the thickness of the cap should not be greater than necessary, both for smaller stresses in the cap and for sufficient undercap space, required for wirebond encapsulation. The obtained formulas enable one to evaluate the actual and the buckling stresses. Preliminary test data, obtained by using STV samples, confirmed the feasibility of the application of an epoxy cap in a flip-chip package design.

Measurement and interpretation of stress in copper films as a function of thermal history

1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal History ◽  
Copper Films ◽  
Thermally Induced ◽  
Aluminum Films ◽  
Interconnection Material ◽  
Interconnect Systems

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.

Reduced Order Finite Element Modeling of Thermally Induced Bearing Loads in Machine Tool Spindles

1999 ◽  
Author(s):  
Alex O. Gibson ◽  
Jeffrey L. Stein
Keyword(s):  
Finite Element ◽  
Thermal Expansion ◽  
Machine Tool ◽  
Mechanical Load ◽  
Machining Process ◽  
Thermally Induced ◽  
Reduced Order ◽  
Wide Range ◽  
Bearing Load ◽  
Bearing Loads

Abstract Machine tool spindle bearings are subjected to a large range of axial and radial loads due to the machining process. Further the rotating spindle must be extremely stiff to minimize the cutting tool’s deflection. The high spindle stiffness is achieved by applying a mechanical load to the bearings, the preload. In fixed preload spindles the bearing loads tend to increase with increasing spindle speed due to thermal expansion and it is well established that these thermally induced loads can lead to premature bearing failure. A model of thermally induced bearing load in angular contact bearing spindles is developed that includes an axis-symmetric reduced order finite element model of the heat transfer and thermal expansion within the spindle’s housing and shaft and the bearing and shaft dynamics. Nodal reduction is used in the reduced order model to minimize the number of temperature states and the computational load. The reduced order model’s calculated temperature and bearing load values are shown to closely match experimentally measured values over a wide range of spindle speeds. The paper ends with a parameter variation study which predicts a dramatic decrease in the thermally induced bearing load when silicon nitride balls are substituted for steel balls.

scholarly journals Characterizing the Performance of Ternary Concrete Mixtures Involving Slag and Metakaolin

2020 ◽  
Vol 5 (2) ◽  
pp. 14
Author(s):  
Matthew S. Sullivan ◽  
Mi G. Chorzepa ◽  
Stephan A. Durham
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Fly Ash ◽  
Coefficient Of Thermal Expansion ◽  
Drying Shrinkage ◽  
Chloride Ion ◽  
Cementitious Materials ◽  
Ternary Mixtures ◽  
Modulus Of Rupture ◽  
Ternary Blends

Ternary blends of cementitious materials are investigated. A cement replacement level of 45% is used for all ternary mixtures consisting of 15% metakaolin and 30% slag replacements. Three metakaolin and two blast furnace slag, referred to as ‘slag’ for short, products commercially available are used to compare performance in ternary blends. A mixture with a 45% fly ash replacement is included to serve as a benchmark for performance. The control mixture contains 422 kg of cement per cubic meter of concrete, and a water-to-cementitious material ratio of 0.43 is used for all mixtures with varying dosages of superplasticizer to retain workability. Mixtures are tested for mechanical properties, durability, and volumetric stability. Mechanical properties include compression, split-cylinder tension, modulus of rupture, and dynamic Young’s modulus. Durability measures are comprised of rapid chloride-ion penetrability, sulfate resistance, and alkali–silica reactivity. Finally, the measure of dimensional stability is assessed by conducting drying shrinkage and coefficient of thermal expansion tests. Results indicate that ternary mixtures including metakaolin perform similarly to the control with respect to mechanical strength. It is concluded that ternary blends perform significantly better than both control and fly ash benchmark in tests measuring durability. Furthermore, shrinkage is reduced while the coefficients of thermal expansion are slightly higher than control and the benchmark.

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

2014 ◽  
Vol 136 (1) ◽  
Author(s):  
Changsoo Jang ◽  
Bongtae Han
Keyword(s):  
Thermal Expansion ◽  
Moisture Content ◽  
Coefficient Of Thermal Expansion ◽  
Measurement Data ◽  
Hybrid Procedure ◽  
Boiling Temperature ◽  
Hygrothermal Behavior ◽  
Expansion Behavior ◽  
Wide Range ◽  
Moisture Conditions

Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to overcome the limitations of the existing methods when used at temperatures above the water boiling temperature. The proposed procedure is implemented to measure the hygrothermal strains of three epoxy molding compounds and a no-filler underfill over a wide range of temperatures including temperatures beyond the water boiling temperature. The effects of moisture content on the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are evaluated from the measurement data. A formulation to predict the Tg change as a function of moisture content is also presented.

