Interface State Densities for SiNx: H on Cleaved GaAs and InP(110)

1999 ◽  
Vol 573 ◽  
Author(s):  
D. Landheer ◽  
J. E. Hulse ◽  
K. Rajesh
Keyword(s):  
Silicon Nitride ◽  
Electron Cyclotron Resonance ◽  
High Vacuum ◽  
Chemical Vapour ◽  
Low Frequency ◽  
Processing System ◽  
Interface State ◽  
Ultra High Vacuum ◽  
Interface Control ◽  
State Densities

ABSTRACTSilicon nitride was deposited in-situ by electron-cyclotron resonance plasma chemical-vapour deposition (ECR-CVD) on (110) surfaces formed by cleaving GaAs and InP(100) substrates in an ultra-high vacuum processing system. Capacitors formed by depositing Al gates on the facet surfaces were analyzed by the high-low frequency capacitance-voltage (CV) technique. The minimum interface-state densities obtained for the cleaved GaAs (110) surfaces were 1–2 × 1012 eV−1cm−2. For cleaved InP facets the measured minimum interface state densities were a factor of two higher; however, they exhibited a smaller hysteresis in the CV characteristics and a smaller modulation in the surface potential. The interface state densities did not change significantly for the GaAs(110) facets if a Si interface control layer 0.8–2 nm thick was deposited prior to silicon nitride deposition; however, a larger effect was observed for the hysteresis and flatband voltage shift of the CV characteristics. The effect of annealing on the interfaces with Si was investigated and the performance compared with published results for GaAs(100) surfaces prepared by molecular-beam epitaxy.

Properties of Gate-Quality SiO2 Films Prepared by Electron Cyclotron Resonance Chemical Vapour Deposition in an Ultrahigh Vacuum Processing System

1995 ◽  
Vol 386 ◽  
Author(s):  
Y. Tao ◽  
D. Landheer ◽  
J. E. Hulse ◽  
D.-X. Xu ◽  
T. Quance
Keyword(s):  
Chemical Vapour Deposition ◽  
Cyclotron Resonance ◽  
Vapour Deposition ◽  
Electron Cyclotron Resonance ◽  
High Vacuum ◽  
Chemical Vapour ◽  
Processing System ◽  
Electron Cyclotron ◽  
Ultra High Vacuum ◽  
Ex Situ

ABSTRACTWe have prepared thin SiO2 layers on Si(100) wafers by electron cyclotron resonance chemical vapour deposition (ECR-CVD) in a multi-chamber ultra-high vacuum (UHV) processing system. The oxides were characterized in-situ by single wavelength ellipsometry (SWE) and x-ray photoelectron spectroscopy (XPS) and ex-situ by Fourier transform infra-red spectroscopy (FTIR), spectroscopic ellipsometry (SE) and capacitance-voltage (CV) electrical measurements. Films deposited at higher pressures, low powers and low silane flow rates had excellent physical and electrical properties. Films deposited at 400 °C had better physical properties than those of thermal oxides grown in dry oxygen at 700 °C. A 1 minute anneal at 950 °C reduced the fast interface state density from 1.2×1011 to 7×1010 eV−1cm−2

Low- and High-Frequency C–V Characteristics of Au/n-GaN/n-GaAs

2018 ◽  
Vol 18 (06) ◽  
pp. 1850039
Author(s):  
Abderrezzaq Ziane ◽  
Mohamed Amrani ◽  
Abdelaziz Rabehi ◽  
Zineb Benamara
Keyword(s):  
Schottky Diode ◽  
High Frequency ◽  
High Vacuum ◽  
Low Frequency ◽  
Interface State ◽  
Interface States ◽  
State Density ◽  
Ultra High Vacuum ◽  
Active Nitrogen ◽  
Capacitance Voltage

Au/GaN/GaAs Schottky diode created by the nitridation of n-GaAs substrate which was exposed to a flow of active nitrogen created by a discharge source with high voltage in ultra-high vacuum with two different thicknesses of GaN layers (0.7[Formula: see text]nm and 2.2[Formula: see text]nm), the I–V and capacitance–voltage (C–V) characteristics of the Au/n-GaN/n-GaAs structures were studied for low- and high-frequency at room temperature. The measurements of I–V of the Au/n-GaN/n-GaAs Schottky diode were found to be strongly dependent on bias voltage and nitridation process. The electrical parameters are bound by the thickness of the GaN layer. The capacitance curves depict a behavior indicating the presence of interface state density, especially in the low frequency. The interface states density was calculated using the high- and low-frequency capacitance curves and it has been shown that the interface states density decreases with increasing of nitridation of the GaAs.

