Recrystallization of Amorphous Silicon Using Rapid Thermal Processing, Laser Annealing and Furnace Heating

1994 ◽  
Vol 342 ◽  
Author(s):  
J. Viatella ◽  
R.K. Singi ◽  
R.P.S. Thiakur ◽  
G. Sandhu ◽  
S.D. Harkness
Keyword(s):  
Amorphous Silicon ◽  
Laser Annealing ◽  
Laser Wavelength ◽  
X Ray Diffraction ◽  
Incoherent Light ◽  
Furnace Annealing ◽  
X Ray ◽  
Pulsed Laser Annealing ◽  
Conventional Furnace ◽  
Transmission Electron

ABSTRACTRecrystallization of amorphous silicon has been investigated using conventional furnace annealing, incoherent light-based rapid thermal annealing (RTA) and pulsed laser annealing using excimner laser (wavelength=248 nm, energy density = 0.1−0.6 J/cm2) at a pulse width of approximately 20 nanoseconds. The effects of annealing methods are characterized for grain growth and crystallized orientation using transmission electron microscopy (TEM) and X-ray diffraction analysis. The various recrystallization methods are compared based on the structural properties of the resulting film and optimized thermal budgets for each heating mechanism are discussed.

Microstructure and superconducting properties of Y–Ba–Cu–O and Yb–Ba–Cu–O thin films formed by metalorganic deposition

1989 ◽  
Vol 4 (5) ◽  
pp. 1065-1071 ◽  
Author(s):  
Y. L. Chen ◽  
J. V. Mantese ◽  
A. H. Hamdi ◽  
A. L. Micheli
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Grain Size ◽  
Superconducting Properties ◽  
X Ray Diffraction ◽  
Furnace Annealing ◽  
X Ray ◽  
Conventional Furnace ◽  
Transmission Electron ◽  
Metalorganic Deposition

Thin films of Y–Ba–Cu–O and Yb–Ba–Cu–O, 0.5–1.5 μm in thickness, were deposited onto (211) and (100) SrTiO3 single crystal substrates by metalorganic deposition (MOD). After deposition the samples were annealed either by conventional furnace annealing or rapid thermal annealing (RTA). The microstructures of these films were then characterized by x-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and energy-dispersive x-ray spectrometry (EDS). Grain size of the annealed films varied from 0.25 to 1.0 μm. Improved superconducting properties were found for the RTA samples, compared to furnace annealing, and were attributed to larger grain size, little strontium diffusion into the thin films from the substrate, and highly preferred orientation of the 1:2:3 phase.

Influence of Annealing Methods on the Morphological and Optical Properties of Cu2O Nanoparticles Prepared by Chemical Bath Deposition

2021 ◽  
Vol 1021 ◽  
pp. 327-334
Author(s):  
Forat H. Alsultany
Keyword(s):  
Chemical Bath Deposition ◽  
Laser Annealing ◽  
Continuous Wave ◽  
Single Step ◽  
X Ray Diffraction ◽  
Furnace Annealing ◽  
X Ray ◽  
Glass Substrates ◽  
Annealing Temperatures ◽  
Conventional Furnace

In this work, the cuprous oxide (Cu2O) thin film on glass substrates were fabricated at low growth temperature by a single-step aqueous solution of chemical bath deposition method. In order to optimize optical and morphology quality, the effect of two different heat treatment methods are conventional furnace annealing process and continuous wave (CW) CO2 laser annealing technique were investigated. The effect of annealing temperatures on the properties of Cu2O thin films were systematically investigated by UV-Vis spectrophotometer, X-ray diffraction (XRD), and field emission scanning electron microscopy (FESEM).

Synchrotron X-Ray Study of the Structure of Silicon During Pulsed Laser Processing

1981 ◽  
Vol 4 ◽  
Author(s):  
B. C. Larson ◽  
C. W. White ◽  
T. S. Noggle ◽  
J. F. Barhorst ◽  
D. Mills
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
Temperature Profiles ◽  
X Ray Diffraction ◽  
Time Resolved ◽  
Near Surface ◽  
X Ray ◽  
Pulsed Laser Annealing ◽  
Pulsed Laser Processing ◽  
Thermal Melting

ABSTRACTSynchrotron x-ray pulses have been used to make nanosecond resolution time-resolved x-ray diffraction measurements on silicon during pulsed laser annealing. Thermal expansion analysis of near-surface strains during annealing has provided depth dependent temperature profiles indicating >1100°C temperatures and diffraction from boron implanted silicon has shown evidence for near-surface melting. These results are in qualitative agreement with the thermal melting model of laser annealing.

