Analysis Of Sige Fet Device Structures On Silicon-on-sapphire Substrates by X-Ray Diffraction

1998 ◽  
Vol 533 ◽  
Author(s):  
P. M. Mooney ◽  
J. O. Chu ◽  
J. A. Ott ◽  
J. L. Jordan-Sweet ◽  
B. S. Meyerson ◽  
...  
Keyword(s):  
Field Effect Transistors ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Device Fabrication ◽  
Ultra High Vacuum ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sapphire Substrates ◽  
Wafer Cleaning ◽  
Device Structures

AbstractSi/Si1-xGex, heterostructures on improved silicon-on-sapphire substrates were grown epitaxially by ultra-high vacuum chemical vapor deposition for application as p-channel field effect transistors. High-resolution triple-axis x-ray diffraction was used to analyze these structures quantitatively and to evaluate the effects of device fabrication processes on them. Out-;diffusion of Ge from the Si1-xGex, quantum well was observed after fabrication as was the change in thickness of the Si cap layer due to wafer cleaning and gate oxidation at 875 °C

AlxGa1-xN-Based Materials and Heterostructures

1996 ◽  
Vol 449 ◽  
Author(s):  
P. Kung ◽  
A. Saxler ◽  
D. Walker ◽  
X. Zhang ◽  
R. Lavado ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Bragg Reflectors ◽  
X Ray Diffraction ◽  
Chemical Vapor Deposition Growth ◽  
X Ray ◽  
Sapphire Substrates ◽  
Transmission Electron ◽  
Dimensional Electron Gas ◽  
P Type

ABSTRACTWe present the metalorganic chemical vapor deposition growth, n-type and p-type doping and characterization of AlxGa1-xN alloys on sapphire substrates. We report the fabrication of Bragg reflectors and the demonstration of two dimensional electron gas structures using AlxGa1-xN high quality films. We report the structural characterization of the AlxGa1-xN / GaN multilayer structures and superlattices through X-ray diffraction and transmission electron microscopy. A density of screw and mixed threading dislocations as low as 107 cm-2 was estimated in AlxGa1-xN / GaN structures. The realization of AlxGa1-xN based UV photodetectors with tailored cut-off wavelengths from 365 to 200 nm are presented.

Structrual Characterization and Raman Scattering of Epitaxial Aluminum Nitride Thin Films on Si(111)

1992 ◽  
Vol 242 ◽  
Author(s):  
W. J. Meng ◽  
T. A. Perry ◽  
J. Heremans ◽  
Y. T. Cheng
Keyword(s):  
Thin Films ◽  
Aluminum Nitride ◽  
Raman Scattering ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
X Ray Diffraction ◽  
X Ray ◽  
Reactive Sputter Deposition ◽  
Transmission Electron ◽  
Substrate Temperatures

ABSTRACTThin films of aluminum nitride were grown epitaxially on Si(111) by ultra-high-vacuum dc magnetron reactive sputter deposition. Epitaxy was achieved at substrate temperatures of 600° C or above. We report results of film characterization by x-ray diffraction, transmission electron microscopy, and Raman scattering.

Oxidation of Gallium Nitride Epilayers in Dry Oxygen

1999 ◽  
Vol 595 ◽  
Author(s):  
P. Chen ◽  
R. Zhang ◽  
X.F. Xu ◽  
Z.Z. Chen ◽  
Y.G. Zhou ◽  
...  
Keyword(s):  
Diffusion Mechanism ◽  
Chemical Vapor ◽  
Oxide Surface ◽  
Layer By Layer ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sapphire Substrates ◽  
Different Temperatures ◽  
Diffraction Peaks ◽  
And Diffusion

AbstractThe oxidation of GaN epilayers in dry oxygen has been studied. The 1-μm-thick GaN epilayers grown on (0001) sapphire substrates by Rapid-Thermal-Processing/Low Pressure Metalorganic Chemical Vapor Deposition were used in this work. The oxidation of GaN in dry oxygen was performed at various temperatures for different time. The oxide was identified as the monoclinic β-Ga2O3 by a θ-2θ scan X-ray diffraction (XRD). The scanning electron microscope observation shows a rough oxide surface and an expansion of the volume. XRD data also showed that the oxidation of GaN began to occur at 800°C. The GaN diffraction peaks disappeared at 1050°C for 4 h or at 1100°C for 1 h, which indicates that the GaN epilayers has been completely oxidized. From these results, it was found that the oxidation of GaN in dry oxygen was not layer-by-layer and limited by the interfacial reaction and diffusion mechanism at different temperatures.

