Integration of NiSi SALICIDE for Deep Submicron CMOS Technologies

1998 ◽  
Vol 514 ◽  
Author(s):  
X. W. Lin ◽  
N. Ibrahim ◽  
L. Topete ◽  
D. Pramanik
Keyword(s):  
Thin Films ◽  
Single Crystal ◽  
Sheet Resistance ◽  
Thermal Annealing ◽  
Cmos Technology ◽  
Deep Submicron ◽  
Thermal Budget ◽  
Si Substrates ◽  
Low Thermal Budget ◽  
Lower Resistivity

ABSTRACTA NiSi-based self-aligned silicidation (SALICIDE) process has been integrated into a 0.25 Ion CMOS technology. It involves rapid thermal annealing (RTA) of Ni thin films (300, Å thick) on Si substrates in the temperature range ≈400 - 700 °C. It was found that the NiSi sheet resistance (Rs) gradually decreases with decreasing linewidth. Parameters, such as RTA temperature, substrate dopant (As vs BF2) and structure (single crystal vs poly), were found to have little effects on Rs. NiSi forms a smoother interface with single crystalSi than with poly Si, and has a slightly lower resistivity. MOSFETs based on NiSi show comparable device characteristics to those obtained with Ti SALICIDE. Upon thermal annealing, NiSi remains stable at 450 °C for more than 39 hours. The same is true for 500 °C anneals up to 6 hours, except for NiSi narrow lines (<0.5 μm) on n+ poly Si substrates whose Rs is moderately increased after a 6 hr anneal. This work demonstrates that with an appropriate low-thermal budget backend process, NiSi SALICIDE can be a viable process for deep submicron ULSI technologies.

Self-Aligned Gate Metallization Processes with Low-Thermal Budget

1998 ◽  
Vol 514 ◽  
Author(s):  
X. W. Lin ◽  
M. Weling
Keyword(s):  
Sheet Resistance ◽  
A Priori ◽  
Cmos Technology ◽  
Deep Submicron ◽  
Complete Suppression ◽  
Metal Gate ◽  
Thermal Budget ◽  
Cmos Transistor ◽  
Novel Concept ◽  
Low Thermal Budget

ABSTRACTA novel concept for CMOS transistor gate metallization is described. It is featured with Gate Cloisonné, a process consisting of dielectric deposition over frontend transistors, followed by chemical mechanical polishing to re-expose the gate pattern on a planar dielectric background. Based on this concept, two metallization schemes have been developed. One is self-aligned metal gate process, which allows for low thermal budget gate metallization with element metals such as W and Al, resulting in a very low sheet resistance (< 1 Ω/sq). The other scheme is dual self-aligned silicidation, which enables decoupling of gate silicidation from that of source/drain silicon areas. Titanium based silicidation process is implemented to form thick silicide on narrow polysilicon gates and thin one over active silicon areas. Low gate sheet resistance (≈ 1.9Ω/sq) is achieved with complete suppression of linewidth effects. Both the metallization schemes are a priori scaleable to deep submicron technologies and suitable to fabricating ultra-shallow junction devices with very low gate sheet resistance. Both of them have been implemented in a 0.25-μm CMOS technology.

scholarly journals Tuning the Electrical Properties of NiO Thin Films by Stoichiometry and Microstructure

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 697
Author(s):  
Yu-He Liu ◽  
Xiao-Yan Liu ◽  
Hui Sun ◽  
Bo Dai ◽  
Peng Zhang ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Energy Loss ◽  
Single Crystal ◽  
Oxygen Stoichiometry ◽  
High Resistivity ◽  
Edge Structure ◽  
Glass Substrates ◽  
Lower Resistivity

Here, the electrical properties of NiO thin films grown on glass and Al2O3 (0001) substrates have been investigated. It was found that the resistivity of NiO thin films strongly depends on oxygen stoichiometry. Nearly perfect stoichiometry yields extremely high resistivity. In contrast, off-stoichiometric thin films possess much lower resistivity, especially for oxygen-rich composition. A side-by-side comparison of energy loss near the edge structure spectra of Ni L3 edges between our NiO thin films and other theoretical spectra rules out the existence of Ni3+ in NiO thin films, which contradicts the traditional hypothesis. In addition, epitaxial NiO thin films grown on Al2O3 (0001) single crystal substrates exhibit much higher resistivity than those on glass substrates, even if they are deposited simultaneously. This feature indicates the microstructure dependence of electrical properties.