Pulsed Ion-Beam Induced Reactions of Ni And Co With Amorphous and Single Crystal Silicon

1984 ◽  
Vol 35 ◽  
Author(s):  
J. O. Olowolafe ◽  
R. Fastow
Keyword(s):  
Amorphous Silicon ◽  
Ion Beam ◽  
Single Crystal Silicon ◽  
Reaction Rates ◽  
Rutherford Backscattering ◽  
Thin Layers ◽  
X Ray Diffraction ◽  
Furnace Annealing ◽  
Crystal Silicon ◽  
Transmission Electron

ABSTRACTThin layers (~1,000 A ) of Ni and Co have been reacted with both (100) and amorphous silicon (a-Si) using a pulsed ion beam. Samples were analyzed using Rutherford backscattering, x-ray diffraction, and transmission electron microscopy. Rutherford backscattering showed that the metal/a-Si and metal/(100)-Si reaction rates were comparable. Both reactions began at the composition of the lowest eutectic. For comparison. furnace annealing of the same structures showed that the reaction rate of Ni with amorphous silicon was greater than with (100) Si; Co reacted nearly identically with both substrates. Diffraction data suggest that pulsed ion beam annealing crystallizes the amorphous silicon before the metal/a-Si reaction begins.

Nanosecond resolved X-ray diffraction during pulsed laser annealing of silicon

1983 ◽  
Vol 208 (1-3) ◽  
pp. 511-517 ◽  
Author(s):  
D.M. Mills ◽  
B.C. Larson ◽  
C.W. White ◽  
T.S. Noggle
Keyword(s):  
Laser Annealing ◽  
Pulsed Laser ◽  
X Ray Diffraction ◽  
X Ray ◽  
Pulsed Laser Annealing

Rapid Thermal Annealing of Composite TaSi2/n+ Poly-Si Silicide Films

1983 ◽  
Vol 23 ◽  
Author(s):  
D.L. Kwong ◽  
R. Kwor ◽  
B.Y. Tsaur ◽  
K. Daneshvar
Keyword(s):  
Electron Microscopy ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Annealed Sample ◽  
Vlsi Circuits ◽  
X Ray Diffraction ◽  
Furnace Annealing ◽  
X Ray ◽  
Transmission Electron ◽  
Average Grain Size

ABSTRACTThe formation of composite TaSi2/n+ Poly-Si silicide films through the use of rapid thermal annealing (RTA) is investigated by x-ray diffraction, four point probe, scanning Auger microprobes (SAM) with ion sputter etching, transmission electron microscopy (TEM), scanning electron microscopy (SEM), and capacitance-voltage (C-V) measurements. 0.2 μm polysilicon is deposited on oxidized Si wafer by LPCVD and doped with phosphorus. A layer of 2200 A TaSix is then co-sputtered on polysilicon samples from separate targets. These as-deposited films are then annealed by RTA in an argon ambient for 1 sec. and 10 sec. at various temperatures. X-ray diffraction and SAM results show the rapid formation of a uniform stoichiometric tantalum disilicide via Si migration from polysilicon. TEM micrographs show simlilar results for samples annealed at 1000°C in furnace for 30 min. or by RTA for 1 sec., exhibiting average grain size greater than 1000 A. Sheet resistance of samples annealed by furnace annealing and RTA are comparable. SEM micrographs indicate that the surface morphology of the RTA-annealed sample is superior to that obtained by furnace annealing. These results show that RTA may offer a practical solution to low-resistivity silicide formation in VLSI circuits.

