scholarly journals A study based on TAM model about debugging tools

2021 ◽  
Author(s):  
Fabio Pereira da Silva
Keyword(s):  
Effect Size ◽  
New Technologies ◽  
Fault Localization ◽  
Three Dimensional ◽  
Software Project ◽  
Statistical Effect ◽  
Tam Model ◽  
Visualization Tools ◽  
Textual Representation

Debugging is the task of locating and fixing defects in a program.Despite the increase of its importance in last decades, debuggingis responsible for a large part of costs in a software project by organizations.Among the techniques proposed to minimize thesedifficulties, Spectrum-Based Fault Localization (SFL) is a promisingdebugging technique due to it is relative low execution cost.Recently, visualization tools have been proposed to represent thesuspicious values of program elements with SFL techniques in differentmetaphors. Some tools use textual representation and others avisual representation. In this paper, we compare two SFL debuggingtools. Jaguar presents the most suspicious elements of a programin a list sorted by suspicious values. CodeForest represents the programin a three dimensional cacti forest. In this article are presentedthe results of an evaluation with 119 students to assess the usabilityperception of these tools to the fault localization by TechnologyAcceptance Model (TAM). This model aims to help organizationsduring the evaluation of new technologies. The results of studyshow that Jaguar has greater usability than CodeForest; however,the statistical effect size observed is low between them.

scholarly journals 3D Printing of High Viscosity Reinforced Silicone Elastomers

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2239
Author(s):  
Nicholas Rodriguez ◽  
Samantha Ruelas ◽  
Jean-Baptiste Forien ◽  
Nikola Dudukovic ◽  
Josh DeOtte ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Viscosity ◽  
Layer By Layer ◽  
Silicone Elastomers ◽  
Uv Curable ◽  
Octet Truss ◽  
Tunable Mechanical Properties

Recent advances in additive manufacturing, specifically direct ink writing (DIW) and ink-jetting, have enabled the production of elastomeric silicone parts with deterministic control over the structure, shape, and mechanical properties. These new technologies offer rapid prototyping advantages and find applications in various fields, including biomedical devices, prosthetics, metamaterials, and soft robotics. Stereolithography (SLA) is a complementary approach with the ability to print with finer features and potentially higher throughput. However, all high-performance silicone elastomers are composites of polysiloxane networks reinforced with particulate filler, and consequently, silicone resins tend to have high viscosities (gel- or paste-like), which complicates or completely inhibits the layer-by-layer recoating process central to most SLA technologies. Herein, the design and build of a digital light projection SLA printer suitable for handling high-viscosity resins is demonstrated. Further, a series of UV-curable silicone resins with thiol-ene crosslinking and reinforced by a combination of fumed silica and MQ resins are also described. The resulting silicone elastomers are shown to have tunable mechanical properties, with 100–350% elongation and ultimate tensile strength from 1 to 2.5 MPa. Three-dimensional printed features of 0.4 mm were achieved, and complexity is demonstrated by octet-truss lattices that display negative stiffness.

Macromolecular Structure Visualization Tools at NCMI

2000 ◽  
Vol 6 (S2) ◽  
pp. 282-283
Author(s):  
Matthew Dougherty ◽  
Wah Chiu
Keyword(s):  
Human Factors ◽  
3D Visualization ◽  
Three Dimensional ◽  
Theoretical Models ◽  
Biological Research ◽  
Macromolecular Structure ◽  
X Ray ◽  
Visualization Tools ◽  
Types Of Information ◽  
3D Em

Sophisticated tools are needed to examine the results of cyro-microscopy. As the size and resolution of three dimensional macromolecular structures steadily improve, and the speed at with which they can be generated increases, researchers are finding they are inundated with larger datasets and at the same time are compelled to expediently evaluate these structures in unforeseen ways. Integration of EM data with other types of information is becoming necessary and routine; for example X-ray data, 3D EM reconstructions, and theoretical models, must be evaluated in concert to discount or propose hypothesis. To create such tools, the developer must take into account not only the empirical and theoretical possibilities, but also they must master the human factors and computational limits. During the last five years, the National Center for Macromolecular Imaging (NCMI) has progressed from a remedial 3D visualization capability to a collection of visualization tools allowing researchers to focus on the discovery phase of biological research.

STM3: a chemistry visualization platform

2005 ◽  
Vol 220 (5/6) ◽  
Author(s):  
Mario Valle
Keyword(s):  
User Interface ◽  
New Technologies ◽  
Software Platform ◽  
Visualization Tools ◽  
Visualization Techniques

AbstractTo support CSCS research users we built STM3, a software platform on which advanced chemistry visualization techniques can be integrated. Its main goal is not to replace existing tools, but to provide functionalities not covered by them. STM3’s unusual characteristic among chemistry visualization tools is its ability to combine chemistry and general visualization techniques in the same view. STM3 is built on top of a proven visualization environment (AVS/Express) that lets CSCS’s visualization staff concentrate its efforts on developing new technologies rather than investing time on graphical and user interface implementation issues.

