WeC-2-3 Development of innovative dilatancy pad and high-speed / high-pressure polishing machine aimed for high-efficient and high-quality processing of next generation semiconductor substrates
2015 ◽
Vol 2015
(0)
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pp. _WeC-2-3-1-_WeC-2-3-3
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2011 ◽
Vol 291-294
◽
pp. 1178-1182
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1986 ◽
Vol 44
◽
pp. 736-737
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