Activation of Si-N Modes in Silicon by Pulsed Laser Annealing

1984 ◽  
Vol 35 ◽  
Author(s):  
H. J. Stein ◽  
P. S. Peercy ◽  
C. R. Hills
Keyword(s):  
Fine Structure ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Realistic Model ◽  
Vibrational Modes ◽  
Annealing Furnace ◽  
Furnace Annealing ◽  
Structure Defects ◽  
Pulsed Laser Annealing ◽  
Transmission Electron

ABSTRACTRetention and bonding of nitrogen implanted into crystalline Si were examined by infrared absorption (ir) and transmission electron microscopy (TEM) after furnace and pulsed laser annealing. Localized Si-N vibrational modes for N-N pairs are observed, and the associated ir band intensities increase upon pulsed annealing. Furnace annealing above 600°C decreases the ir intensity for N-N pairs and fine structure defects appear in TEM. Subsequent laser annealing removes most of the fine structure and reactivates the pair spectrum which we interpret as dissolution of N precipitates and pair formation upon quenching from the melt. Any realistic model for N in Si must include the formation and consequences of N-N pairs.

X-ray studies: CO2 pulsed laser annealing effects on the crystallographic properties, microstructures and crystal defects of vacuum-deposited nanocrystalline ZnSe thin films

CrystEngComm ◽  
2018 ◽  
Vol 20 (44) ◽  
pp. 7120-7129 ◽  
Author(s):  
Ahmed Saeed Hassanien ◽  
Alaa A. Akl
Keyword(s):  
Thin Films ◽  
Laser Annealing ◽  
Pulsed Laser ◽  
Crystal Defects ◽  
Microstructural Properties ◽  
X Ray Diffraction ◽  
X Ray ◽  
Pulsed Laser Annealing ◽  
Annealing Effects ◽  
Znse Thin Films

The influence of CO2 pulsed laser annealing on microstructural properties and crystal defects of nanocrystalline ZnSe thin films have been studied. X-ray diffraction was utilized to study these issues. Laser annealing led to enhance the film quality and decrease the crystal defects.

Transmission Electron Microscopy and X-Ray Diffraction Analysis of Aluminum-Induced Crystallization of Amorphous Silicon in α-Si:H/Al and Al/α-Si:H Structures

2005 ◽  
Vol 11 (2) ◽  
pp. 133-137 ◽  
Author(s):  
Ram Kishore ◽  
C. Hotz ◽  
H.A. Naseem ◽  
W.D. Brown
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Amorphous Silicon ◽  
Solid Phase ◽  
High Vacuum ◽  
Radiative Heating ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transmission Electron ◽  
Xrd Studies

Solid phase crystallization of plasma-enhanced chemical-vapor-deposited (PECVD) amorphous silicon (α-Si:H) in α-Si:H/Al and Al/α-Si:H structures has been investigated using transmission electron microscopy (TEM) and X-ray diffraction (XRD). Radiative heating has been used to anneal films deposited on carbon-coated nickel (Ni) grids at temperatures between 200 and 400°C for TEM studies. α-Si:H films were deposited on c-Si substrates using high vacuum (HV) PECVD for the XRD studies. TEM studies show that crystallization of α-Si:H occurs at 200°C when Al film is deposited on top of the α-Si:H film. Similar behavior was observed in the XRD studies. In the case of α-Si:H deposited on top of Al films, the crystallization could not be observed at 400°C by TEM and even up to 500°C as seen by XRD.

Electrical and Physical Properties of the Bi3.25La0.75Ti3O12 Ferroelectric Thin Films Prepared by Conventional Temperature Annealing Process

2012 ◽  
Vol 512-515 ◽  
pp. 1317-1320
Author(s):  
Fann Wei Yang ◽  
Kai Huang Chen ◽  
Chien Min Cheng
Keyword(s):  
Thin Films ◽  
Ferroelectric Properties ◽  
Sol Gel ◽  
Annealing Process ◽  
X Ray Diffraction ◽  
Si Substrate ◽  
Leakage Currents ◽  
Furnace Annealing ◽  
X Ray ◽  
Conventional Furnace

We have investigated the structure and ferroelectric properties of the Bi3.25La0.75Ti3O12 (BLT) thin films on SiO2/Si substrate fabricated by sol-gel method. We used the BLT films were annealed at various temperatures of 600, 650, and 700°C for one hour by conventional furnace annealing (CTA). The temperature dependence of leakage currents densities of ferroelectric BLT thin films. The crystalline structure of the prepared BLT thin films was analyzed by X-ray diffraction (XRD). Field emission scanning electron microscopy (FESEM) was used to observe the film thickness and the surface morphology including grain size and porosity. The leakage current density and capacitance of thin film were measured by HP4156C.

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