Comparison of Carbon-based Nanostructures with Commercial Products as Thermal Interface Materials

2009 ◽  
Vol 1158 ◽  
Author(s):  
Michael Rosshirt ◽  
Drazen Fabris ◽  
Christopher Cardenas ◽  
Patrick Wilhite ◽  
Thanh Tu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Heat Dissipation ◽  
Limiting Factors ◽  
Great Promise ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Commercial Products ◽  
Experimental Findings ◽  
Interface Materials

AbstractHeat dissipation in electronics packaging can be highly dependent on Thermal Interface Materials (TIM). TIM contact, compliance, and conductivity can be the dominant limiting factors in the overall conduction heat transfer across the interface. Mixing multiwall Carbon Nanotubes (CNTs), which have high thermal conductivity, with other thermally conducting materials holds great promise as TIM fillers and has been shown to have higher thermal performance than commercial TIM ‘1’. Such mixtures possess greater thermal conductivity as a result of increased thermal conduction paths through highly conductive, high aspect ratio CNTs.In this work, we develop and test an advanced apparatus based on the ASTM D5470-06 standard to measure thermal interface resistance. Our experimental findings quantify the thermal performance trends of industry-standard TIM Arctic Silver® 5 along with hybrid TIM mixtures of Arctic Silver®5 and varying weight ratios of CNTs. Early experimental findings show that Arctic Silver®5 mixed with 0.5 to 1% multiwall CNT by weight may improve thermal conductivity over pure Arctic Silver®5.The goal of this research is to investigate the viability of integrating CNTs with commercial products as improved TIM for electronic cooling in chip packages.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

Mechanical Characterization of Thermal Interface Materials and Its Challenges

2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Vijay Subramanian ◽  
Jorge Sanchez ◽  
Joseph Bautista ◽  
Yi He ◽  
Jinlin Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Matrix ◽  
Thermal Performance ◽  
Mechanical Characterization ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Compression Set ◽  
Thermal Solution ◽  
Interface Materials

Thermal interface materials (TIMs) play a vital role in the performance of electronic packages by enabling improved heat dissipation. These materials typically have high thermal conductivity and are designed to offer a lower thermal resistance path for efficient heat transfer. For some semiconductor components, thermal solutions are attached directly to the bare silicon die using TIM materials, while other components use an integrated heat spreader (IHS) attached on top of the die(s) and the thermal solution attached on top of the IHS. For cases with an IHS, two TIM materials are used—TIM1 is applied between the silicon die and IHS and TIM2 is used between IHS and thermal solution. TIM materials are usually comprised of a polymer matrix with thermally conductive fillers such as silica, aluminum, alumina, boron nitride, zinc oxide, etc. The polymer matrix wets the contact surface to lower the contact resistance, while the fillers help reduce the bulk resistance by increasing the bulk thermal conductivity. TIM thickness varies by application but is typically between 25 μm and around 250 μm. Selection of appropriate TIM1 and TIM2 materials is necessary for the reliable thermal performance of a product over its life and end-use conditions. It has been observed that during reliability testing, TIM materials are prone to degradation which in turn leads to a reduction in the thermal performance of the product. Typical material degradation is in the form of hardening, compression set, interfacial delamination, voiding, or excessive bleed-out. Therefore, in order to identify viable TIM materials, characterization of the thermomechanical behavior of these materials becomes important. However, developing effective metrologies for TIM characterization is difficult for two reasons: TIM materials are very soft, and the sample thickness is very small. Therefore, a well-designed test setup and a repeatable sample preparation and test procedure are needed to overcome these challenges and to obtain reliable data. In this paper, we will share some of the TIM characterization techniques developed for TIM material down-selection. The focus will be on mechanical characterization of TIM materials—including modulus, compression set, coefficient of thermal expansion (CTE), adhesion strength, and pump-out/bleed-out measurement techniques. Also, results from several TIM formulations, such as polymer TIMs and thermal gap pads, will be shared.

Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials

2009 ◽  
Author(s):  
Reza H. Khiabani ◽  
Yogendra Joshi ◽  
Cyrus Aidun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Thermal Characteristics ◽  
Thermal Conductivity Ratio ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden Thermal Interface Materials (TIMs) are used extensively in thermal packaging of electronic components to enhance the heat transfer between heat dissipating components and the thermal management layers. In this paper, the thermal performance of particle laden TIMs is studied numerically, using the Lattice Boltzmann method. The effect of particle volume fraction, particle size and the thermal conductivity ratio on the thermal performance of particle laden TIMs are examined. The results for the effective thermal conductivity of particle laden greases are in agreement with the existing analytical and experimental results reported in the literature.

Effect of CNT Arrays on Electrical and Thermal Conductivity of Epoxy Resins

2014 ◽  
Vol 1043 ◽  
pp. 27-30
Author(s):  
Liang Ke Wu ◽  
Ji Ying
Keyword(s):  
Thermal Conductivity ◽  
Epoxy Resin ◽  
Axial Direction ◽  
Great Promise ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Composites ◽  
Circuit Integration ◽  
Cnt Arrays ◽  
Interface Materials

With the development of electronic technology, thermal interface materials (TIMs) of excellent thermal conductivity have been desired for circuit integration. In this study, carbon nanotube arrays (CNTAs) were utilized to prepare high thermal conductive composites by infiltration into epoxy resin. The composite was cured in a drying oven at 60 °C for 4 h. The thermal conductivity of the composite along axial direction reaches 2.24 W/mK at 120 oC, which is about 10 times of that of pure epoxy resin. The results indicated that the great promise of epoxy/CNTA composites as thermal interface materials. However, the electrical conductivity still remains at a low level, although it is increased by orders of magnitudes, the insulativity is beneficial for the application of this composite in electrical industry.

Thermo-optical characterization and thermal properties of graphene–polymer composites: a review

2018 ◽  
Vol 6 (12) ◽  
pp. 2901-2914 ◽  
Author(s):  
Reg Bauld ◽  
Dong-Yup William Choi ◽  
Paul Bazylewski ◽  
Ranjith Divigalpitiya ◽  
Giovanni Fanchini
Keyword(s):  
Thermal Properties ◽  
Polymer Composites ◽  
Optical Characterization ◽  
Great Promise ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Photothermal Deflection ◽  
Interface Materials

Graphene–polymer composites show great promise as thermal interface materials. We here offer a deeper understanding of their thermal properties using contactless photothermal deflection techniques.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

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