Deposition of Iron on Si(111)-(7×7): Photo- and Electron-Assisted Decomposition of Fe(CO)5

1986 ◽  
Vol 75 ◽  
Author(s):  
J. R. Swanson ◽  
C. M. Friend ◽  
Y. J. Chabal
Keyword(s):  
Auger Electron ◽  
Silicon Crystal ◽  
High Vacuum ◽  
Low Frequency ◽  
Temperature Programmed Desorption ◽  
Thermal Reaction ◽  
Ultra High Vacuum ◽  
Temperature Programmed ◽  
Ultraviolet Photons ◽  
Induced Decomposition

AbstractLaser- and electron-assisted deposition of Fe on Si(111)-(7×7) surfaces using decomposition of Fe(CO)5 has been investigated with multiple internal reflection Fourier transform infrared, Auger electron and temperature programmed desorption spectroscopies and low energy electron diffraction under ultra-high vacuum conditions. No thermal reaction was apparent in temperature programmed desorption experiments: only molecular Fe(CO)5 desorption was observed at temperatures of 150 and 170 K, corresponding to desorption energies in the range of 7–10 kcal./mole. Fe(CO)5 decomposition could be induced using either incident 1.6 keV electrons or ultraviolet photons. Significant amounts of carbon were deposited from the electron induced decomposition, consistent with earlier reports on the Si(100) surface. In contrast, ultraviolet photolysis did not result in any detectable incorporation of carbon or oxygen into the iron deposits. No partially decarbonylated Fe(CO)x, x<5, fragments were detected subsequent to exposure to photons using infrared spectroscopy. However, a new, unresolved low frequency shoulder did appear in the infrared spectrum after exposing the Fe(CO)5 covered Si(111)-(7×7) crystal to the electron beam. Iron photodeposition was evident in the Auger electron spectra obtained subsequent to photolysis and annealing of the surface to either 300 K or 1000 K in order to desorb unreacted Fe(CO)5. These data suggest that there are no surface stable Fe(CO)x, x<5, species in the photodeposition process. Instead, photolysis yields Fe atoms directly, even at low temperatures. Annealing to temperatures on the order of 1000 K subsequent to iron deposition resulted in a significant decrease in the Fe:Si ratio as measured by Auger electron spectroscopy. In addition, CO could not be readsorbed on a surface where the Fe(CO)5 had been decomposed. This is attributed to dissolution of Fe into the bulk silicon crystal.

Structure and Magnetic Properties of Fe-N Thin Films Grown by ECR Deposition

1999 ◽  
Vol 562 ◽  
Author(s):  
Š émeth ◽  
H. Akinaga ◽  
H. Boeve ◽  
H. Bender ◽  
J. de Boeck ◽  
...  
Keyword(s):  
Thin Films ◽  
Electron Cyclotron Resonance ◽  
Microwave Plasma ◽  
Nitrogen Concentration ◽  
High Vacuum ◽  
Plasma Source ◽  
Columnar Structure ◽  
Ultra High Vacuum ◽  
Si Substrates ◽  
Transmission Electron

ABSTRACTThe growth of FexNy thin films on GaAs, In0.2Ga0.8As, and SiO2/Si substrates using an ultra high-vacuum (UHV) deposition chamber equipped with electron cyclotron resonance (ECR) microwave plasma source is presented. The structural properties of the deposited films have been measured using various techniques as x-ray diffraction (XRD), Auger electron spectroscopy (AES), and transmission electron microscopy (TEM). The results of XRD measurements show that the films consist of a combination of α-Fe, α'-Fe, y-Fe4N, and α”- Fe16N2 phases. The depth profiles, calculated from the Auger peak intensities, show a uniform nitrogen concentration through the films. The TEM reveals a columnar structure of these films. The properties of the different Fe-N layers have been exploited in the fabrication of Fe(N) / FexNy / Fe trilayer structures, where Fe(N) means a slightly nitrogen doped Fe film. The magneto-transport properties of this trilayer structure grown on In0.2Ga0.8As substrates are presented.

Investigation of Si/4H-SiC Hetero-Junction Growth and Electrical Properties

2009 ◽  
Vol 615-617 ◽  
pp. 443-446 ◽  
Author(s):  
Owen J. Guy ◽  
Amador Pérez-Tomás ◽  
Michael R. Jennings ◽  
Michal Lodzinski ◽  
A. Castaing ◽  
...  
Keyword(s):  
Molecular Beam ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Physical Nature ◽  
Interface State ◽  
Electron Beam Evaporation ◽  
Layer Transfer ◽  
Mos Devices ◽  
State Densities ◽  
Scanning Electron

This paper describes the growth and characterisation of Si/SiC heterojunction structures. Heterojunction structures are of interest for low on-resistance diodes and as potential solutions to fabricating SiC MOS devices with lower interface state densities. The formation of the Si/SiC heterojunction using Chemical Vapour Deposition (CVD), Molecular Beam Epitaxy (MBE), Electron Beam Evaporation under UHV conditions (EBE-UHV) and Layer Transfer (LT) are reported. The physical nature of Si/SiC structures has been investigated using scanning electron microscopy (SEM). Results of electrical characterisation of the Si/SiC heterojunctions, are also reported. Finally, thermal oxidation of a Si / SiC heterojunction structures has been performed. The C(V) characteristics of the resulting oxides are compared to conventional thermal oxides on SiC.

