A Novel Micropump for Electronics Cooling

Author(s):  
Vishal Singhal ◽  
Suresh V. Garimella

A novel micropump design for electronics cooling applications capable of integration into microchannel heat sinks is presented. The pumping action is due to the combined action of Coulomb forces due to induction electrohydrodynamics (EHD) and a vibrating diaphragm with nozzle-diffuser elements for flow rectification. A comprehensive numerical model of the micropump accounting for transient charge transport and vibrating diaphragm deformation is developed. Each component of the model is validated by comparing to analytical, numerical or experimental results from the literature. It is shown that the flow rate achieved by the micropump with combined action of EHD and vibrating diaphragm can be higher than the sum of flow rates achieved from the action of the EHD and the vibrating diaphragm, independent of each other.

Author(s):  
Carlo Nonino ◽  
Stefano Savino

Abstract A numerical investigation is carried out on the effects of flow maldistribution on the temperature uniformity and overall thermal resistance in double-layered microchannel heat sinks. Different flow maldistribution models accounting for the effects of some typical header designs are considered together with different combinations of the average inlet velocity in the two layers of microchannels for a given total mass flow rate. The numerical simulations are carried out using an in-house FEM procedure previously developed by the authors for the analysis of cross-flow microchannel heat exchangers.


2015 ◽  
Vol 7 (9) ◽  
pp. 3981-3987 ◽  
Author(s):  
Wen-Chi Lin ◽  
Mark A. Burns

We have constructed micro-fabricated flow sensors that can measure water flow rates of 0.1 to 2.0 gallons per minute (GPM), and the experimental results we obtained are in good agreement with those from COMSOL simulations.


Author(s):  
Ildar F. Akhmadullin ◽  
Randall D. Manteufel ◽  
Christopher Greene

Experimental measurements are reported for high-flow liquid-cooled heat sinks designed for cooling electronics components such as a CPU. The flow rate is up to 2 GPM with internal flow passage length scales on the order of 0.1 to 1.0 mm in the primary heat transfer region. Of the designs tested, three achieved maximum flow rates with pressure drops of less than 1.5 psi. Two have lower maximum flow rates because of higher internal flow resistance. In the experiments, particular attention is given to sources of experimental uncertainty and the propagation of uncertainty through the calculations to reported thermal resistance, R (°C/W). Analysis includes bias and precision errors for direct measurement of temperature, flow rate, and pressure drop. Additionally, a separate thermocouple calibration test is reported to establish measurement uncertainties for the system. Main emphasis is made to the error propagation in thermal resistance calculations of each heat sink and measurement of heat removal rate from the CPU. Data is used to determine the standard error for R which ranges up to about 0.05 °C/W with the maximum for one heat sink up to 0.07 °C/W. Averaging of repeated measurements at the same flow rate without accounting for the range of the original data will result in lower uncertainties in the reported results.


1973 ◽  
Vol 13 (06) ◽  
pp. 311-320 ◽  
Author(s):  
F. Sonier ◽  
O. Ombret

Abstract This paper describes a two-dimensional three-phase numerical model for simulating two- or three-phase coning behavior. The model is fully implicit with respect to all variables and uses the simultaneous solution of the different equations describing multiphase flow. For determining well flow rates from all blocks communicating with the well, particular attention has been paid to the well boundary condition, which is considered to be a physical boundary. The mathematical expression of these well conditions enables flow rates to be calculated in a perfectly implicit manner and thus makes the model very stable so that the computational error in time is very small. The model described is appreciably different in this respect from previous models in which the well is represented by source points and in which the flour terms are calculated by using various simplifications. The results of several tests are presented. The model was checked by the simulation of several water coning cases that had previously been studied on a physical model. Four examples are given here. In these examples, the boundary influx conditions and fluid mobility ratio are made to vary. One of them illustrates the care that must be taken when using simplified solution schemes for the boundary conditions. Introduction Multiphase numerical models have usually employed finite-difference approximations in which relative permeabilities are evaluated explicitly at the beginning of each time step. But simulators of this type are not capable of solving problems characterized by high flow velocities and such phenomena as well coning, except perhaps at phenomena as well coning, except perhaps at extremely high cost. Recently, some papers were published describing a method that employs semi-implicit relative permeabilities and uses the simultaneous solution of multiphase equations. This method is very efficient. In these simulators, the well is represented by source points, and flow rate terms are calculated by using various simplifications (mobility or potential methods). potential methods). This paper describes a new numerical coning model. The numerical part of the model is similar to that in the latest models, but its representation of wellbore conditions is quite different and more nearly expresses physical phenomena caused by end effects. The well is represented full-scale and not by source points. Furthermore, so as not to partially screen out wellbore conditions, the partially screen out wellbore conditions, the producing interval, even if it is small, may be producing interval, even if it is small, may be advantageously represented by several layers. Any condition may be specified for the external boundaries. All the leading physical parameters are treated semi-implicitly. When a flow rate is imposed on the well, taking into account the well-wall boundary conditions, the calculation of production terms is fully implicit. This calculation is iterative, but at almost each time step a simple algorithm enables a direct solution to be obtained. The results of numerous simulations are presented. Studies on physical models have demonstrated the full validity of the numerical model. The simulation of actual field cases shows that the model is very efficient. CONING MODEL The numerical model described in this paper is a two-dimensional one with radial symmetry. A compressible three-phase system is considered, with possible exchange between the gas and oil phases independently of the composition. phases independently of the composition. The introduction of Darcy's law into the continuity equation for each of the three fluids leads to a system of partial differential equations. SPEJ p. 311


