Direct writing of polymer thick film resistors using a novel laser transfer technique

2001 ◽  
Vol 16 (11) ◽  
pp. 3214-3222 ◽  
Author(s):  
R. Modi ◽  
H. D. Wu ◽  
R. C. Y. Auyeung ◽  
C. M. Gilmore ◽  
D. B. Chrisey
Keyword(s):  
Thick Film ◽  
Room Temperature ◽  
Equivalent Circuit Model ◽  
Wide Frequency Range ◽  
Laser Evaporation ◽  
Direct Write ◽  
Electrical Characteristics ◽  
Direct Writing ◽  
Ambient Conditions ◽  
Laser Transfer

Polymer thick film (PTF) resistors were fabricated using a new laser-based transfer technique called matrix-assisted pulsed laser evaporation direct write (MAPLE-DW). MAPLE-DW is a versatile direct writing technique capable of writing a wide variety of materials on virtually any substrate in air and at room temperature. Epoxy-based PTF resistors spanning four decades of sheet resistances (10 Ω/sq. to 100 kΩ/sq.) were deposited on alumina substrates under ambient conditions. Electrical characteristics of these MAPLE-DW deposited resistors were studied at a wide frequency range (1 MHz to 1.8 GHz), and the results were explained through an equivalent circuit model and impedance spectroscopy. Temperature coefficient of resistance measurements for the PTF resistors were performed between 25 and 125 °C. The results based on the percolation theory were used to explain the temperature dependence of the resistance behavior of the PTF resistors.

Direct writing of electronic and sensor materials using a laser transfer technique

2000 ◽  
Vol 15 (9) ◽  
pp. 1872-1875 ◽  
Author(s):  
A. Piqué ◽  
D. B. Chrisey ◽  
J. M. Fitz-Gerald ◽  
R. A. McGill ◽  
R. C. Y. Auyeung ◽  
...  
Keyword(s):  
Fused Silica ◽  
Laser Evaporation ◽  
Direct Write ◽  
Metal Powders ◽  
Direct Writing ◽  
Ceramic Powders ◽  
Composite Matrix ◽  
Laser Transfer ◽  
Matrix Surface ◽  
The Matrix

We present a laser-based direct write technique termed matrix-assisted pulsed-laser evaporation direct write (MAPLE DW). This technique utilizes a laser transparent fused silica disc coated on one side with a composite matrix consisting of the material to be deposited mixed with a laser absorbing polymer. Absorption of laser radiation results in the decomposition of the polymer, which aids in transferring the solute to an acceptor substrate placed parallel to the matrix surface. Using MAPLE DW, complex patterns consisting of metal powders, ceramic powders, and polymer composites were transferred onto the surfaces of various types of substrates with <10 micron resolution at room temperature and at atmospheric pressure without the use of masks.

Metallic Foil-Assisted Laser Cell Printing

2011 ◽  
Vol 133 (2) ◽  
Author(s):  
Yafu Lin ◽  
Yong Huang ◽  
Douglas B. Chrisey
Keyword(s):  
Cell Viability ◽  
Cell Injury ◽  
Laser Energy ◽  
Layer Structure ◽  
Adhesive Layer ◽  
Laser Evaporation ◽  
Direct Write ◽  
Direct Writing ◽  
Human Colon Cancer ◽  
Metallic Foil

Laser direct-write technology such as modified laser-induced forward transfer (LIFT) is emerging as a revolutionary technology for biological construct fabrication. While many modified LIFT-based cell direct writing successes have been achieved, possible process-induced cell injury and death is still a big hurdle for modified LIFT-based cell direct writing to be a viable technology. The objective of this study is to propose metallic foil-assisted LIFT using a four-layer structure to achieve better droplet size control and increase cell viability in direct writing of human colon cancer cells (HT-29). The proposed four layers include a quartz disk, a sacrificial and adhesive layer, a metallic foil, and a cell suspension layer. The bubble formation-induced stress wave is responsible for droplet formation. It is found that the proposed metallic foil-assisted LIFT approach is an effective cell direct-write technology and provides better printing resolution and high post-transfer cell viability when compared with other conventional modified LIFT technologies such as matrix-assisted pulsed-laser evaporation direct-write; at the same time, the possible contamination from the laser energy absorbing material is minimized using a metallic foil.

Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE DW): A New Method to Rapidly Prototype Active and Passive Electronic Circuit Elements

2000 ◽  
Vol 625 ◽  
Author(s):  
J.M. Fitz-Gerald ◽  
D.B. Chrisey ◽  
A. Piqu ◽  
R.C.Y. Auyeung ◽  
R. Mohdi ◽  
...  
Keyword(s):  
Composite Material ◽  
Thick Film ◽  
Pulsed Laser ◽  
Laser Evaporation ◽  
Work Piece ◽  
Direct Write ◽  
Electromagnetic Modeling ◽  
Cad Cam ◽  
Circuit Elements ◽  
Materials Used