Reduced interface state densities for remote microwave plasma silicon nitride

1992 ◽  
Vol 70 (10-11) ◽  
pp. 795-798 ◽  
Author(s):  
D. Landheer ◽  
J. A. Bardwell ◽  
I. Sproule ◽  
J. Scott-Thomas ◽  
W. Kwok ◽  
...  
Keyword(s):  
Microwave Plasma ◽  
Field Effect Transistors ◽  
Chemical Vapour ◽  
Depth Profiling ◽  
Interface State ◽  
State Density ◽  
Fixed Charge ◽  
Silicon Substrates ◽  
Plasma Chemical Vapour Deposition ◽  
State Densities

The interface state density and fixed charge density of films of a-Si3N4:H deposited on silicon substrates by remote microwave plasma chemical vapour deposition have been studied as a function of deposition and annealing temperature. Interface state densities (Dit as low as 9 × 1010 cm−2 eV−1 have been obtained for films deposited at 215 °C and annealed for 15 min at 500 °C. The films exhibited positive fixed charge levels (QN/q)> 1013 cm−2, increasing slightly with deposition temperature and decreasing slightly with annealing at temperatures from 500 to 700 °C. Fourier transform infrared spectroscopy and Auger depth profiling were used to study the impurities in the films and at the interface. Metal–insulator–silicon field effect transistors made with these films showed room temperature effective channel hole mobilities of 37 cm2 V−1 s−1.

Band Alignment of Si1-xGex And Si1-x-y.GexCy Quantum Wells On Si (001)

1998 ◽  
Vol 533 ◽  
Author(s):  
N. L. Rowell ◽  
R. L. Williams ◽  
G. C. Aers ◽  
H. Lafontaine ◽  
D. C. Houghton ◽  
...  
Keyword(s):  
Quantum Wells ◽  
Applied Stress ◽  
Vapour Deposition ◽  
Stress Condition ◽  
High Vacuum ◽  
Chemical Vapour ◽  
Band Alignment ◽  
Ultra High Vacuum ◽  
Multiple Quantum ◽  
Type I

AbstractRecent low-temperature photoluminescence (PL) studies will be discussed for coherent Si1-xGex. and Si1-xGexCy alloy multiple quantum wells on Si (001) substrates grown by either ultra-high vacuum chemical vapour deposition or solid source molecular beam epitaxy. An in-plane applied-stress technique will be described which removes systematically band edge degeneracies revealing the lower, PL-active CB. Applied-stress data taken with this technique at ultra-low excitation intensity proved intrinsic type II CB alignment in SiGe on Si (001). Apparent type I alignment observed at higher intensity will also be discussed. New applied stress PL results are presented for Si1-x-yGexCy quantum wells under various grown-in stress condition

Preparation of Nanocrystalline Silicon by Pulsed Plasma Processing

1994 ◽  
Vol 358 ◽  
Author(s):  
S. Oda ◽  
M. Otobe
Keyword(s):  
Electron Cyclotron Resonance ◽  
Plasma Cells ◽  
High Vacuum ◽  
Plasma Processing ◽  
Nanocrystalline Silicon ◽  
Ultra High Vacuum ◽  
Pulsed Plasma ◽  
Very High Frequency ◽  
Transmission Electron ◽  
H2 Flux

ABSTRACTWe have proposed digital plasma processing for the fabrication of silicon quantum dots with grain size less than l0nm. By using the pulsed gas supply of SiH4 and H2 in the very-high frequency (VHF) plasma, we have clarified the role of atomic hydrogen in the nucleation, crystallization of nanocrystalline Si (nc-Si) as well as in the selective etching of amorphous Si to nc-Si. Recently, we have prepared nc-Si by employing an ultra-high-vacuum (UHV) chamber equipped with VHF plasma cells of SiH4 and H2. Flux rate of Si cluster depends significantly on the pressure of the plasma cell and VHF power. Spherical shaped nc-Si clusters less than 6nm in diameter have been observed by transmission electron microscopy (TEM). Infrared absorption measurements have clarified that the surface of nc-Si is covered by hydrogen. In an attempt to control the position of nuclei, we have prepared nc-Si on SiO2 with micro trenches, 40nm wide and 20nm deep, fabricated by electron beam exposure and electron cyclotron resonance (ECR) etching. It has been revealed by TEM observation that nc-Si are formed preferentially along micro trenches.

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