High Quality Ultrathin Gate Dielectrics Prepared by In-Situ RTP

1995 ◽  
Vol 387 ◽  
Author(s):  
L. K. Han ◽  
M. Bhat ◽  
J. Yan ◽  
D. Wristers ◽  
D. L. Kwong
Keyword(s):  
Gate Dielectric ◽  
Defect Density ◽  
Gate Dielectrics ◽  
Charge Trapping ◽  
Interface State ◽  
High Quality ◽  
Hot Carrier ◽  
Thermal Oxide ◽  
State Generation

AbstractThis paper reports on the formation of high quality ultrathin oxynitride gate dielectric by in-situ rapid thermal multiprocessing. Four such gate dielectrics are discussed here; (i) in-situ NO-annealed SiO2, (ii) N2O- or NO- or O2-grown bottom oxide/RTCVD SiO2/thermal oxide, (iii) N2O-grown bottom oxide/Si3N4/N2O-oxide (ONO) and (iv) N2O-grown bottom oxide/RTCVD SiO2/N2O-oxide. Results show that capacitors with NO-based oxynitride gate dielectrics, stacked oxynitride gate dielectrics with varying quality of bottom oxide (O2/N2O/NO), and the ONO structures show high endurance to interface degradation, low defect-density and high charge-to-breakdown compared to thermal oxide. The N2O-last reoxidation step used in the stacked dielectrics and ONO structures is seen to suppress charge trapping and interface state generation under Fowler-Nordheim injection. The stacked oxynitride gate dielectrics also show excellent MOSFET performance in terms of transconductance and mobility. While the current drivability and mobilities are found to be comparable to thermal oxide for N-channel MOSFET's, the hot-carrier immunity of N-channel MOSFET's with the N2O-oxide/CVD-SiO2/N2O-oxide gate dielectrics is found to be significantly enhanced over that of conventional thermal oxide.

Electrical Properties of Stacked RTO/RTCVD Oxides as Gate Dielectrics

1994 ◽  
Vol 342 ◽  
Author(s):  
V. Misra ◽  
X-L. Xu ◽  
J.J. Wortman
Keyword(s):  
Gate Dielectric ◽  
Defect Density ◽  
Gate Dielectrics ◽  
Electrical Characterization ◽  
Single Layer ◽  
Superior Performance ◽  
Potential Candidate ◽  
Thermal Budget ◽  
Thermal Oxide

ABSTRACTTo meet the stringent demands of high quality gate performance in advanced devices, a more robust gate dielectric is needed. A stacked structure consisting of thermal oxide and deposited oxide is a potential candidate since it offers certain advantages over single layer oxides such as 1) reduced defect density, 2) reduced stress at the SiO2/Si interface due to stress compensation between the thermal and the deposited oxide, 3) less silicon consumption and 4) reduced thermal budget. In this study, stacked oxides consisting of RTO and RTCVD oxides are characterized. In contrast to other studies which use conventional LPCVD methods to form the top oxide, these stacked oxides have the advantages of rapid thermal and in-situ processing, which produces excellent bulk and interfacial properties. Electrical characterization has shown that these stacked oxides have superior performance compared to single layer furnace or deposited oxides.

Low Temperature (850 °C) Two-Step N2O Annealed Thin Gate Oxides

1996 ◽  
Vol 428 ◽  
Author(s):  
Chao Sung Lai ◽  
Chung Len Lee ◽  
Tan Fu Lei ◽  
Tien Sheng Chao ◽  
Chun Hung Peng ◽  
...  
Keyword(s):  
Low Temperature ◽  
Gate Dielectric ◽  
Gate Dielectrics ◽  
Charge Trapping ◽  
Interface State ◽  
Constant Current ◽  
Short Channel ◽  
Gate Oxides ◽  
Current Stressing ◽  
State Generation

AbstractThe electrical characteristics of thin gate dielectrics prepared by low temperature (850 °C) two-step N20 nitridation (LTN) process are presented. The gate oxides were grown by wet oxidation at 800 °C and then annealed in N2O at 850 °C. The oxide with N2O anneal, even for low temperature (850 °C), had nitrogen incorporation at oxide/silicon interface. The charge trapping phenomena and interface-state generation (ΔDitm) induced by constant current stressing were reduced and charge-to-breakdown (Qbd) under constant current stressing was increased. This LTN oxynitride was used as gate dielectric for N-channel MOSFET, whose hot-canrier immunity was shown improved and reverse short channel effect (RSCE) was suppressed.

Ultrathin Gate Dielectric Growth at Reduced Pressure

1994 ◽  
Vol 342 ◽  
Author(s):  
Robert McIntosh ◽  
Carl Galewski ◽  
John Grant
Keyword(s):  
Gate Dielectric ◽  
Charge Trapping ◽  
Cmos Technology ◽  
Interface State ◽  
Constant Current ◽  
Reduced Pressure ◽  
Current Stress ◽  
Ultrathin Oxides ◽  
State Generation ◽  
Improved Characteristics

The Growth of ultrathin oxides in N2O ambient has been a subject of extensive research for submicron CMOS technology. Oxides grown in N2O tend to have a higher charge-to-breakdown, less charge trapping under constant current stress, and less interface state generation under current stress and radiation than conventional oxides grown in oxygen [1,2]. In addition the penetration of boron through N2O oxides is significantly less than through conventional thermal oxides [3]. The improved characteristics of N2O are due to an interfacial pileup of nitrogen atoms [1-3]. Thus the growth of thermal oxides in N2O provides a method for obtaining many of the more favorable aspects of reoxidized-nitrided silicon dioxides, with a much simpler process.

