Relationship Between Structure and Electromigration Characteristics of Pure Aluminum Films

1997 ◽  
Vol 473 ◽  
Author(s):  
David P. Field ◽  
Oleg V. Kononenko ◽  
Victor N. Matveev
Keyword(s):  
Activation Energy ◽  
Pure Aluminum ◽  
Orientation Imaging Microscopy ◽  
Fiber Texture ◽  
Boundary Structure ◽  
Aluminum Films ◽  
Orientation Imaging ◽  
Grain Boundary Structure ◽  
High Fraction ◽  
Acceleration Potential

ABSTRACTAluminum films were deposited from a high purity aluminum source by the self-ion assisted technique onto oxidized silicon wafers with TiN sub-layers. The ions were accelerated toward the substrate by potentials of 0, 3 and 6 kV. The films were patterned into strips 670 μm long and 8 μm wide using photo-lithographic procedures and wet etching. Average drift velocities were measured in the films tested under electromigration conditions. Electromigration activation energy was obtained for the films. It was found that electromigration activation energy increased with the acceleration potential. The strength of the (111) fiber texture, however, decreased with the acceleration potential. Therefore, the weaker textures resulted in higher electromigration activation energies. These results can be explained in terms of grain boundary structure, which controls electromigration behavior. By using orientation imaging microscopy to characterize the structures, it was shown that the weaker textured specimens contained a high fraction of low angle and low diffusivity grain boundaries.

Interconnect Failure Dependence on Crystallographic Structure

1996 ◽  
Author(s):  
D.P. Field ◽  
J.A. Nucci ◽  
R.R. Keller
Keyword(s):  
Grain Boundary ◽  
Void Formation ◽  
Fiber Texture ◽  
Electron Back Scatter Diffraction ◽  
Boundary Structure ◽  
Experimental Fact ◽  
Crystallographic Structure ◽  
Orientation Imaging ◽  
Grain Boundary Structure ◽  
Interconnect Reliability

Abstract A wealth of literature has arisen in the past couple of decades regarding the phenomenon of electromigration. In addition, stress voiding has received considerable attention from the research community. Some of the work on the structural character of these phenomena has focussed on the roles of crystallographic texture and grain boundary structure. It is an experimental fact that the strength of the (111) fiber texture is an indication of interconnect reliability, the stronger the texture, the more reliable the interconnect. It is also presumed that grain boundary diffusivity is a controlling factor in electromigration behavior of polycrystalline lines. Undesirable grain boundary structure is likely a cause of failure in lines with a bamboo structure as well because they are often sites of stress concentration and local incompatibilities. The present study focuses upon electromigration failures in test structures of Al-Cu lines and stress voiding in Cu lines. Texture and grain boundary structure were measured directly on the specimens using electron back-scatter diffraction and orientation imaging. It is observed that a correlation exists between grain boundary structure and void formation in strongly textured polycrystalline lines. Results indicate that secondary orientation (not just the (111) fiber), and boundary structure may be of primary importance in optimizing interconnect microstructure.

Effect of Texture on Hillock Formation in Aluminum Films

2002 ◽  
Vol 721 ◽  
Author(s):  
T. Muppidi ◽  
Y. Kusama ◽  
D.P. Field
Keyword(s):  
Void Formation ◽  
Orientation Imaging Microscopy ◽  
Substrate Material ◽  
Boundary Structure ◽  
Aluminum Films ◽  
Thermal Expansion Coefficients ◽  
Grain Boundary Structure ◽  
The Difference ◽  
Interconnect Lines ◽  
Scanning Electron

AbstractStress voiding describes a phenomenon in thin interconnect lines where hillocks and voids are formed during thermal cycling due to the stresses caused by the difference in the thermal expansion coefficients of metal used in the interconnect lines and the substrate material. The effect of texture on stress voiding in aluminum interconnects is investigated using orientation imaging microscopy (OIM© ) and scanning electron microscopy. Aluminum films were deposited by PVD deposition onto sublayers of Ti and Ti plus TiN and were analyzed for crystallographic texture and grain boundary structure using OIM©. These films were later annealed at 400°C for 1 hour and cooled. The specimens were examined for the presence of hillocks and voids using a scanning electron microscope. The results show strongly textured (111) films are more resistant to hillock and void formation.

Rodrigues-Frank Space Representations of Fiber Texture

1995 ◽  
Vol 403 ◽  
Author(s):  
Krishna Rajan ◽  
Ronald Petkie
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Crystallographic Orientation ◽  
Fiber Texture ◽  
Boundary Structure ◽  
Structure Information ◽  
Grain Boundary Structure ◽  
Specific Determination

AbstractThe concept of fcc fiber texture is examined in the context of Rodrigues-Frank (R-F) representations. Using fiber texture in thin films as the basis of our analysis, it is shown that this approach when combined with grain specific determination of crystallographic orientation provides a useful means of detecting a number of texture components with relatively small grain sampling densities. The application of R-F representations is also shown to be a useful methodology to couple grain boundary structure information with microtexture data.

