Improving the Structural and Electrical Properties of Epitaxial CaF2 on Si By Rapid Thermal Anneaing

1985 ◽  
Vol 53 ◽  
Author(s):  
Julia M. Phillips ◽  
Mary L. Manger ◽  
Loren Pfeiffer ◽  
D. C. Joy ◽  
T. P. Smith ◽  
...  
Keyword(s):  
Molecular Beam ◽  
Crack Formation ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Bulk Single Crystal ◽  
Electrical Characteristics ◽  
Structural And Electrical Properties ◽  
Annealing Procedure

ABSTRACTRapid thermal annealing (RTA) has been shown to be a useful technique for improving the epitaxial quality of CaF2 films grown on Si(100) by molecular beam epitaxy. We have modified the annealing procedure to prevent crack formation, while still maintaining high film quality. Our work also shows RTA to be useful for improving the crystalline quality, chemical stability, and electrical characteristics of CaF2 films grown on Si(111). After RTA, the crystallinity of CaF2 films on Si(111), as measured by electron channeling, is indistinguishable from bulk single crystal CaF2, and the interface state density is reduced by nearly two orders of magnitude from that found in as-grown films.

Low Interface State Density Oxide-GaAs Structures Fabricated by In-Situ Molecular Beam Epitaxy

1996 ◽  
Vol 421 ◽  
Author(s):  
M. Passlack ◽  
M. Hong
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Molecular Beams ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
In Situ Deposition ◽  
Interface Recombination Velocity ◽  
Recombination Velocity

AbstractWe have extended the spectrum of molecular-beam epitaxy (MBE) related techniques by introducing in-situ deposition of oxides. The oxide films have been deposited on clean, atomically ordered (100) GaAs wafer surfaces using molecular beams of gallium-, magnesium-, silicon-, or aluminum oxide. Among the fabricated oxide-GaAs heterostructures, Ga2O3-GaAs interfaces exhibit unique electronic properties including an interface state density Dit in the low 1010 cm−2eV−1 range and an interface recombination velocity S of 4000 cm/s. The formation of inversion layers in both n- and p-type GaAs has been clearly established. Further, thermodynamic and photochemical stability of excellent electronic interface properties of Ga2O3-GaAs structures has been demonstrated.

In-Situ Etch to Improve Chemical Beam Epitaxy Regrown AlgaAs/GaAs Interfaces for HBT Applications

1996 ◽  
Vol 448 ◽  
Author(s):  
Y.M. Hsin ◽  
N. Y. Li ◽  
C. W. Tu ◽  
P. M. Asbeck
Keyword(s):  
Etching Rate ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Chemical Beam Epitaxy ◽  
Capacitance Voltage ◽  
Substrate Temperatures ◽  
Etching Effect

AbstractWe have studied the etching effect of AlxGa1-xAs (0≤ x ≤ 0.5) by trisdimethylaminoarsenic (TDMAAs) at different substrate temperatures, and the quality of the resulting etched/regrown GaAs interface. We find that the etching rate of AlxGa1-x As decreases with increasing Al composition, and the interface trap density of the TDMAAs etched/regrown interface can be reduced by about a factor of 10 as deduced from capacitance-voltage carrier profiles. A smooth surface morphology of GaAs with an interface state density of 1.4×l011 cm−2 can be obtained at a lower in-situ etching temperature of 550°C. Moreover, by using this in-situ etching the I-V characteristics of regrown p-n junctions of Al0.35Ga0.65As/Al0.25Ga0.75As and Al0.35Ga0.65As/GaAs can be improved.

Influence of Series Resistance and Interface State Density on Electrical Characteristics of Ru/Ni/n-GaN Schottky structure

2013 ◽  
Vol 13 (5) ◽  
pp. 492-499 ◽  
Author(s):  
M. Siva Pratap Reddy ◽  
Mi-Kyung Kwon ◽  
Hee-Sung Kang ◽  
Dong-Seok Kim ◽  
Jung-Hee Lee ◽  
...  
Keyword(s):  
Series Resistance ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Electrical Characteristics ◽  
Schottky Structure

scholarly journals Comprehension of Postmetallization Annealed MOCVD-TiO2on(NH4)2STreated III-V Semiconductors

2012 ◽  
Vol 2012 ◽  
pp. 1-10
Author(s):  
Ming-Kwei Lee ◽  
Chih-Feng Yen
Keyword(s):  
Dielectric Constant ◽  
Valence Band ◽  
Leakage Current ◽  
Chemical Vapor ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Organic Chemical ◽  
Electrical Characteristics ◽  
Current Densities