Gate Oxynitride Grown in N2O and Annealed in NO Using Rapid Thermal Processing

1995 ◽  
Vol 387 ◽  
Author(s):  
S. C. Sun ◽  
C. H. Chen ◽  
J. C. Lou ◽  
L. W. Yen ◽  
C. J. Lin
Keyword(s):  
Gate Dielectrics ◽  
Charge Trapping ◽  
Oxide Thickness ◽  
Interface State ◽  
No Oxidation ◽  
Nitrogen Accumulation ◽  
Electrical Stress ◽  
Wide Range ◽  
State Generation ◽  
Stress Induced Leakage Current

AbstractIn this paper a new technique for the formation of high quality ultrathin gate dielectrics is proposed. Gate oxynitride was first grown in N2O and then annealed by in-situ rapid thermal NO-nitridation. This approach has the advantage of providing a tighter nitrogen distribution and a higher nitrogen accumulation at or near the Si-SiO2 interface than either N2O oxynitride or nitridation of SiO2 in the NO ambient. It is applicable to a wide range of oxide thickness because the initial rapid thermal N2O oxidation rate is slow but not as self-limited as NO oxidation. The resulting gate dielectrics have reduced charge trapping, lower stress-induced leakage current and significant resistance to interface state generation under electrical stress

Ultra-thin Gate Oxide Prepared by Nitridation in ND3 for MOS Device Applications

2000 ◽  
Vol 611 ◽  
Author(s):  
Hyungshin Kwon ◽  
Hyunsang Hwang
Keyword(s):  
Gate Dielectric ◽  
Charge Trapping ◽  
Gate Oxide ◽  
Interface State ◽  
Nitridation Process ◽  
Reliability Characteristics ◽  
State Generation ◽  
Device Applications ◽  
Thin Gate Oxide ◽  
Mos Device

ABSTRACTThe electrical and reliability characteristics of ultra-thin gate oxide, annealed in ND3 gas, have been investigated. Compared with a control oxide, which had been annealed in NH3, the ND3-nitrided oxide exhibits a significant reduction in charge trapping and interface state generation. The improvement of electrical and reliability characteristics can be explained by the strong Si-D bond at the Si/SiO2 interface. This nitridation process of gate dielectric using ND3 has considerable potential for future ultra large scaled integration (ULSI) device applications.

Charge trapping and polarity dependence of interface state generation in nitrided oxide gate dielectric by electron photoinjection

1994 ◽  
Vol 30 (14) ◽  
pp. 1180-1181
Author(s):  
X.-J. Yuan ◽  
W. Eccleston ◽  
J. Mi ◽  
J.S. Marsland ◽  
D. Bouvet ◽  
...  
Keyword(s):  
Gate Dielectric ◽  
Charge Trapping ◽  
Interface State ◽  
State Generation

scholarly journals Investigation of the Impact of Hot-Carrier-Induced Interface State Generation on Carrier Mobility in nMOSFET

2021 ◽  
pp. 1-8
Author(s):  
Zhicheng Wu ◽  
Jacopo Franco ◽  
Brecht Truijen ◽  
Philippe Roussel ◽  
Ben Kaczer ◽  
...  
Keyword(s):  
Carrier Mobility ◽  
Interface State ◽  
Hot Carrier ◽  
State Generation ◽  
The Impact

Rapid Thermal Oxidation of Lightly Doped Silicon in N2O

1994 ◽  
Vol 342 ◽  
Author(s):  
S.C. Sun ◽  
L.S. Wang ◽  
F.L. Yeh ◽  
T.S. Lai ◽  
Y.H. Lin
Keyword(s):  
Growth Rate ◽  
Thermal Oxidation ◽  
Charge Trapping ◽  
Interface State ◽  
Constant Current ◽  
Mos Capacitor ◽  
Rapid Thermal Oxidation ◽  
Doped Silicon ◽  
State Generation ◽  
First Time

ABSTRACTIn this paper, a detailed study is presented for the growth kinetics of rapid thermal oxidation of lightly-doped silicon in N2O and O2 on (100), (110), and (111) oriented substrates. It was found that (110)-oriented Si has the highest growth rate in both N2O and dry O2, and (100) Si has the lowest rate. There is no “crossover” on the growth rate of rapid thermal N2O oxidation between (110) Si and (111) Si as compared to oxides grown in furnace N2O. Pressure dependence of rapid thermal N2O oxidation is reported for the first time. MOS capacitor results show that the low-pressure (40 Torr) N2O-grown oxides have much less interface state generation and charge trapping under constant current stress as compared to oxides grown in either 760 Torr N2O or O2 ambient.

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