AbstractWe demonstrate a novel laser-based approach to perform rapid prototyping of active and passive circuit elements called MAPLE DW. This technique is similar in its implementation to laser induced forward transfer (LIFT), but different in terms of the fundamental transfer mechanism and materials used. In MAPLE DW, a focused pulsed laser beam interacts with a composite material on a laser transparent support transferring the composite material to the acceptor substrate. This process enables the formation of adherent and uniform coatings at room temperature and atmospheric pressure with minimal post-deposition modification required, i.e., ≤ 400°C thermal processing. The firing of the laser and the work piece (substrate) motion is computer automated and synchronized using software designs from an electromagnetic modeling program validating that this technique is fully CAD/CAM compatible. The final properties of the deposited materials depend on the deposition conditions and the materials used, but when optimized, the properties are competitive with other thick film techniques such as screenprinting. Specific electrical results for conductors are < 5X the resistivity of bulk Ag, for BaTiO3/TiO2 composite capacitors the k can be tuned between 4 and 100 and losses are < 1-4%, and for polymer thick film resistors the compositions cover 4 orders of magnitude in sheet resistivity. The surface profiles and fracture cross-section micrographs of the materials and devices deposited show that they are very uniform, densely packed and have minimum resolutions of ∼10 µm. A discussion of how these results were obtained, the materials used, and methods to improve them will be given.

Dielectric properties of oxide structures by a laser-based direct-writing method

2001 ◽  
Vol 16 (6) ◽  
pp. 1720-1725 ◽  
Author(s):  
D. Young ◽  
H. D. Wu ◽  
R. C. Y. Auyeung ◽  
R. Modi ◽  
J. Fitz-Gerald ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Electronic Materials ◽  
Dielectric Material ◽  
Laser Evaporation ◽  
Direct Write ◽  
Oxide Materials ◽  
Direct Writing ◽  
Interdigitated Electrode ◽  
Precise Control ◽  
Logarithmic Rule

Matrix-assisted pulsed laser evaporation direct-write (MAPLE-DW) is a laser-based method of directly writing mesoscopic patterns of electronic materials. Patterns of composite BaTiO3/SiO2/TiO2 dielectric material were written onto Pt/Au interdigitated-electrode test structures, with precise control over final dielectric properties. Scanning electron microscopy indicates random close-packed structures of BaTiO3 and SiO3 particles, with interstitial spaces partially filled with titania. Depending on the BaTiO3:silica ratio, the dielectric constant ranged from 5 to 55 and followed a 4-component logarithmic rule of mixing. This work demonstrates that the transfer process and the final material properties of MAPLE-DW oxide materials are largely decoupled.

scholarly journals Effect of the Addition of Different Metal Oxides in Lead Borosilicate Glasses on the Electrical Characteristics of SbSn Composition-Based Thick-Film Resistors

1993 ◽  
Vol 16 (1) ◽  
pp. 7-18
Author(s):  
E. R. Cubellio ◽  
G. N. Natu ◽  
R. N. Karekar ◽  
R. C. Aiyer
Keyword(s):  
Metal Oxides ◽  
Thick Film ◽  
Material Characterization ◽  
Room Temperature ◽  
Negative Temperature ◽  
Lithium Oxide ◽  
Electrical Characteristics ◽  
Borosilicate Glasses ◽  
Sheet Resistivity ◽  
Aging Studies

The paper reports the effect of addition of metal oxides in lead borosilicate glasses on electrical characteristics of SbSn alloy-based thick-film resistors. The Sb and Sn powder (1: 1 by weight) is taken in two quartz tubes separately, vacuum sealed at 10–5Torr and heated in a resistive furnace .at 430℃ and 630℃ respectively. The conventional glass [1] is modified by using different dopants like tungsten oxide, cobalt oxide, lithium oxide, titanium dioxide, venadium pentoxide, chromium oxide, nickel oxide and manganese dioxide. The resistive pastes are formulated with both powders, 5% glass and conventional organic binder. The firing temperature is optimized for eight glasses. The sheet resistivity varies from 1600 Ω/□ to 40 Ω/□ , with negative temperature co-efficient of resistance varying from 2000 ppm/℃ to 800 ppm/℃ respectively. Material characterization is carried out using the XRD technique. Aging studies of resistors at room temperature over the period of two months indicate that these resistors stabilize within 15–20 days.

scholarly journals Laser Direct Writing of Hydrous Ruthenium Dioxide Micro-Pseudocapacitors

2001 ◽  
Vol 698 ◽  
Author(s):  
Craig B. Arnold ◽  
Ryan C. Wartena ◽  
Bhanu Pratap ◽  
Karen E. Swider-Lyons ◽  
Alberto Piqué
Keyword(s):  
High Surface ◽  
High Surface Area ◽  
Laser Evaporation ◽  
Ruthenium Dioxide ◽  
Direct Write ◽  
Atmospheric Conditions ◽  
Direct Writing ◽  
Laser Direct Writing ◽  
Forward Transfer ◽  
Discharge Behavior

ABSTRACTWe are using a laser engineering approach to develop and optimize hydrous ruthenium dioxide (RuOxHy or RuO2·0.5 H2O) pseudocapacitors. We employ a novel laser forward transfer process, Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE-DW), in combination with UV laser machining, to fabricate mesoscale pseudocapacitors and microbatteries under ambient temperature and atmospheric conditions. Thin films with the desired high surface area morphology are obtained without compromising their electrochemical performance. The highest capacitance structures are achieved by depositing mixtures of sulfuric acid with the RuO2·0.5 H2O electrode material. Our pseudocapacitors exhibit linear discharge behavior and their properties scale proportionately when assembled in parallel and series configurations.