In-Situ Doped Multi-Layer Epitaxial Structures with Abrupt Doping Transitions by Ultra High Vacuum Rapid Thermal Chemical Vapor Deposition (UHV-RTCVD)

1994 ◽  
Vol 342 ◽  
Author(s):  
Mehmet C. ÅztÖjrk ◽  
S. Muhsin ◽  
Ibrahim Ban ◽  
Gari Harris ◽  
Mahesh K. Sanganeria ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Field Effect Transistors ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Gate Oxide ◽  
Ultra High Vacuum ◽  
Dopant Diffusion ◽  
Short Channel ◽  
Doping Density

ABSTRACTIn this work, we have studied boron doped multi-layer epitaxial structures as active regions of deep submicron (< 0.25 gtm)metal oxide silicon field effect transistors (MOSFETs).The structures were formed by ultra high vacuum chemical vapor deposition (UHV-RTCVD) using Si2H6 and B2H6 as the source gases and H2 as the carrier gas at 750°C - 800°C and at a total pressure of 80 mTorr. With the high growth rates provided by Si2H6, thermal budgets were kept below the limit of boron diffusion in Si resulting in extremely abrupt doping transitions pushing the depth resolution limits of secondary ion mass spectroscopy. The structures consist of three epitaxial layers with thicknesses ranging from 100 A to 625 T. The top layer on which the gate oxide is formed is lightly doped (lxl016 cm-3) to minimize vertical electrical field and ionized impurity scattering for higher MOSFET channel mobility. The second layer is doped to lx1018 cm-3 for suppression of punchthrough short channel effects and finally the third layer is doped to lx 1017 cm-3 to decrease the parasitic source/drain junction capacitance that will result from the relatively high doping density of the intermediate layer. To minimize dopant diffusion in Si, low temperature (or low thermal budget) processes were employed for gate oxidation and polysilicon implant activation. A typical source/drain activation anneal was also included in sample preparation in order to simulate complete MOSFET fabrication assuming remaining steps could be carried out at lower temperatures with little contribution to dopant diffusion. Our results indicate that after all process steps a lightly doped region can still be obtained under the gate oxide with sufficient thickness to contain the MOSFET inversion layer. In these structures, the threshold voltage is determined by the doping density and thickness of the top two layers and can be easily tailored to the desired value by optimizing these parameters. With the range of parameters used in this study, our measurements show threshold voltages within the range desired for 0.1 µm MOSFETs.

High Resolution X-ray Diffraction of GaN Grown on Sapphire Substrates

1996 ◽  
Vol 449 ◽  
Author(s):  
A. Saxler ◽  
M. A. Capano ◽  
W. C. Mitchel ◽  
P. Kung ◽  
X. Zhang ◽  
...  
Keyword(s):  
Metalorganic Chemical Vapor Deposition ◽  
Reciprocal Lattice ◽  
Chemical Vapor ◽  
Lattice Points ◽  
Structural Quality ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sapphire Substrates ◽  
Primary Mechanism

ABSTRACTX-ray rocking curves are frequently used to assess the structural quality of GaN thin films. In order to understand the information given by the line shape, we need to know the primary mechanism by which the curves are broadened. The GaN films used in this study were grown by low pressure metalorganic chemical vapor deposition (MOCVD) on (00•1) sapphire substrates. GaN films with both broad and very narrow (open detector linewidth of 40 arcseconds for the (00•2) GaN reflection) rocking curves are examined in this work. Reciprocal space maps of both symmetric and asymmetric reciprocal lattice points are used to determine that the cause of the broadening of GaN rocking curves is a limited in-plane coherence length.

One-Step Cost-Effective Growth of High-Quality Epitaxial Ge Films on Si (100) Using a Simplified PECVD Reactor

2021 ◽  
Vol 2 (4) ◽  
pp. 482-494
Author(s):  
Jignesh Vanjaria ◽  
Venkat Hariharan ◽  
Arul Chakkaravarthi Arjunan ◽  
Yanze Wu ◽  
Gary S. Tompa ◽  
...  
Keyword(s):  
Film Growth ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Cost Effective ◽  
Single Step ◽  
Film Deposition ◽  
Ultra High Vacuum ◽  
Ex Situ ◽  
High Quality ◽  
X Ray

Heteroepitaxial growth of Ge films on Si is necessary for the progress of integrated Si photonics technology. In this work, an in-house assembled plasma enhanced chemical vapor deposition reactor was used to grow high quality epitaxial Ge films on Si (100) substrates. Low economic and thermal budget were accomplished by the avoidance of ultra-high vacuum conditions or high temperature substrate pre-deposition bake for the process. Films were deposited with and without plasma assistance using germane (GeH4) precursor in a single step at process temperatures of 350–385 °C and chamber pressures of 1–10 Torr at various precursor flow rates. Film growth was realized at high ambient chamber pressures (>10−6 Torr) by utilizing a rigorous ex situ substrate cleaning process, closely controlling substrate loading times, chamber pumping and the dead-time prior to the initiation of film growth. Plasma allowed for higher film deposition rates at lower processing temperatures. An epitaxial growth was confirmed by X-Ray diffraction studies, while crystalline quality of the films was verified by X-ray rocking curve, Raman spectroscopy, transmission electron microscopy and infra-red spectroscopy.

