Material Systems Used by Micro Dispensing and Ink Jetting Technologies

2000 ◽  
Vol 624 ◽  
Author(s):  
Jie Zhang ◽  
Irina Shmagin ◽  
James Skinner ◽  
John Szczech ◽  
Daniel Gamota
Keyword(s):  
Transmission Lines ◽  
Flexible Manufacturing ◽  
Low Cost ◽  
High Volume ◽  
Deposition Process ◽  
Electrical Performance ◽  
Direct Writing ◽  
Environmental Conditioning ◽  
Process Characterization ◽  
Material Systems

ABSTRACTIn today's electronic industry, manufacturers are continuously improving capital utilization, developing flexible manufacturing processes, reduce changeover time and improving yield and throughput. Interest in rapid prototyping and 3-D fabrication capabilities are rapidly increasing, and a number of candidate direct writing technologies are in development to meet these demands.This work studies material systems used by data driven materials deposition (DDMD) technologies for potential low temperature reel-to-reel high volume manufacturing on low cost substrates. Characterization results of fabricated discrete and RF devices using commercially available micro dispensing and ink jet systems will be discussed. Material rheological properties, deposition process characterization, deposition repeatability, fabricated device reliability and electrical performance will be presented. The test vehicles contain resistors and capacitors, transmission lines, open and short series stub filters, and half-wavelength resonators. The material/substrate compatibility will be demonstrated through environmental conditioning of the test vehicles. In addition, a cost estimate for using micro dispensing technologies was conducted to compare current manufacturing technologies to DDMD.

Deposition of Bead Arrays With Variable Diameter by Self-Focusing of Electrohydrodynamic Jets

2017 ◽  
Author(s):  
Nicolas Martinez-Prieto ◽  
Gabriela Fratta ◽  
Jian Cao ◽  
Kornel Ehmann
Keyword(s):  
Low Cost ◽  
Three Dimensional ◽  
Deposition Process ◽  
Direct Writing ◽  
Variable Diameter ◽  
Self Focusing ◽  
Poly Ethylene Oxide ◽  
Poly Ethylene ◽  
Number Of Passes ◽  
Bead Arrays

Electrohydrodynamic processes were used for direct-writing of bead arrays with controllable bead sizes. Experiments were conducted to align layers of bead-on-string structures in an effort to create three-dimensional patterns. The results show that the jet focuses on previously deposited droplets allowing for the selective deposition of material over already deposited patterns. Jet attraction to already deposited solutions on the substrate is attributed to the charge transport at the liquid ink-metal collector interface and the dielectric properties of the water/poly(ethylene oxide) solution under an electric field. The deposition process consists of 3 steps: (1) deposition of a layer of bead-on-string structures, (2) addition of extra volume to the beads by subsequent passes of the jet, and (3) evaporation of the solvent resulting in an array of beads with varying sizes. Patterns with up to 20 passes were experimentally obtained. The beads’ height was seen to be independent of the number of passes. The process reported is a simple, fast, and low-cost method for deposition of bead arrays with varying diameters.

Investigation of Using Contact and Non-contact Printing Technologies For Organic Transistor Fabrication

2002 ◽  
Vol 725 ◽  
Author(s):  
Jie Zhang ◽  
Paul Brazis ◽  
A. Roy Chowdhuri ◽  
John Szczech ◽  
Dan Gamota
Keyword(s):  
Integrated Circuits ◽  
Process Development ◽  
Field Effect Transistors ◽  
Low Cost ◽  
High Volume ◽  
Electrical Performance ◽  
Organic Polymer ◽  
Personal Area Networks ◽  
Material System ◽  
Contact Printing

