DLTS AS A LOCAL PROBE OF CONCENTRATION AND DEPTH OF TRAP LEVELS

1994 ◽  
Vol 08 (13) ◽  
pp. 1765-1779 ◽  
Author(s):  
V. NÁDAŽDY ◽  
I. THURZO

Complementarity of the capacitance and charge deep level transient spectroscopy (DLTS) is the idea which led us to an advanced method for profiling trap levels in semiconductors. This unifying approach to the space-charge spectroscopy, on grounds of applying the small-amplitude-filling pulse mode and evaluating the trapped charge balance, allows one to implement it in practice while using currently available instrumentation. A simple formalism is sufficient to obtain the demanded trap level depth. The usefulness of this method is demonstrated on bulk traps found in two different metal-insulator-semiconductor (MIS) capacitors. We propose also a new experimental technique providing the option of a direct determination of the trap depth from a single temperature scan. In addition, we found an expression for the relative detection sensitivity of the capacitance DLTS and justified quantitatively the earlier reported improved relative sensitivity of the charge transient spectroscopy.

2002 ◽  
Vol 719 ◽  
Author(s):  
C. B. Soh ◽  
D. Z. Chi ◽  
H. F. Lim ◽  
S. J. Chua

AbstractIn this paper, deep level defects in undoped and Si–doped GaN have been studied using digital deep level transient spectroscopy. Common trap levels at Ec -ET ∼ 0.15-0.20 eV and 0.59-0.62 eV were detected for both undoped and Si-doped samples. For the doped samples, three additional defect levels at Ec-Et ∼ 0.11, 0.28, and 0.45 eV were detected. The concentration of the 0.15-0.20 eV was found to be much higher in undoped GaN that also shows higher dislocation density. Based on this correlation and the logarithmic capture behavior observed for this level, indicative of extended defect nature, we attribute the 0.15-0.20 eV level to dislocation related defects. On the other hand, the 0.28 and 0.45eV trap levels are tentatively attributed to Sirelated defects simply due to the fact that these two levels were observed only in Si-doped GaN. The 0.11eV trap level, which exhibits an exponential capture kinetic, is believed to be related to nitrogen vacancies.


1997 ◽  
Vol 484 ◽  
Author(s):  
A. Y. Du ◽  
M. F. Li ◽  
T. C. Chong ◽  
Z. Zhang

AbstractDislocations and traps in MBE grown p-InGaAs/GaAs lattice-mismatched heterostructures are investigated by Cross-section Transmission Electron Microscopy (XTEM), Deep Level Transient Spectroscopy (DLTS) and Photo-luminescence (PL). The misfit dislocations and the threading dislocations observed by XTEM in different samples with different In mole fractions and different InGaAs layer thickness generally satisfy the Dodson-Tsao's plastic flow critical layer thickness curve. The threading dislocations in bulk layers introduce three hole trap levels HI, H2 and H5 with DLTS activation energies of 0.32 eV, 0.40 eV, 0.88 eV, respectively, and one electron trap El with DLTS activation energy of 0.54 eV. The misfit dislocations in relaxed InGaAs/GaAs interface induce a hole trap level H4 with DLTS activation energy between the range of 0.67–0.73 eV. All dislocation induced traps are nonradiative recombination centers which greatly degrade the optical property of the InGaAs/GaAs layers.


2003 ◽  
Vol 764 ◽  
Author(s):  
C. B. Soh ◽  
J. Zhang ◽  
D.Z. Chi ◽  
S. J. Chua