The electrical characteristics of TiO2films grown on III-V semiconductors (e.g., p-type InP and GaAs) by metal-organic chemical vapor deposition were studied. With (NH4)2S treatment, the electrical characteristics of MOS capacitors are improved due to the reduction of native oxides. The electrical characteristics can be further improved by the postmetallization annealing, which causes hydrogen atomic ion to passivate defects and the grain boundary of polycrystalline TiO2films. For postmetallization annealed TiO2on (NH4)2S treated InP MOS, the leakage current densities can reach2.7×10−7and2.3×10−7 A/cm2at±1 MV/cm, respectively. The dielectric constant and effective oxide charges are 46 and1.96×1012 C/cm2, respectively. The interface state density is7.13×1011 cm−2eV−1at the energy of 0.67 eV from the edge of valence band. For postmetallization annealed TiO2on (NH4)2S treated GaAs MOS, The leakage current densities can reach9.7×10−8and1.4×10−7at±1 MV/cm, respectively. The dielectric constant and effective oxide charges are 66 and1.86×1012 C/cm2, respectively. The interface state density is5.96×1011 cm−2eV−1at the energy of 0.7 eV from the edge of valence band.

Effect of GaAs Surface Stoichiometry on The Interface of As-Grown Epitaxial ZnSe/Epitaxial GaAs Heterostructures

1989 ◽  
Vol 161 ◽  
Author(s):  
J. Qiu ◽  
R.L. Gunshor ◽  
M. Kobayashi ◽  
D.R. Menke ◽  
Q.-D. Qian ◽  
...  
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Gaas Surface ◽  
Dramatic Reduction ◽  
Epitaxial Gaas ◽  
Capacitance Voltage ◽  
State Densities

ABSTRACTIn the study reported here, the GaAs surface stoichiometry was systematically varied prior to the nucleation of ZnSe to form epitaxial ZnSe/epitaxial GaAs interfaces. The structures were grown by molecular beam epitaxy and evaluated by several techniques including capacitance-voltage (C-V) measurements. A dramatic reduction of interface state density occurred when the GaAs epilayer was made As deficient. The resulting interface state densities of as-grown structures are comparable to values obtained with (Al,Ga)As/GaAs interfaces.

Thermodynamic and photochemical stability of low interface state density Ga2O3–GaAs structures fabricated by in situ molecular beam epitaxy

1996 ◽  
Vol 69 (3) ◽  
pp. 302-304 ◽  
Author(s):  
Matthias Passlack ◽  
Minghwei Hong ◽  
Joseph P. Mannaerts ◽  
Robert L. Opila ◽  
Fan Ren
Keyword(s):  
Molecular Beam Epitaxy ◽  
Molecular Beam ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Photochemical Stability

Interface-State-Density Evaluation of p-type and n-type Ge/GeNx Structures by Conductance Technique

2013 ◽  
Vol 133 (7) ◽  
pp. 1279-1284
Author(s):  
Takuro Iwasaki ◽  
Toshiro Ono ◽  
Yohei Otani ◽  
Yukio Fukuda ◽  
Hiroshi Okamoto
Keyword(s):  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Conductance Technique ◽  
Density Evaluation ◽  
P Type

Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with Non-Contact Test Techniques

1998 ◽  
Author(s):  
Tomasz Brozek ◽  
James Heddleson
Keyword(s):  
Vapor Deposition ◽  
Chemical Vapor ◽  
Interface State ◽  
State Density ◽  
Interface State Density ◽  
Wafer Surface ◽  
Oxide Charge ◽  
Contact Test ◽  
Deposition Power ◽  
Oxide Deposition

Abstract Use of non-contact test techniques to characterize degradation of the Si-SiO2 system on the wafer surface exposed to a plasma environment have proven themselves to be sensitive and useful in investigation of plasma charging level and uniformity. The current paper describes application of the surface charge analyzer and surface photo-voltage tool to explore process-induced charging occurring during plasma enhanced chemical vapor deposition (PECVD) of TEOS oxide. The oxide charge, the interface state density, and dopant deactivation are studied on blanket oxidized wafers with respect to the effect of oxide deposition, power lift step, and subsequent annealing.

Correlation between 1/fnoise and interface state density at the Fermi level in field‐effect transistors

1985 ◽  
Vol 57 (10) ◽  
pp. 4811-4813 ◽  
Author(s):  
Herman E. Maes ◽  
Sabir H. Usmani ◽  
Guido Groeseneken
Keyword(s):  
Fermi Level ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Interface State ◽  
State Density ◽  
Interface State Density
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