The Challenges of FIB Chip Repair and Debug Assistance in the 0.25μm Copper Interconnect Millennium

1998 ◽  
Author(s):  
S.B. Herschbein ◽  
L.S. Fischer ◽  
T.L. Kane ◽  
M.P. Tenney ◽  
A.D. Shore
Keyword(s):  
High Performance ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
Long Term Storage ◽  
Wagon Wheel ◽  
Sram Cell ◽  
Oxide Deposition ◽  
Reliable Isolation

Abstract Copper will probably replace aluminum alloys as the interconnect metallurgy of choice for high performance semiconductor devices. This transition will challenge the suitability of established practices in focused ion beam (FIB) chip repair. A fundamental rethink in methodology, techniques, and process gases will be required to deal with the new metal films. This paper discusses the results of recent experiments in the areas of FIB exposure, cuts and connections to buried copper lines. While copper tends to mill faster than aluminum, etch rate variations due to grain structure tend to make reliable isolation cuts more difficult. The films also have been shown to suffer regrowth and surface reactions during long term storage following FIB exposure. Attempts at halogen gas assisted etch (GAE) mills result in undesirable removal characteristics, and in the case of bromine, the spontaneous destruction of all exposed copper in the immediate area. Resistance measurements and reliability of deposited tungsten connections to copper lines are also presented. In addition, the latest techniques developed for aluminum wiring isolation and device characterization are shown. These include 'cleanup' methods for achieving good circuit isolation without the extensive use of local oxide deposition, and the latest multilevel version of the FIB ‘wagon wheel’ for SRAM cell characterization. Also included is preliminary data from a custom built FIB chamber four manipulator prober module.

Phase-Shifting Electron Holography for Accurate Measurement of Potential Distributions in Organic and Inorganic Semiconductors

Microscopy ◽  
2020 ◽  
Author(s):  
Kazuo Yamamoto ◽  
Satoshi Anada ◽  
Takeshi Sato ◽  
Noriyuki Yoshimoto ◽  
Tsukasa Hirayama
Keyword(s):  
High Performance ◽  
Focused Ion Beam ◽  
Phase Measurement ◽  
Ion Beam ◽  
Functional Materials ◽  
Phase Shifting ◽  
Future Research ◽  
Electron Holography ◽  
Preparation Technique ◽  
Inorganic Semiconductors

Abstract Phase-shifting electron holography (PS-EH) is an interference transmission electron microscopy technique that accurately visualizes potential distributions in functional materials, such as semiconductors. In this paper, we briefly introduce the features of the PS-EH that overcome some of the issues facing the conventional EH based on Fourier transformation. Then, we present a high-precision PS-EH technique with multiple electron biprisms and a sample preparation technique using a cryo-focused-ion-beam, which are important techniques for the accurate phase measurement of semiconductors. We present several applications of PS-EH to demonstrate the potential in organic and inorganic semiconductors and then discuss the differences by comparing them with previous reports on the conventional EH. We show that in situ biasing PS-EH was able to observe not only electric potential distribution but also electric field and charge density at a GaAs p-n junction and clarify how local band structures, depletion layer widths, and space charges changed depending on the biasing conditions. Moreover, the PS-EH clearly visualized the local potential distributions of two-dimensional electron gas (2DEG) layers formed at AlGaN/GaN interfaces with different Al compositions. We also report the results of our PS-EH application for organic electroluminescence (OEL) multilayers and point out the significant potential changes in the layers. The proposed PS-EH enables more precise phase measurement compared to the conventional EH, and our findings introduced in this paper will contribute to the future research and development of high-performance semiconductor materials and devices.

REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING

2008 ◽  
Vol 22 (31n32) ◽  
pp. 6118-6123 ◽  
Author(s):  
SUNG-WON YOUN ◽  
CHIEKO OKUYAMA ◽  
MASHARU TAKAHASHI ◽  
RYUTARO MAEDA
Keyword(s):  
High Performance ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Hot Embossing ◽  
High Fidelity ◽  
Borosilicate Glasses ◽  
Mems Devices ◽  
Barrier Layers ◽  
Multiple Copies ◽  
Micro Electromechanical System

Glass hot-embossing is one of essential techniques for the development of high-performance optical, bio, and chemical micro electromechanical system (MEMS) devices. This method is convenient, does not require routine access to clean rooms and photolithographic equipment, and can be used to produce multiple copies of a quartz mold as well as a MEMS component. In this study, quartz molds were prepared by hot-embossing with the glassy carbon (GC) masters, and they were applied to the hot-emboss of borosilicate glasses. The GC masters were prepared by dicing and focused ion beam (FIB) milling techniques. Additionally, the surfaces of the embossed quartz molds were coated with molybdenum barrier layers before embossing borosilicate glasses. As a result, micro-hot-embossed structures could be developed in borosilicate glasses with high fidelity by hot embossing with quartz molds.

