Physical model of threshold voltage in silicon MOS transistors including reverse short channel effect

1995 ◽  
Vol 31 (5) ◽  
pp. 411-412 ◽  
Author(s):  
H. Brut ◽  
G. Ghibaudo ◽  
A. Juge
Author(s):  
Yuk L. Tsang ◽  
Xiang D. Wang ◽  
Reyhan Ricklefs ◽  
Jason Goertz

Abstract In this paper, we report a transistor model that has successfully led to the identification of a non visual defect. This model was based on detailed electrical characterization of a MOS NFET exhibiting a threshold voltage (Vt) of just about 40mv lower than normal. This small Vt delta was based on standard graphical extrapolation method in the usual linear Id-Vg plots. We observed, using a semilog plot, two slopes in the Id-Vg curves with Vt delta magnified significantly in the subthreshold region. The two slopes were attributed to two transistors in parallel with different Vts. We further found that one of the parallel transistors had short channel effect due to a punch-through mechanism. It was proposed and ultimately confirmed the cause was due to a dopant defect using scanning capacitance microscopy (SCM) technique.


1999 ◽  
Vol 568 ◽  
Author(s):  
M.E. Rubin ◽  
S. Saha ◽  
J. Lutze ◽  
F. Nouri ◽  
G. Scott ◽  
...  

ABSTRACTExperiment shows that the reverse short channel effect (RSCE) in nMOS devices is critically impacted by the inclusion of nitrogen in the gate oxide. A higher concentration of nitrogen results in a lessened RSCE, i.e. more threshold voltage rolloff for smaller gate lengths. We propose that the additional nitrogen reduces the interstitial recombination rate at the interface, resulting in a smaller interstitial flux and therefore less transient enhanced diffusion (TED) of boron to that interface. To test this hypothesis, we simulate boron redistribution in one and two dimensional MOS capacitor structures, as well as full nMOS devices. We then present simulations calibrated to a 0.2 pim technology currently in production.


1997 ◽  
Vol 490 ◽  
Author(s):  
Julie Y. H. Lee ◽  
Tom C. H. Lee ◽  
Mike Embry ◽  
Keenan Evans ◽  
Dan Koch ◽  
...  

ABSTRACTThis study calculates the threshold voltage (VT) roll-off behavior caused by short channel effect (SCE) as a result of scaling and the reverse short-channel effect (RSCE) due to B segregation around source and drain junctions by using the 2D device simulator - SILVACO™-ATLAS. The simulation results are comparable with the experimental data. It suggests that the drift diffusion physics can predict SCE and RSCE very well to sub-0.25μ Si n-MOSFET devices. The modeling results indicate the VT roll off at shorter channel length for devices with higher substrate doping concentration. VT increases if the local p-dopant segregation exists around the source and drain junction. It is observed that RSCE is more significant for devices with lower substrate doping concentration and shorter channel length.


1995 ◽  
Vol 38 (3) ◽  
pp. 567-572 ◽  
Author(s):  
Junko Tanaka ◽  
Toru Toyabe ◽  
Hitoshi Matsuo ◽  
Sigeo Ihara ◽  
Hiroo Masuda ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 613-616
Author(s):  
Tomoyasu Ishii ◽  
Shinichiro Kuroki ◽  
Hiroshi Sezaki ◽  
Seiji Ishikawa ◽  
Tomonori Maeda ◽  
...  

Submicron 4H-SiC MOSFETs are attractive for high frequency operation of 4H-SiC integrated circuits. However, the short channel effects, such as threshold voltage lowering, would be induced at the short-channel devices. In this work, short channel effects were investigated with planar and trench 4H-SiC MOSFETs, and the suppression of the short channel effect with the trench structure was achieved.


1991 ◽  
Vol 34 (6) ◽  
pp. 605-608 ◽  
Author(s):  
S.T. Hsu ◽  
I.H. Kalish ◽  
K. Suzuki ◽  
R. Kawabata ◽  
H. Shibayama

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