Advanced Package FA Flow for Next-Gen Packaging Technology Using EOTPR, 3D X-Ray and Plasma FIB

2016 ◽  
Author(s):  
Christian Schmidt ◽  
Pradip Sairam Pichumani ◽  
Jesse Alton ◽  
Martin Igarashi ◽  
Lisa Chan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
State Of The Art ◽  
Packaging Technology ◽  
Standard Methods ◽  
X Ray ◽  
Different Types ◽  
Recent Developments ◽  
Turn Around Time

Abstract Within this paper, the authors present an adapted FA flow for state-of-the-art Package Failure Analysis for 20nm technology and below. As a key aspect, three methods (EOTPR, 3D Xray & PFIB) are introduced as the next-gen FA standard methods for emerging package technologies such as TSV, u-pillar bumping and stacked-die devices. By showing different types of daily Package FA requests, the paper compares & discusses important factors such as turn-around-time (TAT), success yield and results quality. In the end, an outlook is given how recent developments on these techniques will help to establish a new standard FA flow.

Infra-Red Reflectance Microscopy (IRRM) for Daisy Chain Flip Chip Device Failure Analysis

2004 ◽  
Author(s):  
Carlo Grilletto ◽  
Steve Hsiung ◽  
Andrew Komrowski ◽  
John Soopikian ◽  
Daniel J.D. Sullivan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
State Of The Art ◽  
Failure Mechanisms ◽  
Simple Metal ◽  
X Ray ◽  
Infra Red ◽  
Cause Of Failure ◽  
Reflectance Microscopy ◽  
Ir Emission

Abstract This paper describes a method to "non-destructively" inspect the bump side of an assembled flip-chip test die. The method is used in conjunction with a simple metal-connecting "modified daisy chain" die and makes use of the fact that polished silicon is transparent to infra-red (IR) light. The paper describes the technique, scope of detection and examples of failure mechanisms successfully identified. It includes an example of a shorting anomaly that was not detectable with the state of the art X-ray equipment, but was detected by an IR emission microscope. The anomalies, in many cases, have shown to be the cause of failure. Once this has been accomplished, then a reasonable deprocessing plan can be instituted to proceed with the failure analysis.

Energy-Dispersive X-Ray Emission Spectroscopy

1970 ◽  
Vol 24 (6) ◽  
pp. 557-566 ◽  
Author(s):  
R. S. Frankel ◽  
D. W. Aitken
Keyword(s):  
Emission Spectroscopy ◽  
Energy Dispersive ◽  
New Developments ◽  
X Ray ◽  
Different Types ◽  
Recent Developments ◽  
System Requirements ◽  
Electron Microscopes ◽  
Scanning Electron Microscopes ◽  
Realistic Appraisal

A review is given of recent developments in energy-dispersive x-ray emission spectroscopy, with the aim of providing both an introductory and usefully practical look at this innovative field. The review begins with the first principles of x-ray production and observation, including a brief comparison of the performance capabilities of different types of detectors, but then specializes to a major extent in solid state x-ray spectrometers, which have led to the most significant new developments and applications. Evidence is presented which suggests that we are nearing an asymptotic limit in the attainment of ever better resolution with these types of systems. Applications that have been made possible by significant improvements in system resolution are discussed, but in the context of the need for a realistic appraisal of over-all system requirements. The great advantages offered by the marriage of silicon x-ray spectrometers to scanning electron microscopes and electron microprobe analyzers are reviewed and illustrated.

scholarly journals Functional materials analysis usingin situandin operandoX-ray and neutron scattering

IUCrJ ◽  
2015 ◽  
Vol 2 (2) ◽  
pp. 292-304 ◽  
Author(s):  
Vanessa K. Peterson ◽  
Christine M. Papadakis
Keyword(s):  
Neutron Scattering ◽  
State Of The Art ◽  
Functional Materials ◽  
Materials Analysis ◽  
X Ray ◽  
Materials Research ◽  
Recent Developments ◽  
In Operando ◽  
Types Of Information

