The Coupling Between Densification and Optical Heating in Intense Pulsed Light Sintering of Silver Nanoparticles

2016 ◽  
Author(s):  
Shalu Bansal ◽  
Chih-Hung Chang ◽  
Rajiv Malhotra
Keyword(s):  
Metallic Nanoparticles ◽  
High Speed ◽  
Flexible Substrate ◽  
High Energy ◽  
Intense Pulsed Light ◽  
Xenon Lamp ◽  
Pulsed Light ◽  
Ambient Conditions ◽  
Nanoparticle Deposition ◽  
Thermal Sintering

Sintering of nanoparticles deposited onto rigid or flexible substrate is required for many devices that use continuous and patterned thin films. An emerging need in this area is to perform nanoparticle sintering under ambient conditions, at high speeds, and with throughput that is compatible with high speed nanoparticle deposition techniques. Intense Pulsed Light sintering (IPL) uses a high energy, broad area and broad spectrum beam of xenon lamp light to sinter metallic and non-metallic nanoparticles. The capability of IPL to meet the above needs has been demonstrated. This paper experimentally examines temperature evolution and densification during IPL. It is shown, for the first time, that temperature rise and densification in IPL are related to each other. A coupled optical-thermal-sintering model on the nanoscale is developed, to understand this phenomenon. This model is used to show that the change in nanoscale shape of the nanoparticle ensemble due to sintering, reduces the optically induced heating as the densification proceeds, which provides a better explanation of experimental observations as compared to current models of IPL. The implications of this new understanding on the performance of IPL are also discussed.

Effect of Size Distribution on Optical Absorption During Intense Pulsed Light Sintering of Metal Nanoparticles

2018 ◽  
Author(s):  
Harish Devaraj ◽  
Hyun-Jun Hwang ◽  
Rajiv Malhotra
Keyword(s):  
Optical Absorption ◽  
Metal Nanoparticles ◽  
Size Distribution ◽  
Metallic Nanoparticles ◽  
Bimodal Distribution ◽  
High Energy ◽  
Intense Pulsed Light ◽  
Nanoparticle Size ◽  
Xenon Lamp ◽  
Pulsed Light

Intense pulsed light sintering (IPL) of nanoparticles on rigid or flexible substrates enables rapid fabrication of thin films and patterns over large areas. In IPL, visible light from a high energy xenon lamp is absorbed by the nanoparticles for rapid sintering of metallic and non-metallic nanoparticles. This plasmonic optical absorption during the process for metal nanoparticles has been shown to depend on individual nanoparticle size. However, but there is little understanding of how this absorption depends on nanoparticle size distribution during IPL. This work incorporates a fully three-dimensional packing model along with an electromagnetic model of plasmonic absorption in silver nanoparticles to bridge this gap. It is shown that smaller standard deviation in a unimodal distribution and smaller size ratios in a bimodal distribution demonstrate relatively higher optical absorption in IPL.

scholarly journals Fabrication of solderable intense pulsed light sintered hybrid copper for flexible conductive electrodes

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yong-Rae Jang ◽  
Robin Jeong ◽  
Hak-Sung Kim ◽  
Simon S. Park
Keyword(s):  
Flexible Substrate ◽  
Intense Pulsed Light ◽  
Pulsed Light ◽  
Spectroscopy Analysis ◽  
Multifaceted Approach ◽  
Printed Circuits ◽  
Tensile Tester ◽  
Optical Profilometer ◽  
High Roughness ◽  
Section Analysis

AbstractAdditively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.

