Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions

2005 ◽  
Author(s):  
Je-Young Chang ◽  
Unnikrishnan Vadakkan ◽  
Ravi Prasher ◽  
Suzana Prstic
Keyword(s):  
Thermal Performance ◽  
Hot Spots ◽  
Hot Spot ◽  
Heat Pipes ◽  
Air Cooling ◽  
Test Results ◽  
Uniform Heating ◽  
One Dimensional ◽  
Localized Heating ◽  
Phase Change Phenomena

Use of heat pipes (or vapor chambers) is considered as one of the promising technology to extend the capability of air cooling. This paper reports the test results of vapor chambers using two different sets of test heaters (copper post heater and silicon die heater). Experiments were conducted to understand the effects of non-uniform heating conditions on the thermal performance of vapor chambers. In contrast to the copper post heater which provides ideal heating condition, silicon chip package was developed to replicate more realistic heat source boundary conditions of microprocessors. The chip contains three metallic heaters: a 10 × 12 mm heater in order to provide uniform heating, a 10 × 3 mm heater in order to simulate a localized heating, and a 400 × 400 μm heater in order to simulate the hot spots on actual microprocessors. In the experiment, the highest heat flux from the hotspot heater was approximately 690 W/cm2. Test results indicated that both conduction heat transfer and phase-change phenomena played key roles in the evaporator. The study found that the evaporator resistance was almost insensitive to non-uniform heating conditions, but was clearly dependent on the amount of power applied over the die area. In addition, a simple one-dimensional thermal model was developed to predict the performance of vapor chambers for non-uniform heating conditions and the results were compared against experiments.

Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions

2008 ◽  
Vol 130 (12) ◽  
Author(s):  
Je-Young Chang ◽  
Ravi S. Prasher ◽  
Suzana Prstic ◽  
P. Cheng ◽  
H. B. Ma
Keyword(s):  
Heat Flux ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Hot Spots ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Nonuniform Heating ◽  
Test Results ◽  
Uniform Heating

This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions (hot spots) on the evaporative thermal performance of vapor chambers. In contrast to the copper post heater, which provides ideal heating, a silicon chip package was developed to replicate more realistic heat source boundary conditions of microprocessors. The vapor chambers were tested for hot spot heat fluxes as high as 746 W/cm2. The experimental results show that evaporator thermal resistance is not sensitive to nonuniform heat conditions, i.e., it is the same as in the uniform heating case. In addition, a model was developed to predict the effective thickness of a sintered-wick layer saturated with water at the evaporator. The model assumes that the pore sizes in the sintered particle wick layer are distributed nonuniformly. With an increase of heat flux, liquid in the larger size pores are dried out first, followed by drying of smaller size pores. Statistical analysis of the pore size distribution is used to calculate the fraction of the pores that remain saturated with liquid at a given heat flux condition. The model successfully predicts the experimental results of evaporative thermal resistance of vapor chambers for both uniform and nonuniform heat fluxes.

Hot Spots from Dislocation Pile-up Avalanches

2005 ◽  
Vol 896 ◽  
Author(s):  
William Grisé
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Energetic Material ◽  
Shear Banding ◽  
Dislocation Dynamics ◽  
Circular Loop ◽  
Dislocation Mechanics ◽  
Pile Up ◽  
Localized Heating ◽  
Realistic Assessment

AbstractThe model of localized adiabatic heating associated with release of a dislocation pile-up avalanche is described and re-evaluated. The model supplies a fundamental explanation of shear banding behavior in metal and non-metal systems. Now, a dislocation dynamics description is provided for more realistic assessment of the hot spot heating, for both straight dislocation pile-ups and circular loop pile-ups. Such a localized heating effect was overestimated in the earlier work, in part, to show the dramatic enhancement of the work rate, and the corresponding temperature build-up, potentially occurring in the initial pile-up release, say, at achievement of the critical dislocation mechanics-based stress intensity for cleavage. Proposed applications are to potentially brittle metal, ionic, and energetic material systems.

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

2005 ◽  
Author(s):  
Ioan Sauciuc ◽  
Ravi Prasher ◽  
Je-Young Chang ◽  
Hakan Erturk ◽  
Gregory Chrysler ◽  
...  
Keyword(s):  
Power Density ◽  
Thermal Performance ◽  
Hot Spot ◽  
Average Power ◽  
Building Blocks ◽  
Thermal Design ◽  
Air Cooling ◽  
Back Side ◽  
Two Phase ◽  
Density Factor

Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and development focus for future non air-cooling technologies. This paper presents the thermal performance capability for enabling and package based cooling technologies using a range of “reasonable” boundary conditions. In the enabling area a few key main building blocks are considered: air cooling, high conductivity materials, liquid cooling (single and two-phase), thermoelectric modules integrated with heat pipes/vapor chambers, refrigeration based devices and the thermal interface materials performance. For package based technologies we present only the microchannel building block (cold plate in contact with the back-side of the die). It will be shown that as the hot spot density factor increases, package based cooling technologies should be considered for more significant cooling improvements. In addition to thermal performance, a summary of the key technical challenges are presented in the paper.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

scholarly journals Autoignitions and detonations in engines and ducts

2012 ◽  
Vol 370 (1960) ◽  
pp. 689-714 ◽  
Author(s):  
Derek Bradley
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Burning Velocity ◽  
Turbulent Flame ◽  
Laminar Flames ◽  
Transverse Waves ◽  
One Dimensional ◽  
Gasoline Engines ◽  
Turbulent Burning Velocity ◽  
Autoignition Engines

The origins of autoignition at hot spots are analysed and the pressure pulses that arise from them are related to knock in gasoline engines and to developing detonations in ducts. In controlled autoignition engines, autoignition is benign with little knock. There are several modes of autoignition and the existence of an operational peninsula, within which detonations can develop at a hot spot, helps to explain the performance of various engines. Earlier studies by Urtiew and Oppenheim of the development of autoignitions and detonations ahead of a deflagration in ducts are interpreted further, using a simple one-dimensional theory of the generation of shock waves ahead of a turbulent flame. The theory is able to indicate entry into the domain of autoignition in an ‘explosion in the explosion’. Importantly, it shows the influence of the turbulent burning velocity, and particularly its maximum attainable value, upon autoignition. This value is governed by localized flame extinctions for both turbulent and laminar flames. The theory cannot show any details of the transition to a detonation, but regimes of eventually stable or unstable detonations can be identified on the operational peninsula. Both regimes exhibit transverse waves, triple points and a cellular structure. In the case of unstable detonations, transverse waves are essential to the continuing propagation. For hazard assessment, more needs to be known about the survival, or otherwise, of detonations that emerge from a duct into the same mixture at atmospheric pressure.

Hot Spot Cooling and Harvesting CPU Waste Heat Using Thermoelectric Modules

2014 ◽  
Author(s):  
Soochan Lee ◽  
Patrick E. Phelan ◽  
Carole-Jean Wu
Keyword(s):  
Energy Consumption ◽  
Hot Spots ◽  
Waste Heat ◽  
Hot Spot ◽  
Heat Energy ◽  
High Heat Flux ◽  
Air Cooling ◽  
Thermoelectric Coolers ◽  
Thermoelectric Modules ◽  
Spot Cooling

The increasing integration of high performance processors and dense circuits in current computing devices has produced high heat flux in localized areas (hot spots) that limits their performance and reliability. To control the hot spots on a CPU, many researchers have focused on active cooling methods such as thermoelectric coolers (TECs) to avoid thermal emergencies. This paper presents the optimized thermoelectric modules on top of the CPU combined with a conventional air-cooling device to reduce the hot spot temperature and at the same time harvest waste heat energy generated by the CPU. To control the temperature of the hot spots, we attach small-sized TECs to the CPU and use thermoelectric generators (TEGs) placed on the rest of the CPU to convert waste heat energy into electricity. This study investigates design alternatives with an analytical model considering the non-uniform temperature distribution based on two-node thermal networks. The results indicate that we are able to attain more energy from the TEGs than energy consumption for running the TECs. In other words, we can allow the harvested heat energy to be reused to power other components and reduce hot spots simultaneously. Overall, the idea of simultaneous hot spot cooling and waste heat harvesting using thermoelectric modules on a CPU is a promising method to control the problem of heat generation and to reduce energy consumption in a computing device.

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Hot Spots ◽  
High Performance ◽  
Thermal Environment ◽  
Hot Spot ◽  
Air Cooling ◽  
Multicore Processor ◽  
Temperature Contrast ◽  
On Chip ◽  
Heat Spreading ◽  
Level Analysis

The objective of this study is to understand the effects of various parameters involved in the chip design and cooling on the occurrence of hot spots on a multicore processor chip. The thermal environment for the die is determined by the cooling design which differs distinctly between different classes of electronic equipment. In the present study, like many other hot spot studies, the effective heat transfer coefficient represents the thermal environment for the die, but, its representative values are derived for different cooling schemes in order to examine in what classes of electronic equipment the hot spot concern grows. The cooling modes under study are high-performance air-cooling, high-performance liquid-cooling, conventional air-cooling, and oil-cooling in infrared radiation (IR) thermography setup. Temperature calculations were performed on a model which is designed to facilitate the study of several questions that have not been fully addressed in the existing literature. These questions are concerned with the granularity of power and temperature distributions, thermal interactions between circuits on the die, the roles of on-chip wiring layer and the buried dioxide in heat spreading, and the mechanism of producing temperature contrast across the die. The main results of calculations are the temperature of the target spot and the temperature contrast across the die. Temperature contrasts are predicted in a range 10–25 K, and the results indicate that a major part of the temperature contrast is formed at a granularity corresponding to the size of functional units on actual microprocessor chips. At a fine granularity level and under a scenario of high power concentration, the on-chip wiring layer and the buried oxide play some roles in heat spreading, but their impact on the temperature is generally small. However, the details of circuits need to be taken into account in future studies in order to investigate the possibility of nanometer-scale hot spots. Attention is also called to the need to understand the effect of temperature nonuniformity on the processor performance for which low temperature at inactive cells makes a major contribution. In contrast to the situation for the die under forced convection cooling, the die in passively cooled compact equipment is in distinctly different thermal environment. Strong thermal coupling between the die and the system structure necessitates the integration of package and system level analysis with the die-level analysis.