In situandin operandostudies are commonplace and necessary in functional materials research. This review highlights recent developments in the analysis of functional materials using state-of-the-artin situandin operandoX-ray and neutron scattering and analysis. Examples are given covering a number of important materials areas, alongside a description of the types of information that can be obtained and the experimental setups used to acquire them.

scholarly journals Liquid-Based Reconfigurable Antenna Technology: Recent Developments, Challenges and Future

2020 ◽  
Author(s):  
Habshah Abu Bakar ◽  
Rosemizi Abd Rahim ◽  
Ping Jack Soh ◽  
Prayoot Akkaraekthalin
Keyword(s):  
High Frequency ◽  
Communication Systems ◽  
Room Temperature ◽  
State Of The Art ◽  
Reconfigurable Antennas ◽  
Wireless Communication Systems ◽  
Dielectric Resonators ◽  
Different Types ◽  
Recent Developments ◽  
Basic Approaches

Advances in reconfigurable liquid-based reconfigurable antennas are enabling new possibilities to fulfil the requirements of more advanced wireless communication systems. In this review, a comparative analysis of various state-of-the-art concepts and techniques for designing reconfigurable antennas using liquid is presented. First, the electrical properties of different liquids at room temperature commonly used in reconfigurable antennas are identified. This is followed by a discussion of various liquid actuation techniques in enabling high frequency reconfigurability. Next, liquid-based reconfigurable antennas in literature used to achieve the different types of reconfiguration will be critically reviewed. These include frequency-, polarization-, radiation pattern- and compound reconfigurability. The current concepts of liquid-based reconfigurable antennas can be classified broadly into three basic approaches: altering the physical (and electrical) dimensions of antennas using liquid, applying liquid-based sections as reactive loads; and implementation of liquids as dielectric resonators. Each concept and their design approaches will be examined, outlining their benefits, limitations, and possible future improvements.

scholarly journals Liquid-Based Reconfigurable Antenna Technology: Recent Developments, Challenges and Future

Sensors ◽  
2021 ◽  
Vol 21 (3) ◽  
pp. 827
Author(s):  
Habshah Abu Bakar ◽  
Rosemizi Abd Rahim ◽  
Ping Jack Soh ◽  
Prayoot Akkaraekthalin
Keyword(s):  
High Frequency ◽  
Communication Systems ◽  
Room Temperature ◽  
State Of The Art ◽  
Reconfigurable Antennas ◽  
Wireless Communication Systems ◽  
Dielectric Resonators ◽  
Different Types ◽  
Recent Developments ◽  
Basic Approaches

Advances in reconfigurable liquid-based reconfigurable antennas are enabling new possibilities to fulfil the requirements of more advanced wireless communication systems. In this review, a comparative analysis of various state-of-the-art concepts and techniques for designing reconfigurable antennas using liquid is presented. First, the electrical properties of different liquids at room temperature commonly used in reconfigurable antennas are identified. This is followed by a discussion of various liquid actuation techniques in enabling high frequency reconfigurability. Next, the liquid-based reconfigurable antennas in literature used to achieve the different types of reconfiguration will be critically reviewed. These include frequency-, polarization-, radiation pattern-, and compound reconfigurability. The current concepts of liquid-based reconfigurable antennas can be classified broadly into three basic approaches: altering the physical (and electrical) dimensions of antennas using liquid; applying liquid-based sections as reactive loads; implementation of liquids as dielectric resonators. Each concept and their design approaches will be examined, outlining their benefits, limitations, and possible future improvements.

High-Resolution X-Ray Computed Tomography—What Synchrotron Sources Can Bring to 3Di Devices Failure Analysis

2016 ◽  
Author(s):  
A. Fraczkiewicz ◽  
A. Jouve ◽  
T. Mourier ◽  
P. Bleuet ◽  
E. Capria ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Failure Analysis ◽  
Phase Contrast ◽  
European Synchrotron Radiation Facility ◽  
Field Of View ◽  
3D Integration ◽  
Synchrotron Source ◽  
X Ray ◽  
Different Types ◽  
X Ray Computed