Rapid thermal annealing of CH3NH3PbI3 perovskite thin films by intense pulsed light with aid of diiodomethane additive

2018 ◽  
Vol 6 (20) ◽  
pp. 9378-9383 ◽  
Author(s):  
Krishnamraju Ankireddy ◽  
Amir H. Ghahremani ◽  
Blake Martin ◽  
Gautam Gupta ◽  
Thad Druffel
Keyword(s):  
Thin Films ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Alkyl Halide ◽  
Intense Pulsed Light ◽  
Device Performance ◽  
Pulsed Light ◽  
Ambient Conditions

Perovskite thin films are thermally annealed using a rapid intense pulsed light technique enabled by an alkyl halide that collectively improves device performance when processed in ambient conditions.

The biophysics of photothermal treatments with lasers and intense pulsed light systems

2021 ◽  
Vol 10 (Sup2) ◽  
pp. 40-43
Author(s):  
Mike Murphy
Keyword(s):  
Clinical Outcomes ◽  
High Energy ◽  
Intense Pulsed Light ◽  
Pulsed Light ◽  
Energy Devices ◽  
Good Grasp

Lasers and intense pulsed lights are commonly used for many skin applications today. An understanding of the basic biophysics is essential to achieve good clinical outcomes. Yet, the author's training experiences demonstrate that many users do not have a good grasp of some of these concepts. In this article, Mike Murphy will address these issues, and the most important parameters that need to be considered when treating the skin with high-energy devices will be identified

Ultra-High-Speed Intense Pulsed-Light Irradiation Technique for High-Performance Zinc Oxynitride Thin-Film Transistors

2019 ◽  
Vol 11 (4) ◽  
pp. 4152-4158 ◽  
Author(s):  
Hyun-Jun Jeong ◽  
Hyun-Mo Lee ◽  
Chung-Hyeon Ryu ◽  
Eun-Jae Park ◽  
Ki-Lim Han ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
High Speed ◽  
High Performance ◽  
Intense Pulsed Light ◽  
Light Irradiation ◽  
Pulsed Light ◽  
Ultra High Speed

Intense Pulsed Light Sintering of Inkjet Printed Silver Nanoparticle Ink: Influence of Flashing Parameters and Substrate

2015 ◽  
Vol 1761 ◽  
Author(s):  
Dana Weise ◽  
Kalyan Yoti Mitra ◽  
Enrico Sowade ◽  
Reinhard R. Baumann
Keyword(s):  
Printed Electronics ◽  
Liquid Films ◽  
Post Treatment ◽  
Intense Pulsed Light ◽  
Flexible Substrates ◽  
Pulsed Light ◽  
High Dependency ◽  
Functional Patterns ◽  
Poly Ethylene ◽  
Thermal Sintering

ABSTRACTInkjet printing of various nanoparticle inks, made from silver or copper nanoparticles, and its transformation into solid functional patterns is of high interest in the field of printed electronics. Liquid materials can be deposited as defined patterns in selected areas with micrometer precision. To convert these printed liquid films, consisting of solvents, additives and nanoparticles, into solid functional patterns a post-treatment is required. To this date, many investigations report on various sintering techniques to achieve e.g. high conductivity from the printed conductive materials.Direct thermal sintering (via furnace or hotplate) requires high temperatures, which makes it not suitable for sensitive polymeric substrates. The novel method of intense pulsed light (IPL) sintering opens the window of opportunity to convert liquid or dried metal layers into solid functional layers within milliseconds without damaging the thermally fragile polymeric substrate.In this work we present and analyze the application of the IPL sintering on inkjet printed silver patterns on various flexible substrates, like Poly(ethylene naphthalate) (PEN), Poly(ethylene terephthalate) (PET), Polyimide (PI) foils and paper.A high dependency of the electrical and structural performance of the printed silver layers on the base substrate was observed when flashing with the IPL technique. Flashing parameters were varied and the resulting sheet resistance is presented.With the analytical comparison of optical and electrical results, the flashing settings could be adapted to achieve highly conductive inkjet printed silver patterns on flexible substrates, when compared to other thermal sintering techniques. Furthermore the first integration of this post treatment methodology into semi-industrial roll-2-roll processing was successfully performed and will be demonstrated.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

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