Molding of Three-Dimensional Microcomponents

2006 ◽  
Author(s):  
W. N. P. Hung ◽  
M. M. Agnihotri ◽  
M. Y. Ali ◽  
S. Yuan
Keyword(s):  
Focused Ion Beam ◽  
New Technologies ◽  
Electrical Discharge Machining ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Three Dimensional ◽  
Cost Effective ◽  
Molecular Structures ◽  
Minimum Size ◽  
Ion Beam Sputtering

Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electrical mechanical systems (MEMS) have been successfully developed and implemented in industry. Since current MEMS are designed for manufacture using microelectronics processes, they are limited to two-dimensional profiles and semiconductor based materials. Such shape and material constraints would exclude many applications that require biocompatibility, dynamic stress, and high ductility. New technologies are sought to fabricate three dimensional microcomponents using robust materials for demanding applications. To be cost effective, such microdevices must be economically mass producible. Molding is one of the promising replication techniques to mass produce components from polymers and polymer-based composites. This paper presents the development of a micromolding process to produce thermoplastic microcomponents. Mold design required precision fitting and was integrated with a vacuum pump to minimize air trap in mold cavities. Nickel and aluminum mold inserts were used for the study; their cavities were fabricated by combinations of available micromachining processes like laser micromachining, micromilling, micro electrical discharge machining, and focused ion beam sputtering. High and low density polyethylene, polystyrene polymers were used for this study. The effects of polymer molecular structures, molding temperature, time, and pressure on molding results were studied. Simulation of stress in the microcomponents, plastic flow in microchannels, and mold defects was performed and compare with experimental data. The research results showed that a microcomponent can be fabricated to the minimum size of 10 ± 1μm (0.0004 inch) with surface roughness <10 nm Rt. Molding of micro-size geartrains and orthopedic meso-size fasteners was completed to illustrate the capability of this process.

scholarly journals Three-dimensional lattice logic circuits, Part II: Formal methods

2005 ◽  
Vol 18 (1) ◽  
pp. 15-28 ◽  
Author(s):  
Anas Al-Rabadi
Keyword(s):  
Formal Methods ◽  
Fault Localization ◽  
Three Dimensional ◽  
Logic Circuits ◽  
Design Methods ◽  
Algebraic Methods ◽  
Automatic Design ◽  
Important Class ◽  
Dimensional Lattice ◽  
Future Technologies

This paper introduces formal algebraic methods for the design of three-dimensional (3D) lattice circuits that were discussed in the first part of my article. New regular 3D logic circuits are introduced, where the application of ternary decompositions into regular three-dimensional lattice circuits is shown. Lattice circuits represent an important class of regular logic circuits that allow for local interconnections, predictable timing fast fault localization, and self-repair. The introduced design methods can be used for the automatic design of logic circuits in 3D for applications and future technologies that require such topologies.

scholarly journals Three-dimensional Super-resolved Imaging of Paraffin-embedded Kidney Samples

2021 ◽  
Author(s):  
David Unnersjoe-Jess ◽  
Amer Ramdedovic ◽  
Martin Hoehne ◽  
Linus Butt ◽  
Felix C Koehler ◽  
...  
Keyword(s):  
New Technologies ◽  
Three Dimensional ◽  
Kidney Tissue ◽  
Confocal Imaging ◽  
Disease Assessment ◽  
Gold Standard Method ◽  
Filtration Barrier ◽  
Formalin Fixed Paraffin ◽  
Formalin Fixed Paraffin Embedded ◽  
Monitoring Treatment

Diseases of the glomeruli, the renal filtration units, are a leading cause of progressive kidney disease. Assessment of the ultrastructure of podocytes at the glomerular filtration barrier is essential for diagnosing diverse disease entities, providing insight into the disease pathogenesis as well as monitoring treatment responses. New technologies, including super-resolved nanoscopy and expansion microscopy, as well as new sample preparation techniques, are starting to revolutionize imaging of biopsy specimens. However, our previous approaches for simple and fast three-dimensional imaging of optically cleared samples are to date not compatible with formalin fixed paraffin-embedded (FFPE) tissue, impeding application in clinical routine. Here we provide protocols that circumvent these limitations and allow for three dimensional STED and confocal imaging of FFPE kidney tissue with similar staining and image quality as compared to our previous approaches. This would increase the feasibility to implement these protocols in clinical routines, as FFPE is the gold standard method for storage of patient samples.

scholarly journals Three-dimensional lattice logic circuits, Part I: Fundamentals

2005 ◽  
Vol 18 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Anas Al-Rabadi
Keyword(s):  
Circuit Design ◽  
Fault Localization ◽  
Three Dimensional ◽  
Logic Circuits ◽  
Logic Circuit ◽  
Device Performance ◽  
Important Class ◽  
Future Directions ◽  
Dimensional Lattice ◽  
Current Technology

