Effect of Microstructure on the Dissolution Kinetics of Copper Thin Films in Dilute Aqueous Solutions of Cupric Chloride

1993 ◽  
Vol 323 ◽  
Author(s):  
L. Harper Walsh ◽  
N. B. Feilchenfeld ◽  
J. A. Schwarz
Keyword(s):  
Grain Size ◽  
Grain Orientation ◽  
Dissolution Kinetics ◽  
Surface Region ◽  
Practical Method ◽  
Reaction Rates ◽  
Near Surface ◽  
Dilute Aqueous Solutions ◽  
Microelectronics Industry ◽  
Kinetics Of

ABSTRACTMicrostructural differences in copper deposited by four techniques commonly used in the microelectronics industry were previously reported. [1] The reaction rates were predicted using either grain size or grain orientation as the dominant microstructure characteristic. A practical method to monitor copper speciation was developed.[2] This technique was used to measure the reaction rates for the different copper films under two different etching conditions. The results are explained using grain size, grain orientation and near surface region composition.

Characterization of Films Formed during the Corrosion of Copper in Dilute Solutions of Cupric Chloride

1995 ◽  
Vol 390 ◽  
Author(s):  
L. H. Walsh ◽  
N. B. Feilchenfeld
Keyword(s):  
Grain Size ◽  
Etch Rate ◽  
Reaction Rate ◽  
Surface Film ◽  
Reaction Rates ◽  
Cupric Chloride ◽  
Copper Corrosion ◽  
Near Surface ◽  
Microelectronics Industry

ABSTRACTMicrostructural differences in copper deposited by four techniques commonly used in the microelectronics industry were previously reported. Grain size, preferred orientation, and near surface chemistry were considered. [1] Prediction of the reaction rates were made based on these differences and then correlated with actual measurements. [2] In aerobic conditions the grain size dictated the reaction rate, the smaller the size the faster the rate.[3] The composition of the surface film formed during etching was examined. The trends in chemical concentrations on the surface film vary for each sample, but the relative constituent amounts correlate to the grain size of the original copper samples. Thus, there is further evidence that during exposure to aqueous solutions of cupric chloride, copper corrosion, in terms of both etch rate and film composition, is dictated by grain size of the original copper and not other microstructural factors.

scholarly journals Effect of Surface Roughness on Oxidation Resistance of Stainless Steel AISI 316Ti During Exposure at High Temperature

2020 ◽  
Vol 29 (12) ◽  
pp. 8060-8069
Author(s):  
Wojciech J. Nowak
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Oxidation Resistance ◽  
Surface Preparation ◽  
Surface Region ◽  
Lower Surface ◽  
Near Surface ◽  
Steel Aisi ◽  
Kinetics Of ◽  
Effect Of Surface

AbstractIn the present work, the influence of surface roughness on oxidation kinetics of AISI 316Ti stainless steel and its consequences in term of oxidation resistance were investigated. Namely, the effect of surface roughness on oxidation resistance was evaluated during different types of cyclic oxidation tests at 900 and 1000 °C. The obtained results revealed that alloy possessing higher surface roughness showed longer lifetime compared to that with lower surface roughness. It was also found that more severe cyclic conditions suppressed the positive effect of surface roughness on sample’s lifetime. The better oxidation resistance of rougher alloy was correlated with suppressed formation of Fe-rich nodules on ground surfaces and explained by the combined effect of introduced defects in the near-surface region and possible increase in residual stresses caused by mechanical surface preparation.

The Temperature Dependence of the Atoms Co Diffusion Coefficient in Pt80Co20(111) Alloy

2007 ◽  
Vol 265 ◽  
pp. 19-23
Author(s):  
M. Vasylyev ◽  
Vitaliy A. Tinkov ◽  
Sergey I. Sidorenko ◽  
S.M. Voloshko
Keyword(s):  
Activation Energy ◽  
Diffusion Coefficient ◽  
Temperature Dependence ◽  
Surface Segregation ◽  
Surface Region ◽  
Near Surface ◽  
Kinetics Of