Observation of grain superstructure in thin aluminum films by orientation imaging microscopy

1995 ◽  
Vol 53 ◽  
pp. 436-437
Author(s):  
Roger Alvis ◽  
David Dingley ◽  
David Field
Keyword(s):  
Aluminum Alloy ◽  
Orientation Imaging Microscopy ◽  
Test Structure ◽  
Al Alloy ◽  
X Ray Diffraction ◽  
Aluminum Films ◽  
Orientation Imaging ◽  
Reliability Parameters ◽  
Transmission Electron ◽  
Thin Aluminum

The correlation of aluminum alloy reliability data to microstructure has long been the goal of those scientists seeking to model electromigration behavior of interconnects. Traditionally, microstructural information has been acquired through x-ray diffraction , and transmission electron microscopy (TEM). However, each of these techniques is capable of delivering only part of the characterization whole. We describe the application of orientation imaging microscopy (OIM) to thin aluminum alloy films and demonstrate its versatility in providing the key microstructural reliability parameters: namely texture and grain size, as well as providing insight to the microstructure of grain boundaries.OIM was performed on an electromigration test structure (figure 1). The Al-alloy was deposited on titanium and capped with an anti-reflective titanium nitride. Subsequently, the test structure was patterned and capped with a multilayer blanket consisting of silicon nitride (SiN), and SiO2. The structure was annealed after the SOG deposition at 450° C for 90 minutes, seeing no electrical stressing. The die was removed from the package and deprocessed before the OIM was acquired.

scholarly journals QUANTITATIVE CHARACTERIZATION OF MICROSTRUCTURE OF PURE COPPER PROCESSED BY ECAP

2013 ◽  
Vol 32 (2) ◽  
pp. 65 ◽  
Author(s):  
Ondřej Šedivý ◽  
Viktor Beneš ◽  
Petr Ponížil ◽  
Petr Král ◽  
Václav Sklenička
Keyword(s):  
Structural Parameters ◽  
Pure Copper ◽  
Orientation Imaging Microscopy ◽  
Grain Morphology ◽  
Grain Structure ◽  
Boundary Structure ◽  
Electron Backscattered Diffraction ◽  
Quantitative Characterization ◽  
Grain Boundary Structure

Orientation imaging microscopy (OIM) allows to measure crystallic orientations at the surface of the material. Digitalized data representing the orientations are processed to recognize the grain structure and they are visualized in crystal orientation maps. Analysis of the data firstly consists in recognition of grain boundaries followed by identification of grains themselves. Knowing the grain morphology it is possible to characterize the homogeneity of the structure and estimate structural parameters related to the physical properties of the material. The paper describes methods of imaging and quantitative characterization of the grain boundary structure in metals based on data from electron backscattered diffraction (EBSD).

Electromigration activation energy in pure aluminum films deposited by partially ionized beam technique

1995 ◽  
Vol 33 (12) ◽  
pp. 1981-1986 ◽  
Author(s):  
O.V. Kononenko ◽  
E.D. Ivanov ◽  
V.N. Matveev ◽  
I.I. Khodos
Keyword(s):  
Activation Energy ◽  
Pure Aluminum ◽  
Aluminum Films ◽  
Partially Ionized ◽  
Beam Technique

A comparative HVEM study of ICB-deposited aluminum films

1989 ◽  
Vol 47 ◽  
pp. 642-643
Author(s):  
K.H. Westmacott ◽  
U. Dahmen
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
High Resolution ◽  
Video Camera ◽  
Boundary Structure ◽  
Cluster Beam ◽  
Aluminum Films ◽  
Grain Boundary Structure ◽  
Potential Use

The Ionized Cluster Beam (ICB) technique pioneered by Takagi and colleagues in Kyoto is an exciting new method for depositing thin films possessing novel microstructures and unusual properties, (see for example Ref. 1 for a review of recent work). These materials are of interest not only for their potential use in electronic applications but also because of their eminent suitability for fundamental high resolution studies of grain boundary structureThe HVEM's at the National Center for Electron Microscopy are employed in a complementary fashion to characterize fully the microstructure of ICB deposited Al films. In-situ annealing studies of the films are conducted in the 1.5 MeV Kratos HVEM taking advantage of its heating stage, excellent specimen chamber vacuum (10-8 torr), and high resolution video camera. The increased penetration at 1.5 MeV allows different film thicknesses of Al film to be examined as well as the regions of the foil where the silicon substrate remains backing the Al film. High resolution studies of the atomic structure of grain boundaries are performed on the 1 MeV JEOL ARM using its unique tilting stage and ability to image structures at the 0.15 nm level.

Texture and Microstructure Variation in Severe Plastic Deformed OFHC Cu Wires

2007 ◽  
Vol 550 ◽  
pp. 509-514 ◽  
Author(s):  
Peter N. Kalu ◽  
Daudi R. Waryoba
Keyword(s):  
Isothermal Annealing ◽  
Inner Core ◽  
Outer Region ◽  
Orientation Imaging Microscopy ◽  
Direct Consequence ◽  
Fiber Texture ◽  
Nano Indentation ◽  
Orientation Imaging ◽  
Microhardness Data ◽  
Kinetics Of

The texture and microstructure resulting from heavily drawn and annealed oxygen-free high conducting (OFHC) copper wires have been investigated using several microscopical techniques including orientation imaging microscopy and nano-indentation. In the as-drawn condition, the microstructure and texture were heterogeneous across the wires, and consisted of three distinct concentric regimes: the inner core, the mid section, and the outer region. Whilst the microtexture of the inner core was dominated by a strong <111>+weak<100> duplex fiber texture, the mid section and the outer region had a comparatively weak fiber texture. Analysis using a Taylor-type viscoplasticity model revealed that the weak texture observed in this material was a direct consequence of shear deformation during drawing. The recrystallization kinetics of the wires upon isothermal annealing at various temperature was influenced by the deformation heterogeneity, and can be accurately described by a modified JMAK-Microhardness model. In this approach, the JMAK model is expressed in terms of microhardness data, from which the parameters of the different restoration kinetics were determined.

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