Low-Thermal-Budget Solution Processing of Thin Films of Zinc Ferrite and Other Complex Oxides

2012 ◽  
Vol 1400 ◽  
Author(s):  
Ranajit Sai ◽  
Suresh D. Kulkarni ◽  
K. J. Vinoy ◽  
Navakanta Bhat ◽  
S. A. Shivashankar
Keyword(s):  
Thin Films ◽  
Zinc Ferrite ◽  
Film Deposition ◽  
Vacuum System ◽  
Molar Ratio ◽  
Large Area ◽  
Thermal Budget ◽  
Control Film ◽  
Circuit Components ◽  
Low Thermal Budget

ABSTRACTFurther miniaturization of magnetic and electronic devices demands thin films of advanced nanomaterials with unique properties. Spinel ferrites have been studied extensively owing to their interesting magnetic and electrical properties coupled with stability against oxidation. Being an important ferrospinel, zinc ferrite has wide applications in the biological (MRI) and electronics (RF-CMOS) arenas. The performance of an oxide like ZnFe2O4depends on stoichiometry (defect structure), and technological applications require thin films of high density, low porosity and controlled microstructure, which depend on the preparation process. While there are many methods for the synthesis of polycrystalline ZnFe2O4powder, few methods exist for the deposition of its thin films, where prolonged processing at elevated temperature is not required. We report a novel, microwave-assisted, low temperature (<100°C) deposition process that is conducted in the liquid medium, developed for obtaining high quality, polycrystalline ZnFe2O4thin films on technologically important substrates like Si(100). An environment-friendly solvent (ethanol) and non-hazardous oxide precursors (β-diketonates of Zn and Fe in 1:2 molar ratio), forming a solution together, is subjected to irradiation in a domestic microwave oven (2.45 GHz) for a few minutes, leading to reactions which result in the deposition of ZnFe2O4films on Si (100) substrates suspended in the solution. Selected surfactants added to the reactant solution in optimum concentration can be used to control film microstructure. The nominal temperature of the irradiated solution, i.e., film deposition temperature, seldom exceeds 100°C, thus sharply lowering the thermal budget. Surface roughness and uniformity of large area depositions (50x50 mm2) are controlled by tweaking the concentration of the mother solution. Thickness of the films thus grown on Si (100) within 5 min of microwave irradiation can be as high as several microns. The present process, not requiring a vacuum system, carries a very low thermal budget and, together with a proper choice of solvents, is compatible with CMOS integration. This novel solution-based process for depositing highly resistive, adherent, smooth ferrimagnetic films on Si (100) is promising to RF engineers for the fabrication of passive circuit components. It is readily extended to a wide variety of functional oxide films.

scholarly journals Incorporation of Iron Cations Into Epitaxial Sapphire Thin Films by CO-Evaporation and Subsequent Thermal Annealing

1994 ◽  
Vol 341 ◽  
Author(s):  
Ning Yu ◽  
Harriet Kung ◽  
Michael Nastasi ◽  
DeQuan Li
Keyword(s):  
Thin Films ◽  
Single Crystal ◽  
Thermal Annealing ◽  
Rutherford Backscattering Spectrometry ◽  
Ultra Violet ◽  
Cation Sublattice ◽  
Epitaxial Relationship ◽  
Cross Sectional ◽  
Simple Method ◽  
Subsequent Thermal Annealing

AbstractIron-doped sapphire thin films have been successfully epitaxially grown onto sapphire single crystal substrates by electron beam deposition and subsequent thermal annealing. Amorphous A12O3 thin films, about 280–390 nm thick, cation doped with iron have been deposited on [0001] oriented sapphire substrates. Iron doping with cation concentrations (a ratio of Fe content to total cation content) up to 5 at.% can be incorporated into the octahedral sites of Al-cation sublattice during the epitaxial regrowth process at 1000–1400 C, as determined by Rutherford Backscattering Spectrometry and ion channeling measurements. Cross-sectional Transmission Electron Microscopy shows the presence of two distinct regions in the annealed films. One exhibits the epitaxial relationship with the sapphire substrate and the second region has amorphous type of contrast. External optical transmittance measurements in the ultra violet and visible light range have exhibited the absorption associated with Fe3+. This study has demonstrated a simple method of incorporating dopants into single crystal sapphire, which has potential in the fabrications of thin film planar optical waveguiles.

