The Nucleation of Crystalline TiSi2 Phases from Amorphous TiSix Layers and Interfacial Layers

1996 ◽  
Vol 441 ◽  
Author(s):  
R. T. Tung ◽  
K. Fujii ◽  
K. Kikuta ◽  
S. Chikaki ◽  
T. Kikkawa
Keyword(s):  
Single Crystal ◽  
Transformation Temperature ◽  
Interfacial Layers ◽  
Heavily Doped ◽  
Amorphous Si ◽  
P Type

AbstractSilicide reaction between co-deposited TiSix layers and Si was studied. It was shown that an amorphous TiSix layer, with x − 0.5–1, deposited between amorphous Si and the Ti film led to a significant reduction in the observed C49→C54 TiSis transformation temperature. Amorphous TiSix layers generated by the pre-deposition of Ti and pre-annealing also enhanced the nucleation of the C54-TiSi2 phase. The efficacy of the interfacial TiSix layer was demonstrated on undoped and heavily doped n- and p-type α-Si, but was found to be absent on single crystal Si. Possible mechanisms of these phenomena are discussed.

Broad temperature plateau for high ZTs in heavily doped p-type SnSe single crystals

2016 ◽  
Vol 9 (2) ◽  
pp. 454-460 ◽  
Author(s):  
Kunling Peng ◽  
Xu Lu ◽  
Heng Zhan ◽  
Si Hui ◽  
Xiaodan Tang ◽  
...  
Keyword(s):  
Fermi Level ◽  
Single Crystal ◽  
Single Crystals ◽  
Carrier Concentration ◽  
Heavily Doped ◽  
P Type ◽  
Temperature Plateau

The increased number of carrier pockets near the Fermi level and the optimized carrier concentration in doped SnSe single crystal can lead to a high averageZTave∼ 1.2 from 300 K to 800 K and a peakZTmaxvalue in excess of 2.0 at 800 K along the crystallographicb-axis.

Analysis of Defects in Heavily-Doped MBE-GaAs

1982 ◽  
Vol 14 ◽  
Author(s):  
C.B. Carter ◽  
D.M. Desimone ◽  
H.T. Griem ◽  
C.E.C. Wood
Keyword(s):  
Liquid Phase ◽  
Molecular Beam ◽  
Type Material ◽  
Grown Layer ◽  
Defect Clusters ◽  
Complex Defect ◽  
Heavily Doped ◽  
Rich Material ◽  
P Type ◽  
Very High

ABSTRACTGaAs Has Been Grown By Molecular-Beam Epitaxy (MBE) With Large Concentrations (∼1018CM−2) Of Sn, Si, Ge, And Mn As Dopants. The Heavily-Doped N-Type Material Has Been Found To Contain Regions Of A Very High Dislocation Density. An Analysis Of The Less Complex Defect Areas Shows That The Dislocations Originate In The MBE-Grown Layer. These Observations And Others On More Complex Defect Clusters Are Compared With Recent Studies Of Defects In Material Grown By Liquid Phase Epitaxy (LPE). The More Heavily Doped P-Type Material Contains Discs Of Mn-Rich Material At The Surface Of The MBEgrown Epilayer. Both The Structure And Composition Of These Regions Have Been Examined.

The effect of device geometry and crystal orientation on the stress-dependent offset voltage of 3C–SiC(100) four terminal devices

2015 ◽  
Vol 3 (34) ◽  
pp. 8804-8809 ◽  
Author(s):  
Afzaal Qamar ◽  
Hoang-Phuong Phan ◽  
Jisheng Han ◽  
Philip Tanner ◽  
Toan Dinh ◽  
...  
Keyword(s):  
Single Crystal ◽  
Crystal Orientation ◽  
Offset Voltage ◽  
Device Geometry ◽  
Stress Dependent ◽  
P Type ◽  
The Impact ◽  
First Time

This communication reports for the first time, the impact of device geometry on the stress-dependent offset voltage of single crystal p-type 3C–SiC four terminal devices.

scholarly journals Behavior of W and WSix Contact Metallization on n- and p- Type GaN

1999 ◽  
Vol 4 (S1) ◽  
pp. 684-690
Author(s):  
X. A. Cao ◽  
F. Ren ◽  
J. R. Lothian ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Annealing Temperature ◽  
Specific Contact Resistance ◽  
Ohmic Behavior ◽  
Contact Metallization ◽  
Specific Contact ◽  
Heavily Doped ◽  
Sputter Deposited ◽  
Optimum Annealing Temperature ◽  
P Type

Sputter-deposited W-based contacts on p-GaN (NA∼1018 cm−3) display non-ohmic behavior independent of annealing temperature when measured at 25°C. The transition to ohmic behavior occurs above ∼250°C as more of the acceptors become ionized. The optimum annealing temperature is ∼700°C under these conditions. These contacts are much more thermally stable than the conventional Ni/Au metallization, which shows a severely degraded morphology even at 700°C. W-based contacts may be ohmic as-deposited on very heavily doped n-GaN, and the specific contact resistance improves with annealing up to ∼900°C.

Epitaxial Growth of SixGe1−x Films on Si by Solid Phase Epitaxy.

1984 ◽  
Vol 37 ◽  
Author(s):  
C. S. Pai ◽  
S. S. Lau
Keyword(s):  
Phase Separation ◽  
Single Crystal ◽  
Epitaxial Growth ◽  
Ohmic Contacts ◽  
Solid Phase ◽  
Metal Layer ◽  
Alloyed Layer ◽  
Quaternary Compounds ◽  
Amorphous Si ◽  
Ion Backscattering

AbstractIt has been demonstrated in the literature that amorphous Si (or Ge) can be transported across a metal layer and grown epitaxially on Si(Ge) single crystal substrates in the solid phase. The objective of this study is to investigate if amorphous SixGe1−x mixtures can be transported uniformly across a medium and grown epitaxially on single crystal substrates without phase separation. The samples were prepared by e-beam evaporation of thin Pd films onto Si<100> substrates, followed by co-evaporation of SixGe1−x alloyed films (0<x<1) without breaking vacuum. The samples were anneaie in vacuum at 300°C to form a Pd silicide-germanide layer at the interface, then at 500°C for transport of the alloyed layer across the Pd silicide-germanide layer and subsequent epitaxial growth on Si substrate. The samples were investigated by x-ray diffraction and by MeV ion backscattering and channeling. The results show the alloyed film transports uniformly with no phase separation detected. The channeling result shows the grown alloyed layer is epitaxial with some Pd trapped in the layer. This simple technique is potentially useful for forming lattice-matched non-alloyed ohmic contacts on III–V ternary and quaternary compounds.

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