Low Temperature Tungsten Deposition by Arf-Laser Induced Photo-CVD

1990 ◽  
Vol 181 ◽  
Author(s):  
Rutger L. Krans ◽  
Arjan Berntsen ◽  
Wim C. Sinke
Keyword(s):  
High Vacuum ◽  
Chemical Vapor ◽  
Vacuum System ◽  
Nuclear Reaction Analysis ◽  
Direct Relation ◽  
X Ray Diffraction ◽  
X Ray ◽  
Arf Excimer Laser ◽  
Thick Layers ◽  
Better Than

ABSTRACTLaser-induced Chemical Vapor Deposition of tungsten on Si(100) using WF6 and H2 has been investigated using a high-vacuum system comprising a cold-wall reactor. The activation source is a pulsed ArF-excimer laser. The deposition rate depends linearly on the repetition rate, when H2 is used as a reducing agent. When no H2 is used the laser radiation suppresses deposition.At deposition temperatures down to 200 °C laser deposited layers have resistivities better than 20 μΩ cm. Thick layers have resistivities down to 8 μΩ cm. There is a direct relation between layer thickness and resistivity. X-ray diffraction revealed the layers to consist of α-tungsten. β-tungsten was only obtained for those thermally deposited layers where growth was slower than expected.Nuclear reaction analysis of fluorine showed that most fluorine is present near the W-Si interface, and that the amount of fluorine relative to the amount of tungsten in the layer decreases markedly with deposition temperature.

scholarly journals Oxidation of Gallium Nitride Epilayers in Dry Oxygen

2000 ◽  
Vol 5 (S1) ◽  
pp. 866-872 ◽  
Author(s):  
P. Chen ◽  
R. Zhang ◽  
X.F. Xu ◽  
Z.Z. Chen ◽  
Y.G. Zhou ◽  
...  
Keyword(s):  
Diffusion Mechanism ◽  
Chemical Vapor ◽  
Oxide Surface ◽  
Layer By Layer ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sapphire Substrates ◽  
Different Temperatures ◽  
Diffraction Peaks ◽  
And Diffusion

The oxidation of GaN epilayers in dry oxygen has been studied. The 1-µm-thick GaN epilayers grown on (0001) sapphire substrates by Rapid-Thermal-Processing/Low Pressure Metalorganic Chemical Vapor Deposition were used in this work. The oxidation of GaN in dry oxygen was performed at various temperatures for different time. The oxide was identified as the monoclinic β-Ga2O3 by a θ−2θ scan X-ray diffraction (XRD). The scanning electron microscope observation shows a rough oxide surface and an expansion of the volume. XRD data also showed that the oxidation of GaN began to occur at 800°C. The GaN diffraction peaks disappeared at 1050°C for 4 h or at 1100°C for 1 h, which indicates that the GaN epilayers has been completely oxidized. From these results, it was found that the oxidation of GaN in dry oxygen was not layer-by-layer and limited by the interfacial reaction and diffusion mechanism at different temperatures.

Thermodynamically Stable Conducting Films of Intermetallic PtGa2 on Gallium Arsenide

1988 ◽  
Vol 144 ◽  
Author(s):  
Larry P. Sadwick ◽  
Kang L. Wang ◽  
David K. Shuh ◽  
Young K. Kim ◽  
R. Stanley Williams
Keyword(s):  
Gallium Arsenide ◽  
Photoelectron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
X Ray Diffraction ◽  
X Ray ◽  
Gaas Substrates ◽  
Suitable Temperature

ABSTRACTThe first epitaxial platinum gallium two (PtGa2) films have been grown on gallium arsenide (GaAs) (100) by co-evaporation of the elements under ultra-high vacuum conditions. An electron beam evaporator and a Knudsen cell were used to produce the platinum and gallium beams, respectively. The resulting films and bulk PtGa2 have been characterized by x-ray diffraction, Auger electron spectroscopy, and x-ray photoelectron spectroscopy. The data confirm the PtGa2 stoichiometry and crystal structure of the films, and demonstrate their chemical stability on GaAs (100). This study supports the contention that PtGa2 can be a suitable, temperature stable contact material on GaAs substrates.

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