Fundamentals of regular three-dimensional (3D) lattice circuits are introduced. Lattice circuits represent an important class of regular circuits that allow for local interconnections, predictable timing, fault localization, and self-repair. In addition, three-dimensional lattice circuits can be potentially well suited for future 3D technologies, such as nanotechnologies, where the intrinsic physical delay of the irregular and lengthy interconnections limits the device performance. Although the current technology does not offer a menu for the immediate physical implementation of the proposed three-dimensional circuits, this paper deals with three-dimensional logic circuit design from a fundamental and foundational level for a rather new possible future directions in designing digital logic circuits.

scholarly journals Organic Nanoplatforms for Iodinated Contrast Media in CT Imaging

Molecules ◽  
2021 ◽  
Vol 26 (23) ◽  
pp. 7063
Author(s):  
Peng Zhang ◽  
Xinyu Ma ◽  
Ruiwei Guo ◽  
Zhanpeng Ye ◽  
Han Fu ◽  
...  
Keyword(s):  
Contrast Media ◽  
New Technologies ◽  
Drug Loading ◽  
Three Dimensional ◽  
Disease Diagnosis ◽  
Ct Imaging ◽  
Water Soluble ◽  
Iodinated Contrast Media ◽  
Iodinated Contrast ◽  
Anatomical Images

X-ray computed tomography (CT) imaging can produce three-dimensional and high-resolution anatomical images without invasion, which is extremely useful for disease diagnosis in the clinic. However, its applications are still severely limited by the intrinsic drawbacks of contrast media (mainly iodinated water-soluble molecules), such as rapid clearance, serious toxicity, inefficient targetability and poor sensitivity. Due to their high biocompatibility, flexibility in preparation and modification and simplicity for drug loading, organic nanoparticles (NPs), including liposomes, nanoemulsions, micelles, polymersomes, dendrimers, polymer conjugates and polymeric particles, have demonstrated tremendous potential for use in the efficient delivery of iodinated contrast media (ICMs). Herein, we comprehensively summarized the strategies and applications of organic NPs, especially polymer-based NPs, for the delivery of ICMs in CT imaging. We mainly focused on the use of polymeric nanoplatforms to prolong circulation time, reduce toxicity and enhance the targetability of ICMs. The emergence of some new technologies, such as theragnostic NPs and multimodal imaging and their clinical translations, are also discussed.

scholarly journals Virtual and Space Tourism as New Trends in Travelling at the Time of the COVID-19 Pandemic

2022 ◽  
Vol 14 (2) ◽  
pp. 628
Author(s):  
Michał Roman ◽  
Robert Kosiński ◽  
Kumar Bhatta ◽  
Arkadiusz Niedziółka ◽  
Andrzej Krasnodębski
Keyword(s):  
Public Space ◽  
New Technologies ◽  
Space Station ◽  
Three Dimensional ◽  
Developed Countries ◽  
Google Earth ◽  
Alternative Form ◽  
Original Form ◽  
Space Tourism ◽  
The World

The first European COVID-19 infection was recorded in February 2020, and Poland followed in mid-March. Restrictions were imposed on traveling between states and using public space. These movement restrictions forced a search for new, often innovative, forms of tourism. Google Earth virtual reality (VR), Google Street View, and the Chernobyl VR Project are just some of the selected opportunities to create virtual tours. Different activities using VR mean that people can experience the illusion of travelling in time and space, outside of their everyday surroundings, in a digitally constructed three-dimensional (3D) environment, for cognition or entertainment. Therefore, this study aimed to present virtual and space tourism as new traveling trends during various crise,s such as health, economic, etc. A diagnostic survey with a developed questionnaire was conducted in June and July 2021 in Poland. A total of 564 fully answered responses were collected from randomly selected respondents. We found that around 82% of Polish people were aware of VR technology, and 70% believed that new technologies determine VR tourism development. VR presents the possibility of travelling to places that no longer exist in their original form, but have been reconstructed only in VR. Around 75% of the respondents agreed that VR tourism plays an essential role in tourism promotion in Poland and throughout the world. Moreover, VR and augmented tourism lets us visit fictitious and dangerous, politically restricted, and geographically as well as economically difficult destinations. For example, our results revealed that many people want to experience North Korea, the USA, Antarctica, Syria, etc. At the same time, people recommended the NASA space station as a visiting destination using VR and augmented reality. VR offers an alternative form of tourism during crises and pandemics such as COVID-19. We found over 26% of the respondents were satisfied with contemporary tourists’ cognitional needs during VR sightseeing. More than 87% of the respondents believed that VR tourism cannot substitute real-world tourism in the long run. However, VR tourism will be more beneficial for developing countries facing difficulties in economic aspects, and easier than attaining visas to enter developed countries. Furthermore, virtual sightseeing may also constitute an alternative for people who are disabled or sick, and who cannot undertake the effort of active tourism and explore tourist resources of the world on their own.

scholarly journals A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-Via and Solder Bumping Process

Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung
Keyword(s):  
High Speed ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Density ◽  
Internal Stresses ◽  
Deep Reactive Ion Etching ◽  
Fifth Generation ◽  
Precise Understanding ◽  
Fabrication Defects

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

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