Author(s):  
Suresh V. Garimella ◽  
Vishal Singhal

Microchannel heat sinks are widely regarded as being amongst the most effective heat removal techniques from space-constrained electronic devices. However, the fluid flow and heat transfer in microchannels is not fully understood. The pumping requirements for flow through microchannels are also very high and none of the micropumps in the literature are truly suitable for this application. A wide-ranging research program on microchannel heat sinks and micropumps is underway in the Electronics Cooling Laboratory at Purdue University. This article provides an overview of the research being conducted to understand fluid flow and heat transfer in microchannels and to identify pumping requirements and suitable mechanisms for pumping in microchannels.


2020 ◽  
Vol 24 (2 Part A) ◽  
pp. 683-692 ◽  
Author(s):  
Hussain Tariq ◽  
Ahmad Shoukat ◽  
Muhammad Anwar ◽  
Asif Israr ◽  
Hafiz Ali

Thermal performance of micro-hole cellular structure using water as a cool?ing fluid was investigated through CFD and then numerical results were validated with the experimental results. The minimum base temperature for the micro-hole cellular structure was found to be 29.7?C and 32.3?C numerically and experimentally, respectively, with volumetric flow rate of 0.000034 m3/s (2 Lpm) at a heating power of 345 W. Numerical values of the base temperature are in close agreement with experimental results with an error of 8.75%. Previously, the base temperatures of heat sinks using alumina nanofluid with 1% of volumetric concentration and water with volumetric flow rate of 0.000017 m3/s (1 Lpm) have been reported to be 43.9?C and 40.5?C, respectively.


Author(s):  
Takashi Fukue ◽  
Katsuhiro Koizumi ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa

Critical fan performance metric such as characteristic output curves and maximum flow rates are affected by various environmental conditions where cooling fans are installed. This paper describes the relationship between the fan performance and configuration factors such as the flow inlet porosity of electronic enclosure, the flow obstacles which imitate high-density packages and narrow flow area configurations. We installed a test enclosure in front of a test fan and measured P-Q curves of the test fan, which were operated in the enclosure. The experiments, it was observed that the pressure difference was increased in the enclosure by the effects of a wall. We installed a perforated plate in front of the fan as an obstacle and investigated how this changed the P-Q curve. In general, addition of the perforated plate in front of the fan decreased the characteristic output of the fan. On the other hand, the flow rate by the fan supply was decreased by the existence of the narrow inlet or obstacles. When an opening area in front of a fan became smaller than double of the fan flow area, the flow rate was significantly decreased. In addition, it was observed that the maximum flow rate depended on the opening area ratio. Finally, a model for predicting flow rates decreases by the enclosure inlet and obstacles was proposed.


2010 ◽  
Vol 7 (2) ◽  
pp. 90-98
Author(s):  
Pradeep Hegde ◽  
K.N. Seetharamu

Numerical investigations with regard to the thermal characteristics of water cooled single stack and multistack microchannel heat sinks subjected to nonuniform base heating are conducted. Nonuniformities in base heating are accomplished by applying gradually increasing and gradually decreasing base heat fluxes with respect to coolant flow direction in the heat sink. The effects of heat concentration upstream, downstream, and in the center half of the microchannel heat sinks (similar to a hotspot) are also studied. Both parallel flow and counter coolant flow conditions in the heat sink are considered and the results are compared. The results are presented in the form of base temperature distribution and heat sink thermal resistance. The finite element method is used for the analysis.


2021 ◽  
Vol 25 (6 Part A) ◽  
pp. 4181-4187
Author(s):  
Yichi Zhang ◽  
Shinichi Saito ◽  
Yoshishige Tsuchiya ◽  
Yeliang Wang

A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estimation of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm ? 1 cm ? 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resistance of 6.84?C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.


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