Zone Melting Recrystallization of InSb Films on Oxidized Si Wafers

1983 ◽  
Vol 23 ◽  
Author(s):  
C.C. Wong ◽  
C.J. Keavney ◽  
H.A. Atwater ◽  
C.V. Thompson ◽  
H.I. Smith
Keyword(s):  
Thin Films ◽  
Single Crystal ◽  
Eutectic Structure ◽  
Zone Melting ◽  
Molten Zone ◽  
Si Substrates ◽  
Novel Device ◽  
Device Structures ◽  
Insb Thin Films ◽  
Selection Of

ABSTRACTInSb thin films on oxidized Si wafers have been recrystallized using a strip heater to generate and scan a narrow molten zone across the film. Grains up to 3 × 10 mm have been produced. Crystallization proceeds in a faceted cellular fashion, the excess solute (Sb) being rejected into subboundaries which often lie along low-index crystallographic directions. A InSb-Sb eutectic structure forms at the subboundaries. The width of the single-crystal InSb between subboundaries is approximately 75 μm. The techniques of planar constriction and subboundary entrainment have been extended to InSb for the selection of single grains and the orelocation of subboundaries. This technology of producing InSb thin films on oxidized Si substrates max, be extendable to other III-V materials, and could lead to novel device structures through the integration of Si and III-V compound devices on the same substrate.

TiSi2 Integrity within a Doped Silicide Process Step

1992 ◽  
Vol 279 ◽  
Author(s):  
G. M. Crean ◽  
P. D. Cole ◽  
J. Stoemenos
Keyword(s):  
Thin Films ◽  
Sheet Resistance ◽  
Silicon Substrate ◽  
Thermal Processing ◽  
Rutherford Backscattering Spectrometry ◽  
Cross Sectional ◽  
Process Step ◽  
Thermal Budget ◽  
Transmission Electron ◽  
Junction Formation

ABSTRACTDegradation of arsenic implanted titanium suicide (TiSi2) thin films as a result of thermal processing for shallow junction formation is investigated. Significant arsenic diffusion from the suicide overlayer into the silicon substrate has been detected by Rutherford Backscattering Spectrometry at drive-in temperatures > 1050°C. Cross-sectional transmission electron micrographs have shown the suicide film become increasingly non-uniform as the thermal budget increases, ultimately leading to discontinuities forming in the suicide film. This observed degradation of the titanium suicide film is also supported by sheet resistance measurements which show the film to degrade significantly above a threshold thermal budget

scholarly journals Mechanical Properties of 3C-SiC Films for MEMS Applications

2007 ◽  
Vol 1049 ◽  
Author(s):  
Jayadeep Deva Reddy ◽  
Alex A. Volinsky ◽  
Christopher L. Frewin ◽  
Chris Locke ◽  
Stephen E. Saddow
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Toughness ◽  
Silicon Carbide ◽  
Plastic Deformation ◽  
Elastic Modulus ◽  
Single Crystal ◽  
Elastic Contact ◽  
Si Substrates ◽  
Sic Films

AbstractThere is a technological need for hard thin films with high elastic modulus and fracture toughness. Silicon carbide (SiC) fulfills such requirements for a variety of applications at high temperatures and for high-wear MEMS. A detailed study of the mechanical properties of single crystal and polycrystalline 3C-SiC films grown on Si substrates was performed by means of nanoindentation using a Berkovich diamond tip. The thickness of both the single and polycrystalline SiC films was around 1-2 μm. Under indentation loads below 500 μN both films exhibit Hertzian elastic contact without plastic deformation. The polycrystalline SiC films have an elastic modulus of 457 GPa and hardness of 33.5 GPa, while the single crystalline SiC films elastic modulus and hardness were measured to be 433 GPa and 31.2 GPa, respectively. These results indicate that polycrystalline SiC thin films are more attractive for MEMS applications when compared with the single crystal 3C-SiC, which is promising since growing single crystal 3C-SiC films is more challenging.

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