Liquid-chromatographic determination of serotonin in serum and plasma.

1978 ◽  
Vol 24 (9) ◽  
pp. 1509-1514 ◽  
Author(s):  
S Sasa ◽  
C L Blank ◽  
D C Wenke ◽  
C A Sczupak
Keyword(s):  
High Performance ◽  
Clinical Laboratory ◽  
Chromatographic Determination ◽  
Present Scheme ◽  
Long Term Storage ◽  
Significant Difference ◽  
Liquid Chromatographic Determination ◽  
Liquid Chromatographic

Abstract Using high-performance liquid chromatography with electrochemical detection, we determined serotonin in plasma from parkinsonian patients being treated with L-3,4-dihydroxyphenylalanine or N-(DL-seryl)-N'(2,3,4-trihydroxybenzyl)hydrochloride plus L-3,4-dihydroxyphenylalanine ("Sinemet") and in serum from a blood bank, from "normal" persons, and a pooled specimen from a hospital clinical laboratory. The values obtained for the two groups of Parkinson's disease patients showed no significant difference. Long-term storage on solid CO2 was xhown to be an adequate technique for preserving samples. The mean (+/-SEAM) normal value obtained for serotonin in serum was 146 +/- 46 microgram/liter (n = 23), a result in harmony with that previously obtained [Clin. Chem. 20, 812 (1974)] by fluorometry. In comparison to other methods for measurement of serotonin in serum or plasma, we believe that the present scheme offers greater selectivity, sensitivity, and precision.

Validated HPLC Method for Quantification of a Novel Trk Inhibitor, Larotrectinib in Mice Plasma: Application to a Pharmacokinetic Study

Drug Research ◽  
2020 ◽  
Vol 70 (02/03) ◽  
pp. 101-106
Author(s):  
Harsha K. Tripathy ◽  
S.V. Nair Manju ◽  
Ashok Zakkula ◽  
Ram Murthi Bestha ◽  
Sreekanth Dittakavi ◽  
...  
Keyword(s):  
Pharmacokinetic Study ◽  
High Performance ◽  
Wave Length ◽  
Internal Standard ◽  
Hplc Method ◽  
Long Term Storage ◽  
Development And Validation ◽  
Orally Active ◽  
Regulatory Guideline

AbstractLarotrectinib, is an orally active novel small molecule approved for the treatment of solid tumors in pediatrics and adult patients. It acts by inhibiting tropomyosin receptor kinase. In this paper, we report the development and validation of a high-performance liquid chromatography (HPLC) method for the quantitation of larotrectinib in mice plasma as per the FDA regulatory guideline. Plasma samples processing was accomplished through simple protein precipitation using acetonitrile enriched with internal standard (IS, enasidenib). The chromatographic analysis was performed using a gradient mobile phase comprising 10 mM ammonium acetate and acetonitrile at a flow-rate of 0.8 mL/min on an X-Terra Phenyl column. The UV detection wave length was set at λmax 262 nm. Larotrectinib and the IS eluted at 3.85 and 6.60 min, respectively with a total run time of 8.0 min. The calibration curve was linear over a concentration range of 0.20–5.00 μg/mL (r2=≥0.992). The intra- and inter-day precision and accuracy results were within the acceptable limits. Results of stability studies indicated that larotrectinib was stable on bench-top, in auto-sampler, up to three freeze/thaw cycles and long-term storage at −80°C. The validated HPLC method was successfully applied to a pharmacokinetic study in mice.

