X-ray Laminography Benchmarking and Failure Analysis of Solder Joint Interfaces

2003 ◽  
Author(s):  
Barbara A. Thomson ◽  
Norman J. Armendariz
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Generation X ◽  
Failure Modes ◽  
Technology Development ◽  
X Ray ◽  
Solder Balls ◽  
Joint Location ◽  
Image Planes ◽  
Joint Quality

Abstract A new generation X-ray laminography (XRL) automated Xray inspection (AXI) tool was evaluated for surface mount technology (SMT) assembly defect detection and was qualified using formal “benchmark” comparative analysis processes. In addition, defect characterization was performed using the XRL AXI system in manual X-ray inspection mode to correlate various failure modes and mechanisms at SMT solder joint interfaces for selected non-destructive failure analyses and technology development. Since ball grid array (BGA) solder joint quality is a great concern in board assembly, test technology development and failure analysis teams explored the use of XRL AXI as a method to detect and monitor BGA ball abnormalities using XRL AXI-generated solder ball images and measurements. It was found that XRL AXI was able to successfully discern differences in the shape, location and diameter of the suspect BGA solder balls from XRL AXI horizontal image planes (slices) for physical failure analysis and reliability issues not previously detected using conventional X-ray transmission or electrical methods. Subsequent metallographic x-sectioning correlated the XRL AXI mages to the physical condition of the suspected second level interconnect (SLI) solder joint location.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Failures in Soldering

2021 ◽  
pp. 326-337
Author(s):  
Qiming Zhang ◽  
Babak Kondori ◽  
Xing Qiu ◽  
Jeffry C.C. Lo ◽  
S.W. Ricky Lee
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Manufacturing Process ◽  
Failure Modes ◽  
Solder Joints ◽  
Failure Detection ◽  
Cause Analysis ◽  
Root Cause ◽  
Integration Density ◽  
Root Cause Failure Analysis

Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure at the assembly level. This article covers the properties of solder alloys and the corresponding intermetallic compounds. It includes the dominant failure modes introduced during the solder joint manufacturing process and in field-use applications. The corresponding failure mechanism and root-cause analysis are also presented. The article introduces several frequently used methods for solder joint failure detection, prevention, and isolation (identification for the failed location).

Conductive-AFM for Failure Analysis of Parametric Test Structures in Advanced Technology Development

2017 ◽  
Author(s):  
Chuan Zhang ◽  
Esther P.Y. Chen
Keyword(s):  
Atomic Force Microscopy ◽  
Failure Analysis ◽  
Failure Modes ◽  
Technology Development ◽  
Advanced Technology ◽  
Conductive Atomic Force Microscopy ◽  
Parametric Test ◽  
Conductive Afm ◽  
Force Microscopy ◽  
Atomic Force

Abstract A variety of parametric test structures were designed with the purpose of characterizing parameters tied to failure modes for specific structures, and the electrical test of the parametric test structures are typically conducted earlier inline, which could be months ahead of the functional test. Due to the unique advantages, conductive-atomic force microscopy (CAFM) was introduced to parametric test structure failure analysis during advanced technology development, and has been proven to be a powerful solution to many challenging failure analysis (FA) problems. This paper uses several case studies to illustrate how CAFM can be used to successfully localize defects in challenging parametric test structures that would otherwise be invisible with conventional FA techniques.

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

2019 ◽  
Vol 32 (2) ◽  
pp. 57-64
Author(s):  
Bangyao Han ◽  
Fenglian Sun ◽  
Tianhui Li ◽  
Yang Liu
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Content Type ◽  
X Ray ◽  
Soldering Process ◽  
Cu Alloy ◽  
Solder Balls ◽  
High Temperature Aging ◽  
Harsh Conditions ◽  
Temperature Aging

Purpose The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni solder joint during the high temperature aging. Design/methodology/approach Sn-5Sb-1Cu-0.1Ni-0.1Ag solder balls (500 µm in diameter), heat sink with structure of 7.4 µm Au layer on 5 µm Ni-plated Cu alloy and Si chip with 5.16 µm plated Au were used to fabricate micro-solder joints. The joints were performed in a furnace at 150°C for 150, 250 and 350 h aging. The samples were polished and deep etched before analyzed by metallographic microscope and scanning electron microscopy, respectively. Energy dispersive x-ray spectroscopy was used to identify the composition of the IMCs. Findings ß-(Au,Ni,Cu)10Sn phase is formed during the soldering process. The IMCs evolution has two periods during the aging. The first is the ξ-(Au,Ni,Cu)5Sn, ξ-(Au,Cu)5Sn and δ-AuSn were formed and grew to form a full-compound joint after about 150 h aging. The second is the conversion of the full-compound joint. The IMCs converted to ξ′ phase when the aging time extends to 250 h, and transformed to ε-(Au,Ni,Cu)Sn2 and η-(Au,Ni,Cu)Sn4 after 350 h aging. The thicker gold layer and thinner solder joint can promote the growth of the IMCs. ß-(Au,Ni,Cu)10Sn emerged in Au/SnSb-CuNiAg/(Au)Ni in this research, which is not usually found. Originality/value The results in this study have a significant meaning for the application of the new Sn-5Sb-1Cu-0.1Ni-0.1Ag in harsh conditions.