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

scholarly journals The Use of Recycled Carpet in Low-Cost Composite Tooling Materials

Recycling ◽  
2019 ◽  
Vol 4 (1) ◽  
pp. 12 ◽  
Author(s):  
Kunal Mishra ◽  
Sarat Das ◽  
Ranji Vaidyanathan
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Value Engineering ◽  
Compressive Properties ◽  
Structural Composites ◽  
Environmental Deterioration ◽  
Composite Tooling

More than 250,000 metric tons (600 million pounds) of carpet are dumped in landfills every year. That creates a significant concern regarding environmental deterioration and economic liability. It is therefore imperative to develop sustainable post-consumer carpet-based products for high-value engineering applications such as composite tooling. To be considered as an acceptable composite tooling material, the composite needs to meet certain required properties such as a low coefficient of thermal expansion, excellent compressive properties, and high a hardness value after repeated exposure to curing cycles. The tooling composites must also exhibit the ability to endure several curing cycles, without deteriorating the mechanical properties. In the present investigation, post-consumer carpet has been recycled in the form of structural composites for tooling applications. The recycled carpet composites have been reinforced with 0.5 wt.% of graphene nanoplatelets to modify the material properties of the carpet composites. The results from compressive and hardness experiments demonstrate that the recycled carpet preserved its mechanical integrity even after several curing cycles. This indicates that recycled carpet composites have the potential to be a low-cost composite tooling alternative for the industry.

Investigation of fatigue behavior of centrifuged series 3000 Al with addition of 26 wt% Cu

2020 ◽  
Vol 234 (10) ◽  
pp. 1375-1385
Author(s):  
Aref Mehditabar ◽  
Seyed E Vahdat ◽  
Gholam-Hossein Rahimi
Keyword(s):  
Electron Microscopy ◽  
Thermal Expansion ◽  
High Performance ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Fatigue Behavior ◽  
Centrifugal Casting ◽  
Image Analyzer ◽  
Casting Technique ◽  
Wide Range

More than 70% of mechanical parts in a wide range of engineering fields fail by fatigue. In addition, centrifugal casting is identified as the most effective casting technique for production of high performance cylindrical parts. In this regard, the present work aims to investigate the fatigue behavior of series 3000 Al with addition of 26 wt% Cu produced through horizontal centrifugal casting method. Microstructure characterizations are precisely studied using scanning transmission electron microscopy and field emission scanning electron microscopy in conjunction with image analyzer software. Also, compressive behavior, hardness, coefficient of thermal expansion, and wear rate ( Wr) are measured applying Zwick Z100, Vickers hardness, DIL 805A/D, and pin-on-disc machines, respectively. The results indicate that the main intermetallic compound is Al2Cu-based particle, and a volume fraction of 31 vol.% is obtained. Besides, the compressive strength of 460 MPa, elastic modulus of 10.986 GPa, hardness of 152 HV, coefficient of thermal expansion of 1.7 × 10−5 1/°C, and wear resistance of 3.3 × 10−6 g/mm2 are measured. Finally, the four-point bending fatigue test is performed and the fatigue ratio of 0.109 at about 106 cycles to failure is obtained.

Rheological and Thermomechanical Properties of Meso and Non-Porous Silica Filled Epoxy Composites

2015 ◽  
Vol 815 ◽  
pp. 67-71
Author(s):  
Gang Li ◽  
Peng Li Zhu ◽  
Tao Zhao ◽  
Rong Sun ◽  
Daniel Lu
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Glass Transition ◽  
Mesoporous Silica ◽  
Coefficient Of Thermal Expansion ◽  
Porous Silica ◽  
Thermomechanical Properties ◽  
Epoxy Composites ◽  
Silica Microspheres ◽  
Silica Filler

In the present study, epoxy based composite filled with meso and non-porous silica microspheres with similar size were prepared respectively and their rheological and thermo-mechanical properties were studied systematically. The results showed that the mesoporous silica/epoxy composites showed much higher viscosity, storage modulus and glass transition temperature (Tg) while lower coefficient of thermal expansion (CTE) than did epoxy composites with nonporous silica particles, which could be attributed to the stronger interface interaction between the mesoporous silica filler with larger specific surface area (BET) and the epoxy matrix.

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