Abstract To get both the resolution and the field of view needed, 3Di devices are characterized in this paper using phase-contrast X-ray tomography performed in a synchrotron source. The paper shows how the synchrotron-based tomography can be routinely used as a tool for failure analysis, and how some strategies can be applied to make those analyses more time-efficient and automatic without any loss of resolution. It presents and assesses the possibilities offered by a synchrotron radiation facility such as European Synchrotron Radiation Facility for the field of failure analysis in microelectronics. The paper illustrates those possibilities through two main examples, based on two different types of connection of bottom and top tiers in 3D integration, either thermocompression with copper pillars or hybrid bonding using copper pads. Several strategies have been successfully tested for the data acquisition to be faster and to limit the needed human intervention as much as possible.

Biological or Chemico-Physical Landfill Leachate Purification - An Alternative or a Useful Combination

1992 ◽  
Vol 26 (1-2) ◽  
pp. 137-145 ◽  
Author(s):  
J. T. Kettern
Keyword(s):  
Landfill Leachate ◽  
State Of The Art ◽  
Engineering Practice ◽  
Treatment Technology ◽  
Leachate Treatment ◽  
Different Types ◽  
Recent Developments ◽  
Minimum Requirements

The passing of the “General Administrative Regulations on Minimum Requirements for the Discharge of Sewage to Waters”, and particularly Annex 51, has far-reaching implications for landfill leachate treatment. The administrative regulations prescribe limits which entail treatment according to good engineering practice and state-of-the-art technology. The paper describes leachates from different types of landfill, discusses state-of-the-art leachate treatment technology and presents some recent developments.

Review of recent trends in gas sensing technologies and their miniaturization potential

Sensor Review ◽  
2014 ◽  
Vol 34 (1) ◽  
pp. 24-35 ◽  
Author(s):  
Sari Lakkis ◽  
Rafic Younes ◽  
Yasser Alayli ◽  
Mohamad Sawan
Keyword(s):  
Design Methodology ◽  
Gas Sensing ◽  
State Of The Art ◽  
The State ◽  
Content Type ◽  
Novel Technologies ◽  
Advantages And Disadvantages ◽  
Different Types ◽  
Recent Developments ◽  
Recent Trends

Purpose – This paper aims to give an overview about the state of the art and novel technologies used in gas sensing. It also discusses the miniaturization potential of some of these technologies in a comparative way. Design/methodology/approach – In this article, the authors state the most of the methods used in gas sensing discuss their advantages and disadvantages and at last the authors discuss the ability of their miniaturization comparing between them in terms of their sensing parameters like sensitivity, selectivity and cost. Findings – In this article, the authors will try to cover most of the important methods used in gas sensing and their recent developments. The authors will also discuss their miniaturization potential trying to find the best candidate among the different types for the aim of miniaturization. Originality/value – In this article, the authors will review most of the methods used in gas sensing and discuss their miniaturization potential delimiting the research to a certain type of technology or application.

History and Recent Developments of Packaging Technology for SiC Power Devices

2016 ◽  
Vol 858 ◽  
pp. 1043-1048 ◽  
Author(s):  
Karl Otto Dohnke ◽  
Karsten Guth ◽  
Nicolas Heuck
Keyword(s):  
Silicon Carbide ◽  
State Of The Art ◽  
Complex Structure ◽  
Junction Temperature ◽  
Power Device ◽  
Full Potential ◽  
Power Devices ◽  
Packaging Technology ◽  
Power Modules ◽  
Recent Developments

Packaging plays an important role to allow the full potential of silicon carbide devices to be realised. The physical properties of silicon carbide will allow devices to operate with junction temperatures well above 200 °C, but today standard-packaged SiC products are limited to a maximum junction temperature of 175 °C. The limitation lies in the packaging, because a power device package is a complex structure consisting of many components of different materials and with correspondingly different thermal properties. As such, the assembly technologies define both the performance and lifetime of discrete packages and power modules. In this paper we give an insight of packaging technology for SiC devices from the beginning in the mid-1980s through to the state-of-the-art of today. In addition, new packaging technologies to enable power SiC devices to operate up to 200 °C are discussed.

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