Interface Interstitial Recombination Rate and the Reverse Short Channel Effect

1999 ◽  
Vol 568 ◽  
Author(s):  
M.E. Rubin ◽  
S. Saha ◽  
J. Lutze ◽  
F. Nouri ◽  
G. Scott ◽  
...  

ABSTRACTExperiment shows that the reverse short channel effect (RSCE) in nMOS devices is critically impacted by the inclusion of nitrogen in the gate oxide. A higher concentration of nitrogen results in a lessened RSCE, i.e. more threshold voltage rolloff for smaller gate lengths. We propose that the additional nitrogen reduces the interstitial recombination rate at the interface, resulting in a smaller interstitial flux and therefore less transient enhanced diffusion (TED) of boron to that interface. To test this hypothesis, we simulate boron redistribution in one and two dimensional MOS capacitor structures, as well as full nMOS devices. We then present simulations calibrated to a 0.2 pim technology currently in production.

Author(s):  
Yuk L. Tsang ◽  
Xiang D. Wang ◽  
Reyhan Ricklefs ◽  
Jason Goertz

Abstract In this paper, we report a transistor model that has successfully led to the identification of a non visual defect. This model was based on detailed electrical characterization of a MOS NFET exhibiting a threshold voltage (Vt) of just about 40mv lower than normal. This small Vt delta was based on standard graphical extrapolation method in the usual linear Id-Vg plots. We observed, using a semilog plot, two slopes in the Id-Vg curves with Vt delta magnified significantly in the subthreshold region. The two slopes were attributed to two transistors in parallel with different Vts. We further found that one of the parallel transistors had short channel effect due to a punch-through mechanism. It was proposed and ultimately confirmed the cause was due to a dopant defect using scanning capacitance microscopy (SCM) technique.


1997 ◽  
Vol 490 ◽  
Author(s):  
Julie Y. H. Lee ◽  
Tom C. H. Lee ◽  
Mike Embry ◽  
Keenan Evans ◽  
Dan Koch ◽  
...  

ABSTRACTThis study calculates the threshold voltage (VT) roll-off behavior caused by short channel effect (SCE) as a result of scaling and the reverse short-channel effect (RSCE) due to B segregation around source and drain junctions by using the 2D device simulator - SILVACO™-ATLAS. The simulation results are comparable with the experimental data. It suggests that the drift diffusion physics can predict SCE and RSCE very well to sub-0.25μ Si n-MOSFET devices. The modeling results indicate the VT roll off at shorter channel length for devices with higher substrate doping concentration. VT increases if the local p-dopant segregation exists around the source and drain junction. It is observed that RSCE is more significant for devices with lower substrate doping concentration and shorter channel length.


2006 ◽  
Vol 912 ◽  
Author(s):  
Benjamin Dumont ◽  
Arnaud Pouydebasque ◽  
Bartek Pawlak ◽  
Benjamin Oudet ◽  
Dominique Delille ◽  
...  

AbstractThis work demonstrates the efficiency of a Germanium and Carbon co-implantation that suppresses the Boron Transient Enhanced Diffusion, enhances Boron activation and enables large improvement of Short Channel Effects in PMOS devices while maintaining drive current performances. We present here 65/45nm node devices on conventional bulk substrates featuring Germanium and Carbon engineered shallow junctions that enable to reduce the Drain Induced Barrier Lowering compared to devices implanted only with Boron. This improvement is attributed to the suppression of Boron channelling with Ge pre-amorphization (PAI), and to the reduction of Boron TED due to the trapping of interstitial defects by Carbon with Germanium PAI.


1995 ◽  
Vol 38 (3) ◽  
pp. 567-572 ◽  
Author(s):  
Junko Tanaka ◽  
Toru Toyabe ◽  
Hitoshi Matsuo ◽  
Sigeo Ihara ◽  
Hiroo Masuda ◽  
...  

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