A New Technique For Visualizing The Displacement Field Of Indentations: The Case Of A Soft Film On A Hard Substrate

1997 ◽  
Vol 505 ◽  
Author(s):  
Joost J. Vlassak ◽  
T. Y. Tsui ◽  
W. D. Nix
Keyword(s):  
Titanium Nitride ◽  
Displacement Field ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
New Technique ◽  
Hard Substrate ◽  
Film Material ◽  
Pile Up ◽  
A New Technique

ABSTRACTWe have developed a new technique for visualizing displacement fields of indentations in thin films. In this technique, the indented film consists of alternating layers of two different materials. One of the materials serves as a marker for visualizing the plastic flow induced by the indentation. Focused Ion Beam (FIB) milling is used to cross-section the indentation, revealing the deformed layers. This technique can be used to study how the presence of the substrate affects the plastic displacement field around the indentation. The technique is applied to a multilayered film of aluminum and titanium nitride on a silicon substrate. The titanium nitride layers are much thinner than the aluminum layers and serve the function of marker. Pile-up of the film material around the indenter and the effect of the hard substrate are easily revealed and a mechanism for pile-up is suggested. The technique also shows that the grain structure in the deformed zone around the indentation is altered profoundly.

Behavior of High Performance Concrete Under High Temperature (60-450°C) for Surface Long-Term Storage: Thermo-Hydro-Mechanical Residual Properties

2000 ◽  
Vol 663 ◽  
Author(s):  
C. Gallé ◽  
J. Sercombe ◽  
M. Pin ◽  
G. Arcier ◽  
P. Bouniol
Keyword(s):  
Thermal Conductivity ◽  
Compressive Strength ◽  
Elastic Modulus ◽  
High Performance ◽  
High Performance Concrete ◽  
Gas Permeability ◽  
Long Term Storage ◽  
Residual Properties ◽  
Term Storage

ABSTRACTAfter various thermal treatments (up to 450°C), residual thermo-hydro-mechanical (T-H-M) properties of two OPC high performance concretes (HPC) were analyzed in the context of surface long-term storage. Materials were prepared with silico-calcareous aggregates (standard HPC) and hematite aggregates (heavy HPC). The initial microstructural (porosity ≈10%) and transport (gas permeability ≈10-19 m2) properties are similar for both concretes. As far as the mechanical aspect is concerned, heavy HPC shows a higher compressive strength and elastic modulus than standard HPC (78 and 63 MPa, 81 and 49 GPa, respectively). Heavy HPC is also characterized by a higher thermal conductivity (7.3 W m-1 K-1 compared to 2.7 W m-1 K-1 for standard concrete). Results analysis show that thermo-hydro-mechanical damages are smaller for heavy HPC. Between 60 and 250°C, the elastic modulus and the compressive strength of standard HPC decrease by 40% and 16%, respectively. For heavy HPC, these parameters respectively decrease by 10% and 4%. A similar trend was observed for thermal conductivity evolution. Gas permeability and porosity data confirm the good behavior of heavy HPC. As a conclusion, hematite HPC seems to provide more interesting T-H-M residual properties than standard HPC. Limited thermal expansion and thermal gradients induced by hematite are probably responsible of this behavior.

Characterization of Plated Cu Thin Film Microstructures

1999 ◽  
Vol 564 ◽  
Author(s):  
L. M. Gignac ◽  
K. P. Rodbel ◽  
C. Cabral ◽  
P. C. Andricacos ◽  
P. M. Rice ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
Grain Structures ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Gaussian Fit ◽  
Cu Thin Film ◽  
Log Normal ◽  
Electron Imaging

AbstractElectroplated Cu was found to have a fine as-plated microstructure, 0.05 ± 0.03 μm, with multiple grains through the film thickness and evidence of twins and dislocations within grains. Over time at room temperature, the grains grew to greater than 1 μm in size. Studied as a function of annealing temperature, the recrystallized grains were shown to be 1.6 ± 1.0 μm in size, columnar and highly twinned. The grain growth was directly related to the time dependent decrease in sheet resistance. The initial grain structure was characterized using scanning transmission electron microscopy (STEM) from a cross-section sample prepared by a novel focused ion beam (FIB) and lift-out technique. The recrystallized grain structures were imaged using FIB secondary electron imaging. From these micrographs, the grain boundary structures were traced, and an image analysis program was used to measure the grain areas. A Gaussian fit of the log-normal distribution of grain areas was used to calculate the mean area and standard deviation. These values were converted to grain size diameters by assuming a circular grain geometry.

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