The method of Ionization Spectroscopy is used to study the thermo-induced kinetics of surface segregation of the Pt80Co20(111) alloy components. The temperature dependence of the Co diffusion coefficient in this alloy is determined. It is found that the value of the activation energy for the segregation of Co atoms in the near-surface region is close to the heat of sublimation of pure Co.

scholarly journals Ion Implantation and Annealing of SrTiO3 and CaTiO3

1987 ◽  
Vol 93 ◽  
Author(s):  
C. W. White ◽  
L. A. Boatner ◽  
J. Rankin ◽  
M. J. Aziz
Keyword(s):  
Ion Implantation ◽  
Solid Phase ◽  
Surface Region ◽  
Single Crystal Substrate ◽  
Recrystallization Process ◽  
Near Surface ◽  
Ion Channeling ◽  
Implantation Damage ◽  
Crystal Substrate ◽  
Kinetics Of

ABSTRACTIon implantation damage and thermal annealing results are presented for single crystals of SrTiO3 and CaTiO3. The near-surface region of both of these materials can be made amorphous by low doses (∼1015/cm2 ) of heavy ions (Pb at 540 keV). During annealing, the amorphous implanted region crystallizes epitaxially on the underlying single-crystal substrate. The kinetics of this solid-phase epitaxial recrystallization process have been measured by employing ion channeling techniques.

Initiation and Growth of Short Cracks during Cycling in an Aged Superduplex Stainless Steel

2011 ◽  
Vol 465 ◽  
pp. 411-414 ◽  
Author(s):  
M. Balbi ◽  
S. Hereñú ◽  
Ingrid Proriol Serre ◽  
Jean Bernard Vogt ◽  
A.F. Armas ◽  
...  
Keyword(s):  
Growth Rate ◽  
Stainless Steel ◽  
Tensile Axis ◽  
Surface Region ◽  
Aged Condition ◽  
Exponential Behavior ◽  
Near Surface ◽  
Short Cracks ◽  
Superduplex Stainless Steel ◽  
Kinetics Of

The kinetics of short crack growth during cycling has been studied in a superduplex stainless steel in aged condition. After few cycles, slip lines appear distributed in both phases but the preferred phase for microcrack nucleation is the ferrite. Contrary to the exponential behavior observed in the as-received material, the growth rate of microcracks in aged condition follows a rather linear law. Internal dislocation structures were studied in the near surface region; microbands that sometimes extend over several grains were found at approximately 45º of the tensile axis on ferrite grains. The origin of the microbands has been analyzed and correlated with the microcracks.

scholarly journals Dissolution of the Primary γ′ Precipitates and Grain Growth during Solution Treatment of Three Nickel Base Superalloys

Metals ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1921
Author(s):  
Karen Alvarado ◽  
Ilusca Janeiro ◽  
Sebastian Florez ◽  
Baptiste Flipon ◽  
Jean-Michel Franchet ◽  
...  
Keyword(s):  
Experimental Data ◽  
Grain Size ◽  
Solution Treatment ◽  
Dissolution Kinetics ◽  
Second Phase ◽  
Stable States ◽  
Size Evolution ◽  
Nickel Base Superalloys ◽  
Nickel Base ◽  
Kinetics Of

Second phase particles (SPP) play an essential role in controlling grain size and properties of polycrystalline nickel base superalloys. The understanding of the behavior of these precipitates is of prime importance in predicting microstructure evolutions. The dissolution kinetics of the primary γ′ precipitates during subsolvus solution treatments were investigated for three nickel base superalloys (René 65, AD730 and N19). A temperature-time codependency equation was established to describe the evolution of primary γ′ precipitates of each material using experimental data, the Thermo-Calc software and the Johnson–Mehl–Avrami–Kolmogorov (JMAK) model. The dissolution kinetics of precipitates was also simulated using the level-set (LS) method and the former phenomenological model. The precipitates are represented using an additional LS function and a numerical treatment around grain boundaries in the vicinity of the precipitates is applied to reproduce their pinning pressure correctly. Thus, considering the actual precipitate dissolution, these simulations aim to predict grain size evolution in the transient and stable states. Furthermore, it is illustrated how a population of Prior Particle Boundaries (PPB) particles can be considered in the numerical framework in order to reproduce the grain size evolution in the powder metallurgy N19 superalloy. The proposed full-field strategy is validated and the obtained results are in good agreement with experimental data regarding the precipitates and grain size.

