Low resistivity body‐centered cubic tantalum thin films as diffusion barriers between copper and silicon

1992 ◽  
Vol 10 (5) ◽  
pp. 3318-3321 ◽  
Author(s):  
Philip Catania ◽  
James P. Doyle ◽  
Jerome J. Cuomo
Author(s):  
N. Rozhanski ◽  
V. Lifshitz

Thin films of amorphous Ni-Nb alloys are of interest since they can be used as diffusion barriers for integrated circuits on Si. A native SiO2 layer is an effective barrier for Ni diffusion but it deformation during the crystallization of the alloy film lead to the appearence of diffusion fluxes through it and the following formation of silicides. This study concerns the direct evidence of the action of stresses in the process of the crystallization of Ni-Nb films on Si and the structure of forming NiSi2 islands.


2016 ◽  
Vol 4 (2) ◽  
pp. 407-415 ◽  
Author(s):  
Nicholas P. Chadwick ◽  
Emily N. K. Glover ◽  
Sanjayan Sathasivam ◽  
Sulaiman N. Basahel ◽  
Shaeel A. Althabaiti ◽  
...  

Combinatorial AACVD has achieved the production of various niobium/nitrogen co-doped TiO2 materials in a single film. The co-doping concentrations have been correlated with functional properties.


1995 ◽  
Vol 387 ◽  
Author(s):  
M. J. O'Keefe ◽  
C. L. Cerny

AbstractPhysical vapor deposition of Group VI elements (Cr, Mo, W) can lead to the formation of a metastable A-15 crystal structure under certain processing conditions. Typically, a thermally induced transformation of the metastable A-15 structure into the equilibrium body centered cubic structure has been accomplished by conventional furnace annealing at T/Tm ≈ 0.3 from tens of minutes to several hours. In this study we report on the use of rapid thermal annealing to transform sputter deposited A- 15 crystal structure tungsten and chromium thin films into body centered cubic films within the same temperature range but at times on the order of one minute. The minimum annealing times and temperatures required for complete transformation of the A-15 phase into the BCC phase varied from sample to sample, indicating that the transformation was dependent on the film characteristics. The electrical resistivity of A-15 Cr and W films was measured before and after rapid thermal annealing and was found to significantly decrease after transformation into the body center cubic phase.


2021 ◽  
Vol 102 (3) ◽  
pp. 95-111
Author(s):  
Sreeram Sundaresh ◽  
Shraddha Dhanraj Nehate ◽  
Kalpathy B. Sundaram

2003 ◽  
Vol 220 (1-4) ◽  
pp. 349-358 ◽  
Author(s):  
Shun-Tang Lin ◽  
Yu-Lin Kuo ◽  
Chiapyng Lee

2011 ◽  
Vol 61 (3) ◽  
pp. 565-569 ◽  
Author(s):  
Yang Ren ◽  
Gaoyang Zhao ◽  
Chenxi Zhang ◽  
Yuanqing Chen

2018 ◽  
Vol 18 (12) ◽  
pp. 8333-8336 ◽  
Author(s):  
Guangde Wang ◽  
Xinyu Zhang ◽  
Wenlong Jiang ◽  
Lizhong Wang

The AZO transparent conductive films are prepared by the atomic layer deposition (ALD) at a low temperature of 150 °C. The different Al–Zn doping ratios were designed during the deposition. The phase structure of the films was characterized by XRD, the electrical properties of thin films were analyzed by the Holzer test, and the optical properties of thin films were analyzed by the UV-3600 (UV-VIS-NIR) spectrophotometer. The results showed that all the films preferred the orientation of the C axis during the growth process, the AZO films have a very low resistivity of 6.955×10−4 Ω·cm with the Al doping ratio by 2%, the deposition temperature is 150 °C and the thickness of the film is 200 nm. The transmission of AZO films with the different doping ratios in the visible region is 85%. The proper doping ratio can be selected to get the excellent photoelectric properties of AZO thin films. Such low resistivity AZO transparent conductive film is expected to replace the ITO as the transparent electrode for the organic light-emitting devices and the other new generation of the optoelectronic devices.


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