Thermal performance of sheet steel walls exposed to fire

1984 ◽  
Vol 11 (2) ◽  
pp. 346-351
Author(s):  
K. H. Bardell
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Sheet Steel ◽  
Heat Transfer Analysis ◽  
Small Scale ◽  
Fire Tests ◽  
Test Results ◽  
Wall Surface ◽  
One Dimensional ◽  
Insulation Thickness

Unexposed wall surface temperatures are used to determine spatial fire separation requirements for buildings.A series of 10 small-scale fire tests of insulated sheet steel walls was conducted to study the influence of wall fastening details, surface ventilation, and insulation thickness on these temperatures.Test results showed that thermal performance is affected by all three parameters, in particular insulation thickness. A one-dimensional heat transfer analysis and an empirical formula predicted test results accurately.La température de surface des murs non exposés est utilisée pour déterminer les exigences de résistance au feu requises dans les bâtiments.

Spatial Hotspot Analysis of Bucharest’s Urban Heat Island (UHI) Using Modis Data

2018 ◽  
Vol 18 (1) ◽  
pp. 14-22 ◽  
Author(s):  
Georgiana Grigoraș ◽  
Bogdan Urițescu
Keyword(s):  
Surface Temperature ◽  
Air Temperature ◽  
Land Surface Temperature ◽  
Hot Spots ◽  
Land Surface ◽  
Hot Spot ◽  
Monitoring Network ◽  
Residential Areas ◽  
Hotspot Analysis ◽  
The City

Abstract The aim of the study is to find the relationship between the land surface temperature and air temperature and to determine the hot spots in the urban area of Bucharest, the capital of Romania. The analysis was based on images from both moderate-resolution imaging spectroradiometer (MODIS), located on both Terra and Aqua platforms, as well as on data recorded by the four automatic weather stations existing in the endowment of The National Air Quality Monitoring Network, from the summer of 2017. Correlation coefficients between land surface temperature and air temperature were higher at night (0.8-0.87) and slightly lower during the day (0.71-0.77). After the validation of satellite data with in-situ temperature measurements, the hot spots in the metropolitan area of Bucharest were identified using Getis-Ord spatial statistics analysis. It has been achieved that the “very hot” areas are grouped in the center of the city and along the main traffic streets and dense residential areas. During the day the "very hot spots” represent 33.2% of the city's surface, and during the night 31.6%. The area where the mentioned spots persist, falls into the "very hot spot" category both day and night, it represents 27.1% of the city’s surface and it is mainly represented by the city center.

The family Orthotrichaceae (Bryophyta) in flora of Russia: results of revision and biogeographical review

2018 ◽  
Vol 52 (2) ◽  
pp. 519-534 ◽  
Author(s):  
V. E. Fedosov
Keyword(s):  
Hot Spots ◽  
Latitudinal Gradient ◽  
Hot Spot ◽  
Spatial Differentiation ◽  
Taxonomic Composition ◽  
Undescribed Species ◽  
Longitudinal Gradient ◽  
Biogeographic Pattern ◽  
The Family ◽  
North Pacific Region

Recent studies on Orthotrichoid mosses in Russia are summarized genus by genus. Orthotrichum furcatum Otnyukova is synonymized with Nyholmiella obtusifolia. Orthotrichum vittii is excluded from the Russian moss flora. Description of O. dagestanicum is amended. Fifty four currently recognized species from 9 genera of the Orthotrichaceae are presently known to occur in Russia; list of species with common synonyms and brief review of distribution in Russia is presented. Numerous problematic specimens with unresolved taxonomy were omitted for future. Revealed taxonomical inconsistencies in the genera Zygodon, Ulota, Lewinskya, Nyholmiella, Orthotrichum are briefly discussed. Main regularities of spatial differentiation of the family Orthotrichaceae in Russia are considered. Recently presented novelties contribute to the certain biogeographic pattern, indicating three different centers of diversity of the family, changing along longitudinal gradient. Unlike European one, continental Asian diversity of Orthotrichaceae is still poorly known, the Siberian specimens which were previously referred to European species in most cases were found to represent other, poorly known or undescribed species. North Pacific Region houses peculiar and poorly understood hot spot of diversity of Orthotrichoid mosses. Thus, these hot spots are obligatory to be sampled in course of revisions of particular groups, since they likely comprise under-recorded cryptic- or semi-cryptic species. Latitudinal gradient also contributes to the spatial differentiation of the revealed taxonomic composition of Orthotrichaceae.

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