Preparation of cross-sectional samples for near-surface TEM studies

1987 ◽  
Vol 45 ◽  
pp. 380-381
Author(s):  
R.C. Dickenson ◽  
K.R. Lawless
Keyword(s):  
Standard Sample ◽  
Surface Region ◽  
Specimen Preparation ◽  
Thick Sheet ◽  
Drill Bit ◽  
Sample Holder ◽  
Metal Interface ◽  
Cross Sectional ◽  
Near Surface ◽  
Cold Worked

In thermal oxidation studies, the structure of the oxide-metal interface and the near-surface region is of great importance. A technique has been developed for constructing cross-sectional samples of oxidized aluminum alloys, which reveal these regions. The specimen preparation procedure is as follows: An ultra-sonic drill is used to cut a 3mm diameter disc from a 1.0mm thick sheet of the material. The disc is mounted on a brass block with low-melting wax, and a 1.0mm hole is drilled in the disc using a #60 drill bit. The drill is positioned so that the edge of the hole is tangent to the center of the disc (Fig. 1) . The disc is removed from the mount and cleaned with acetone to remove any traces of wax. To remove the cold-worked layer from the surface of the hole, the disc is placed in a standard sample holder for a Tenupol electropolisher so that the hole is in the center of the area to be polished.

The Effects of Ion Implantation on the Surface Features of Inconel 600

1985 ◽  
Vol 43 ◽  
pp. 288-289
Author(s):  
John D. Rubio
Keyword(s):  
Grain Boundary ◽  
Ion Implantation ◽  
Nuclear Power ◽  
Power Plants ◽  
Surface Region ◽  
Selective Dissolution ◽  
Boundary Region ◽  
Near Surface ◽  
Inconel 600 ◽  
Steam Generator Tubing

The degradation of steam generator tubing at nuclear power plants has become an important problem for the electric utilities generating nuclear power. The material used for the tubing, Inconel 600, has been found to be succeptible to intergranular attack (IGA). IGA is the selective dissolution of material along its grain boundaries. The author believes that the sensitivity of Inconel 600 to IGA can be minimized by homogenizing the near-surface region using ion implantation. The collisions between the implanted ions and the atoms in the grain boundary region would displace the atoms and thus effectively smear the grain boundary.To determine the validity of this hypothesis, an Inconel 600 sample was implanted with 100kV N2+ ions to a dose of 1x1016 ions/cm2 and electrolytically etched in a 5% Nital solution at 5V for 20 seconds. The etched sample was then examined using a JEOL JSM25S scanning electron microscope.

Microstructural changes of Aluminum Nitride after laser irradiation and electroless copper deposition

1994 ◽  
Vol 52 ◽  
pp. 636-637
Author(s):  
S. Cao ◽  
A. J. Pedraza ◽  
L. F. Allard
Keyword(s):  
Aluminum Nitride ◽  
Laser Irradiation ◽  
Electroless Deposition ◽  
Thermal Evaporation ◽  
Surface Region ◽  
Near Surface ◽  
Laser Patterning ◽  
Electroless Copper ◽  
Excimer Laser Irradiation ◽  
Laser Effect

Excimer-laser irradiation strongly modifies the near-surface region of aluminum nitride (AIN) substrates. The surface acquires a distinctive metallic appearance and the electrical resistivity of the near-surface region drastically decreases after laser irradiation. These results indicate that Al forms at the surface as a result of the decomposition of the Al (which has been confirmed by XPS). A computer model that incorporates two opposing phenomena, decomposition of the AIN that leaves a metallic Al film on the surface, and thermal evaporation of the Al, demonstrated that saturation of film thickness and, hence, of electrical resistance is reached when the rate of Al evaporation equals the rate of AIN decomposition. In an electroless copper bath, Cu is only deposited in laser-irradiated areas. This laser effect has been designated laser activation for electroless deposition. Laser activation eliminates the need of seeding for nucleating the initial layer of electroless Cu. Thus, AIN metallization can be achieved by laser patterning followed by electroless deposition.

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