Laser transfer of biomaterials: Matrix-assisted pulsed laser evaporation (MAPLE) and MAPLE Direct Write

2003 ◽  
Vol 74 (4) ◽  
pp. 2546-2557 ◽  
Author(s):  
P. K. Wu ◽  
B. R. Ringeisen ◽  
D. B. Krizman ◽  
C. G. Frondoza ◽  
M. Brooks ◽  
...  
Keyword(s):  
Pulsed Laser ◽  
Laser Evaporation ◽  
Direct Write ◽  
Laser Transfer

scholarly journals Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics

2021 ◽  
Vol 34 (1) ◽  
pp. 24-31
Author(s):  
James Feng ◽  
Anthony Loveland ◽  
Michael Renn
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Printed Circuit Board ◽  
Printed Electronics ◽  
Electronics Industry ◽  
Circuit Board ◽  
Print Quality ◽  
Direct Write ◽  
Direct Writing ◽  
Fixed Amount

To improve performance and reduce size of printed-circuit board (PCB) in electronics industry, embedding discrete components within a board substrate has been an effective approach by reducing solder joints and their associated impedance mismatching, inductive reactance, etc.  With its unique capabilities for non-contact precision material deposition, the Aerosol Jet® direct-write technology has been enabling additive manufacturing of fine-feature electronics conformally onto flexible substrates of complicated shapes.  The CAD/CAM controlled relative motions between substrate and print head allows convenient adjustment of the pattern and pile height of deposited material at a given ink volumetric deposition rate.  To date in the printed electronics industry, additively printing embedded polymer-thick-film (PTF) resistors has mostly been done with screen printing using carbon-based paste inks.  Here we demonstrate results of Aerosol Jet® printed PTF resistors of resistance values ranging from ~50 W to > 1 kW, adjustable (among several variable parameters) by the number of stacked layers (or print passes with each pass depositing a fixed amount of ink) between contact pads of around 1 mm apart with footprint line typically < 0.3 mm. In principle, any ink material that can be atomized into fine droplets of 1 to 5 microns can be printed with the Aerosol Jet® system.  However, the print quality such as line edge cleanliness can significantly influenced by ink rheology which involves solvent volatility, solids loading, and so on.  Our atomizable carbon ink was made by simply diluting a screen printing paste with a compatible solvent of reasonable volatility, which can be cured at temperatures below 200 oC. We show that Aerosol Jet® printed overlapping lines can be stacked to large pile height (to reduce the resistance value) without significant increase of line width, which enables fabricating embedded resistors with adjustable resistance values in a limited footprint space.

Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE DW): A New Method to Rapidly Prototype Active and Passive Electronic Circuit Elements

2000 ◽  
Vol 624 ◽  
Author(s):  
J.M. Fitz-Gerald ◽  
D.B. Chrisey ◽  
A. Piqu ◽  
R.C.Y. Auyeung ◽  
R. Mohdi ◽  
...  
Keyword(s):  
Composite Material ◽  
Thick Film ◽  
Pulsed Laser ◽  
Laser Evaporation ◽  
Work Piece ◽  
Direct Write ◽  
Electromagnetic Modeling ◽  
Cad Cam ◽  
Circuit Elements ◽  
Materials Used

ABSTRACTWe demonstrate a novel laser-based approach to perform rapid prototyping of active and passive circuit elements called MAPLE DW. This technique is similar in its implementation to laser induced forward transfer (LIFT), but different in terms of the fundamental transfer mechanism and materials used. In MAPLE DW, a focused pulsed laser beam interacts with a composite material on a laser transparent support transferring the composite material to the acceptor substrate. This process enables the formation of adherent and uniform coatings at room temperature and atmospheric pressure with minimal post-deposition modification required, i.e., ≤400°C thermal processing. The firing of the laser and the work piece (substrate) motion is computer automated and synchronized using software designs from an electromagnetic modeling program validating that this technique is fully CAD/CAM compatible. The final properties of the deposited materials depend on the deposition conditions and the materials used, but when optimized, the properties are competitive with other thick film techniques such as screen-printing. Specific electrical results for conductors are < 5X the resistivity of bulk Ag, for BaTiO3/TiO2composite capacitors the k can be tuned between 4 and 100 and losses are < 1-4%, and for polymer thick film resistors the compositions cover 4 orders of magnitude in sheet resistivity. The surface profiles and fracture cross-section micrographs of the materials and devices deposited show that they are very uniform, densely packed and have minimum resolutions of -10 jtm. A discussion of how these results were obtained, the materials used, and methods to improve them will be given

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