Advanced In Situ X-ray Metrology for Thermal Interface Materials Package Failure Analysis

2017 ◽  
Author(s):  
Peng Li ◽  
Alfred La Mar ◽  
Yongmei Liu ◽  
Deepak Goyal
Keyword(s):  
Failure Analysis ◽  
Technology Development ◽  
Void Formation ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
X Ray ◽  
Direct Guidance ◽  
Root Cause Identification ◽  
Interface Materials

Abstract Innovative in situ X-ray metrologies for package failure analysis (FA) were developed to understand solder thermal interface materials (STIM) package process and failure mechanisms through elevated temperature. Dynamic STIM void formation mechanism and STIM bleeding-out dependency on reflow were observed. It was found that long sit time before STIM liquidus temperature helps to minimize the STIM void formation and fast cooling mitigates the STIM bleed-out risk. Our studies demonstrate that in situ metrologies offer direct guidance to packaging process optimization and accelerate root-cause identification for temperature induced package failures; therefore, it improves throughput-time for packaging technology development.

Failure Analysis on BGA U45 on Soldered Balls

2020 ◽  
Author(s):  
Miguel Angel Neri Flores ◽  
Gregorio Vázquez Olvera
Keyword(s):  
Computed Tomography ◽  
Failure Analysis ◽  
Cross Sections ◽  
Printed Circuit Board ◽  
Intermetallic Layer ◽  
Circuit Board ◽  
X Ray ◽  
Printed Circuit ◽  
Solder Balls ◽  
X Ray Computed

Abstract This paper presents a failure analysis to determine the origin of the failure on the soldered balls of one BGA soldered to a Printed circuit board, presenting Intermittency on the soldered joints, by Visual inspection, X ray inspection, Computed Tomography(CT), Cross-section analysis, Scanning Electron Microscopy, and Energy dispersive spectroscopy, determined the failure located on soldered balls of the BGA was caused by cracks that run along the Intermetallic layer formed between the solder balls and the copper pads of the printed circuit board, that were located near the BGA corners. With X ray computed Tomography we can analyze all the soldered balls of the BGA, by "virtual" cross-sections on the soldered joints without damage on the sample.

Generation-X mirror technology development plan and the development of adjustable x-ray optics

2009 ◽  
Author(s):  
Paul B. Reid ◽  
William Davis ◽  
Stephen O'Dell ◽  
Daniel A. Schwartz ◽  
Susan Tolier-McKinstry ◽  
...  
Keyword(s):  
Generation X ◽  
Technology Development ◽  
Development Plan ◽  
Ray Optics ◽  
X Ray

Failure Analysis Case Study of a 1.5 Meter Space Flex Harness

2017 ◽  
Author(s):  
Erick Kim ◽  
Kamjou Mansour ◽  
Gil Garteiz ◽  
Javeck Verdugo ◽  
Ryan Ross ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Field Of View ◽  
Area Of Interest ◽  
Air Stream ◽  
Novel Method ◽  
Temperature Controlled ◽  
Non Destructive ◽  
Failure Site

Abstract This paper presents the failure analysis on a 1.5m flex harness for a space flight instrument that exhibited two failure modes: global isolation resistances between all adjacent traces measured tens of milliohm and lower resistance on the order of 1 kiloohm was observed on several pins. It shows a novel method using a temperature controlled air stream while monitoring isolation resistance to identify a general area of interest of a low isolation resistance failure. The paper explains how isolation resistance measurements were taken and details the steps taken in both destructive and non-destructive analyses. In theory, infrared hotspot could have been completed along the length of the flex harness to locate the failure site. However, with a field of view of approximately 5 x 5 cm, this technique would have been time prohibitive.

Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects

2000 ◽  
Author(s):  
George M. Wenger ◽  
Richard J. Coyle ◽  
Patrick P. Solan ◽  
John K. Dorey ◽  
Courtney V. Dodd ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Solder Interconnects ◽  
Area Array ◽  
Surface Finishes ◽  
Soldering Reaction

Abstract A common pad finish on area array (BGA or CSP) packages and printed wiring board (PWB) substrates is Ni/Au, using either electrolytic or electroless deposition processes. Although both Ni/Au processes provide flat, solderable surface finishes, there are an increasing number of applications of the electroless nickel/immersion gold (ENi/IAu) surface finish in response to requirements for increased density and electrical performance. This increasing usage continues despite mounting evidence that Ni/Au causes or contributes to catastrophic, brittle, interfacial solder joint fractures. These brittle, interfacial fractures occur early in service or can be generated under a variety of laboratory testing conditions including thermal cycling (premature failures), isothermal aging (high temperature storage), and mechanical testing. There are major initiatives by electronics industry consortia as well as research by individual companies to eliminate these fracture phenomena. Despite these efforts, interfacial fractures associated with Ni/Au surface finishes continue to be reported and specific failure mechanisms and root cause of these failures remains under investigation. Failure analysis techniques and methodologies are crucial to advancing the understanding of these phenomena. In this study, the scope of the fracture problem is illustrated using three failure analysis case studies of brittle interfacial fractures in area array solder interconnects. Two distinct failure modes are associated with Ni/Au surface finishes. In both modes, the fracture surfaces appear to be relatively flat with little evidence of plastic deformation. Detailed metallography, scanning electron microscopy (SEM), energy dispersive x-ray analysis (EDX), and an understanding of the metallurgy of the soldering reaction are required to avoid misinterpreting the failure modes.

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