AbstractLow cost, high volume manufacturing processes are envisioned for solution processable organic semiconductor integrated circuits (IC) fabrication. The organic IC may be the low cost solution for driving electronic devices, i.e. smart cards, RFID tags, flexible displays, personal area networks, and body area networks. This study investigated the manufacturability of organic electronics (organic field effect transistors (OFETs), organic light emitting diodes (OLEDs), etc.) using commercially available printing technologies and materials systems qualified for use in microelectronic products. The evaluated contact printing technologies were pad printing and screen-printing; the non-contact printing technologies were ink jetting and micro dispensing. The material system selection for transistor structures and active layers was based on printing technology requirements and commercial availability. The materials were polymer thick film conductors and insulators, conductive nano-particle suspensions, and organic polymer systems. A series of material property characterization and printing process development studies were conducted. Several OFET designs were created and functional all printed organic transistors were demonstrated. The device electrical performance was characterized.

scholarly journals Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

2018 ◽  
Vol 2018 ◽  
pp. 1-19 ◽  
Author(s):  
Eva S. Rosker ◽  
Rajinder Sandhu ◽  
Jimmy Hester ◽  
Mark S. Goorsky ◽  
Jesse Tice
Keyword(s):  
Transmission Lines ◽  
High Performance ◽  
Low Cost ◽  
Ease Of Use ◽  
Multidisciplinary Teams ◽  
Direct Writing ◽  
Structure Property ◽  
Low Loss ◽  
Rf Components ◽  
Subtractive Manufacturing

Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

Deposition of Variable Bead Diameter Arrays by Self-Focusing Electrohydrodynamic Jets

2018 ◽  
Vol 6 (3) ◽  
Author(s):  
Nicolas Martinez-Prieto ◽  
Gabriela Fratta ◽  
Jian Cao ◽  
Kornel F. Ehmann
Keyword(s):  
Low Cost ◽  
Three Dimensional ◽  
Deposition Process ◽  
Direct Writing ◽  
Self Focusing ◽  
Poly Ethylene Oxide ◽  
Bead Diameter ◽  
Poly Ethylene ◽  
Number Of Passes ◽  
Bead Arrays

Electrohydrodynamic (EHD) processes were used for direct writing of bead arrays with controllable bead sizes. Experiments were conducted to align layers of bead-on-string structures in an effort to create three-dimensional patterns. The results show that the jet focuses on previously deposited droplets allowing for the selective deposition of material over already deposited patterns. Jet attraction to already deposited solutions on the substrate is attributed to the charge transport at the liquid ink–metal collector interface and the dielectric properties of the water/poly(ethylene oxide) (PEO) solution under an electric field. The deposition process consists of three steps: (1) deposition of a layer of bead-on-string structures, (2) addition of extra volume to the beads by subsequent passes of the jet, and (3) evaporation of the solvent resulting in an array of beads with varying sizes. Patterns with up to 20 passes were experimentally obtained. The beads' height was seen to be independent of the number of passes. The process reported is a simple, fast, and low-cost method for deposition of bead arrays with varying diameters.

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

scholarly journals A rapid, accurate, scalable, and portable testing system for COVID-19 diagnosis

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Guanhua Xun ◽  
Stephan Thomas Lane ◽  
Vassily Andrew Petrov ◽  
Brandon Elliott Pepa ◽  
Huimin Zhao
Keyword(s):  
Limit Of Detection ◽  
Low Cost ◽  
High Volume ◽  
N Gene ◽  
Testing System ◽  
Target Sequence ◽  
One Pot ◽  
Sequence Detection ◽  
Highly Sensitive ◽  
Speed Accuracy

AbstractThe need for rapid, accurate, and scalable testing systems for COVID-19 diagnosis is clear and urgent. Here, we report a rapid Scalable and Portable Testing (SPOT) system consisting of a rapid, highly sensitive, and accurate assay and a battery-powered portable device for COVID-19 diagnosis. The SPOT assay comprises a one-pot reverse transcriptase-loop-mediated isothermal amplification (RT-LAMP) followed by PfAgo-based target sequence detection. It is capable of detecting the N gene and E gene in a multiplexed reaction with the limit of detection (LoD) of 0.44 copies/μL and 1.09 copies/μL, respectively, in SARS-CoV-2 virus-spiked saliva samples within 30 min. Moreover, the SPOT system is used to analyze 104 clinical saliva samples and identified 28/30 (93.3% sensitivity) SARS-CoV-2 positive samples (100% sensitivity if LoD is considered) and 73/74 (98.6% specificity) SARS-CoV-2 negative samples. This combination of speed, accuracy, sensitivity, and portability will enable high-volume, low-cost access to areas in need of urgent COVID-19 testing capabilities.