AbstractIn this paper, deep level defects in high quality continuous GaN films grown over a cracked Si-doped GaN template has been studied using digital deep level transient spectroscopy (DLTS) and transmission electron microscopy (TEM). From TEM observation, it is found that the density of pure screw dislocations have been effectively suppressed while pure edge dislocations remained in substantial quantity. From DLTS measurement, trap levels at Ec -ET ∼ 0.11-0.12 eV, 0.24-0.27 eV, 0.60-0.63 eV were detected in the high quality GaN layer. DLTS measurement was also carried out on the underlying cracked Si-doped GaN template after the top high quality continuous GaN film was removed by plasma etching. An additional defect level at Ec-Et ∼ 0.37 eV was detected which we attributed to defect decoration at screw dislocation. Both the trap levels Ec-ET ∼ 0.24–0.27 eV, 0.60-0.63 eV are believed to originate from mixed screw/edge dislocation based on observation of the logarithmic capture behavior. Trap level at Ec -ET ∼ 0.24-0.27eV, however, experiences a more drastic increase in transient capacitance (i.e. in trap concentration) compared to that of Ec -ET ∼ 0.60-0.63 eV after plasma etching, illustrating that the latter is related to a higher proportion of edge dislocation. The 0.11-0.12 eV trap level, which exhibits an exponential capture kinetic, is believed to be related to nitrogen vacancies. This high quality continuous GaN layer can be used as a template to grow any device structure and the underneath cracked Si-doped GaN layer may help to release stress for the top continuous GaN layer. This can bring about a cracked free epilayer for subsequent device fabrication.


1995 ◽  
Vol 378 ◽  
Author(s):  
C. W. Nam ◽  
S. Ashok

AbstractSi wafers subject to short-time (4–12 min.), low-temperature atomic hydrogen cleaning in an electron cyclotron resonance (ESR) plasma system have been annealed subsequently in the temperature range 300–750 °C for 20 mins. While only a small broad peak is seen immediately after hydrogenation, several pronounced and distinct majority carrier trap levels show up in deep level transient spectroscopy (DLTS) measurements of subsequently fabricated Schottky diodes on samples annealed at 450 °C and above. The concentrations of these deep levels reach a maximum at anneal temperatures around 500 °C and drop substantially beyond 750 °C. This phenomenon appears to be unrelated to the presence of oxygen in Si and is of potential importance in silicon processing technology.


1999 ◽  
Vol 572 ◽  
Author(s):  
A P Knights ◽  
D J Morrison ◽  
N G Wright ◽  
C M Johnson ◽  
A G O'Neill ◽  
...  

ABSTRACTThe edge termination of SiC by the implantation of an inert ion species is used widely to increase the breakdown voltage of high power devices. We report results of the edge termination of Schottky barrier diodes using 30keV Ar+ ions with particular emphasis on the role of postimplant, relatively low temperature, annealing. The device leakage current measured at 100V is increased from 2.5nA to 7μA by the implantation of 30keV Ar+ ions at a dose of 1×1015 cm−2. This is reduced by two orders of magnitude following annealing at 600°C for 60 seconds, while a breakdown voltage in excess of 750V is maintained. The thermal evolution of the defects introduced by the implantation was monitored using positron annihilation spectroscopy (PAS) and deep-level-transient spectroscopy (DLTS). While a concentration of open-volume defects in excess of 1×1019cm−3 is measured using PAS in all samples, electrically active trapping sites are observed at concentrations ∼1×1015cm−3 using DLTS. The trap level is well-defined at Ec−Et = 0.9eV.


2008 ◽  
Vol 1108 ◽  
Author(s):  
Junjiroh Kikawa ◽  
Yuki Horiuchi ◽  
Eiji Shibata ◽  
Masamitsu Kaneko ◽  
Hirotaka Otake ◽  
...  