scholarly journals Development of an Additive Manufacturing System for the Deposition of Thermoplastics Impregnated with Carbon Fibers

2019 ◽  
Vol 3 (2) ◽  
pp. 35 ◽  
Author(s):  
Miguel Reis Silva ◽  
António M. Pereira ◽  
Nuno Alves ◽  
Gonçalo Mateus ◽  
Artur Mateus ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Additive Manufacturing ◽  
Carbon Fibers ◽  
Low Cost ◽  
Deposition Process ◽  
Processing Parameters ◽  
Yarn Diameter ◽  
Thermoplastic Matrix ◽  
Anisotropic Mechanical Properties ◽  
Long Carbon Fiber

This work presents an innovative system that allows the oriented deposition of continuous fibers or long fibers, pre-impregnated or not, in a thermoplastic matrix. This system is used in an integrated way with the filamentary fusion additive manufacturing technology and allows a localized and oriented reinforcement of polymer components for advanced engineering applications at a low cost. To demonstrate the capabilities of the developed system, composite components of thermoplastic matrix (polyamide) reinforced with pre-impregnated long carbon fiber (carbon + polyamide), 1 K and 3 K, were processed and their tensile and flexural strength evaluated. It was demonstrated that the tensile strength value depends on the density of carbon fibers present in the composite, and that with the passage of 2 to 4 layers of fibers, an increase in breaking strength was obtained of about 366% and 325% for the 3 K and 1 K yarns, respectively. The increase of the fiber yarn diameter leads to higher values of tensile strength of the composite. The obtained standard deviation reveals that the deposition process gives rise to components with anisotropic mechanical properties and the need to optimize the processing parameters, especially those that lead to an increase in adhesion between deposited layers.

Plastic Encapsulated MCM Technology for High Volume, Low Cost Electronics

Circuit World ◽  
1995 ◽  
Vol 21 (2) ◽  
pp. 28-31 ◽  
Author(s):  
R. Fillion ◽  
R. Wojnarowski ◽  
T. Gorcyzca ◽  
E. Wildi ◽  
H. Cole
Keyword(s):  
Low Cost ◽  
High Volume

Direct Writing on Paper Substrate to Prepare Silver Electrode Structures for Flexible Sensors

2021 ◽  
Vol 21 (12) ◽  
pp. 6048-6053
Author(s):  
Qi Wang ◽  
Mingwei Li ◽  
Yao Xie ◽  
Yun Ou ◽  
Weiping Zhou
Keyword(s):  
Low Cost ◽  
Rapid Development ◽  
Silver Electrode ◽  
Silver Nanostructures ◽  
Direct Writing ◽  
Paper Substrate ◽  
Electronic Products ◽  
Glass Substrates ◽  
Different Temperatures ◽  
Writing Technology

With the rapid development of the electronics industry, electronic products based on silicon and glass substrates electronic products will gradually be unable to meet the rising demand. Flexibility, environmental protection, and low costs are important for the development of electronic products. In this study, an efficient and low-cost method for preparing silver electrode structures by direct writing on paper has been demonstrated. Based on this method, a flexible paper-based sensor was prepared. The liquid printing ink used mainly comprises a precursor liquid without pre-prepared nanomaterials. The precursor liquid is transparent with good fluidity. Simple direct writing technology was used to write on the paper substrate using the precursor ink. When the direct-writing paper substrate was subsequently heated, silver nanostructures precipitated from the precursor liquid ink onto the paper substrate. The effect of different temperatures on the formation of the silver nanostructures and the influence of different direct writing processes on the structures were studied. Finally, a paper-based flexible sensor was prepared for finger-bending signal detection. The method is simple to operate and low in cost and can be used for the preparation of environment-friendly paper-based devices.

Sign in / Sign up

Export Citation Format

Share Document