AbstractInterface states produced at the interface between an insulator and GaN semiconductor determine the performance of GaN metal-insulator-semiconductor (MIS) field effect transistors. Therefore, it is important to know details of interface states characteristics to improve device performances. For above purpose, we have fabricated GaN MIS capacitors, then carried out capacitance-voltage (CV) and deep level transient spectroscopy (DLTS) measurements, and analyzed the obtained results in detail.Wafers used in this study were n-type GaN grown on sapphire substrates by metal organic chemical vapor deposition. A film of SiN was deposited as an insulating layer using electron-cyclotron-resonance plasma-assisted deposition at room temperature, then samples were annealed at 400, 600 or 800°C in N2 atmosphere for 10 min.CV measurements were performed for all the samples at various frequencies and bias sweep rates in the dark condition. CV curves of all the samples exhibited ledges in the curves. Here, ledge indicates a region of which capacitance is independent of applied bias. Although each sample was annealed at each different temperature, it was observed at the same surface potential for all the samples. This result indicates that the Fermi level of the GaN/SiN interface is pinned by a particular trap. In addition, the shape of the CV curve depended on both frequency and bias sweep rate, and it was not observed in the results obtained by a quasi-static capacitance voltage measurement. This can be explained that the shape of ledge is determined by the quasi-equilibrium between a filling rate of traps and a bias sweep rate or test frequency.In the positive bias region of the ledge, a hysteresis window of the CV curve had some dependence on frequency but little dependence on bias sweep rate. On the other hand, in the negative bias region of the ledge, it had little dependence on frequency but obvious dependence on bias sweep rate. These dependences indicate two different traps and related to the ledge formation. The trap energy level related to the sweep rate dependence is estimated to be 0.34 eV by the temperature dependence of the width of hysteresis window.Deep level transient spectroscopy measurements were carried out to characterize the trap levels observed in the CV curves. Trap levels with activation energies of 0.32 and 0.78 eV were observed [1]. The former is almost equal to 0.34 eV obtained from the temperature dependence of the width of hysteresis window. The latter is similar to the interface trap reported by Nakano et al., which is considered to be originated from the complexes of Si and surface defect [2].[1] E. Shibata et al., Ext. Abstracts 2008 IMFEDK, Osaka, pp.69-70. (2008).[2] Y. Nakano and T. Jimbo, Appl. Phys. Lett. 80, 4756 (2002).


1994 ◽  
Vol 338 ◽  
Author(s):  
Zhang Rong ◽  
Yang Kai ◽  
Qing Guoyi ◽  
Shi Yi ◽  
Gu Shulin ◽  
...  

ABSTRACTIn this paper we report for the first time theoretical and experimental study on smallpulse DLTS measurements of deep levels in semiconductor heterostructures. A theoretical model has been developed on the basis of the Schodinger and Poisson's electrostatic equation. Distribution of charge density in the superlattice has been considered, especially transferred charges in the “narrow gap” sublayers. The calculated results indicate that tinder the 1017/cm3 doping condition, a 30mV small pulse corresponds to a 2nm “sampling space window”, it is enough to detect special signal of deep levels in each sublayer in the semiconductor heterostructures. A SiGe/Si sample has been measured by the small-pulse DLTS. The experimental results agree well with the theoretical prediction and show that the small-pulse DLTS is a good method to study deep levels in the semiconductor heterostructures.


2019 ◽  
Vol 963 ◽  
pp. 516-519 ◽  
Author(s):  
Xiang Zhou ◽  
Gyanesh Pandey ◽  
Reza Ghandi ◽  
Peter A. Losee ◽  
Alexander Bolotnikov ◽  
...  

We have studied capacitance mode Deep Level Transient Spectroscopy (DLTS) of five 4H-SiC Schottky diode and PiN diode designs. Comparing with previous DLTS studies, we have identified four traps levels, Z1/2, EH1, EH3and EH5. Additionally, a new trap level, EH1, is prominent in blanket Al+and B+high-energy implanted samples but less so in mask-implanted samples. Al+implantation increases EH3(associated with silicon vacancy) and EH5, while B+implantation significantly reduces EH3. The Z1/2peak (associated with carbon vacancy) is reduced to very low levels after B+and Al+implantation.


1996 ◽  
Vol 35 (Part 1, No. 4A) ◽  
pp. 2196-2198
Author(s):  
Óscar Alejos ◽  
Carlos de Francisco ◽  
Pablo Herná ◽  
José Mañoz ◽  
José Vicente ◽  
...  

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