scholarly journals The Study of Cooling Mechanism Design for High-Power Communication Module with Experimental Verification

2021 ◽  
Vol 11 (11) ◽  
pp. 5188
Author(s):  
Tsu-Ping Yu ◽  
Yung-Lung Lee ◽  
Ya-We Li ◽  
Shih-Wei Mao
Keyword(s):  
High Power ◽  
Experimental Verification ◽  
Communication Systems ◽  
Heat Dissipation ◽  
Cooling System ◽  
Heat Pipes ◽  
Communications Systems ◽  
Cooling Mechanism ◽  
Simulation Results ◽  
Cold Plates

With the continued development of 5G mobile communications technology, the implementation of high-power communication systems has become a key indicator of developed nations. Communication modules are also trending toward wide bandwidth and high-capacity Multi-Input and Multi-Output systems. As the signal transmission speed and resolution continue with the increasing trend, the power used to operate these communications systems increase, causing extreme heat generation by transmit/receive modules (T/R module). In conditions where computation load increases in micro design systems, chips must operate in environments that are narrow, sealed, and have no convection, which can drastically increase the thermal load within a system. If no proper cooling system is utilized, the system fails or operates at impacted performance due to excessive temperatures. To solve the aforementioned problem, this study aimed to optimize the design of the cooling system in the T/R modules of communications systems by integrating heat pipes, cooling fans, cooling fins, and cooling chips within a limited space. We also proposed four types of cold plates based on the different directional clamp-in configuration methods of heat pipes within copper panels and utilized the finite element method to simulate and analyze the heat dissipation performance. The simulation results reveal that cold plates of types I and II can achieve a better heat dissipation performance. Finally, types I and II cold plates were selected for production and experimental verification. The results show that heat dissipation performances were similar to simulation results. The results also confirmed that type II cold plate has a better temperature uniformity and heat transfer efficiency. Thus, the cooling mechanism depicted in this study is viable in practical applications. The proposed mechanisms can also provide a reference for heat dissipation design patterns in different electronic module settings.

Experimental Study of Effect Factors on Performance of Heat Dissipation of HP Heat Exchanger for LED Cooling System

2012 ◽  
Vol 490-495 ◽  
pp. 2530-2533
Author(s):  
Yun Jun Gou ◽  
Zhong Liang Liu ◽  
Chun Min Wang ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Exchanger ◽  
High Power ◽  
Heat Dissipation ◽  
Environmental Temperature ◽  
Cooling System ◽  
Heat Pipes ◽  
Two Phase ◽  
High Power Led ◽  
Street Lamp ◽  
Two Phase Heat Transfer

A new cooling concept for high power LED street lamp by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this paper we study the effect of heat pipe numbers, fins structure and ambient temperature on the performance of heat dissipation of HP heat exchanger. Through experimental results, we found the heat pipes number plays a more importent role on the performance of heat dissipation than the fins material and the final surface temperature will increase with the environmental temperature.

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2012 ◽  
Vol 490-495 ◽  
pp. 2278-2281
Author(s):  
Yun Jun Gou ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Exchangers ◽  
Heat Dissipation ◽  
Cooling System ◽  
Heat Pipes ◽  
Two Phase ◽  
High Power Led ◽  
Two Phase Heat Transfer ◽  
Pipe Heat

A new cooling concept for high power LED street lamp by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a series of heat pipes with specific fins structure were developed. Through experimental results, we found the new heat pipe heat exchangers have the features of higher efficiency of heat dissipation and more compact construction which meets the demand of heat dissipation for high power LED than the traditional heat pipe heat exchangers and the new exchanger with outwards-radiate structure has the best heat dissipation performance.

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2011 ◽  
Vol 295-297 ◽  
pp. 1985-1988
Author(s):  
Yu Jun Gou ◽  
Zhong Liang Liu ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
High Power ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Two Phase ◽  
High Power Led ◽  
New Type ◽  
Two Phase Heat Transfer

A new cooling concept for high power LED by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a new type of heat pipe with specific fins structure was developed. Through experimental results, we found the new heat pipe heat exchanger has the features of high efficiency of heat dissipation and compact construction which meets the demand of heat dissipation for high power LED. We also found the heat dissipation performance of the HP heat exchanger changed with the work angle.

Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

Qualitative analysis of coupling effect of fluid velocity distribution in microchannels on the performance of the LED water cooling system

2019 ◽  
Vol 29 (10) ◽  
pp. 3893-3907
Author(s):  
Yuanlong Chen ◽  
Tingbo Hou ◽  
Xiaochao Zhou
Keyword(s):  
Velocity Distribution ◽  
High Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Fluid Velocity ◽  
Water Cooling ◽  
Content Type ◽  
Aspect Ratios ◽  
High Power Led ◽  
Water Cooling System

Purpose The purpose of this paper is to ensure adequate thermal management to remove and dissipate the heat produced by a light-emitting diode (LED) and to guarantee reliable and safe operation. Design/methodology/approach A three-dimensional (3-D) computational fluid dynamics (CFD) model was used to analyze the distribution of fluid velocities among microchannels at four different aspect ratios. Findings The results showed that at the same inlet flow rate, the larger the aspect ratio of the microchannels, the better the uniformity of the internal fluid velocity and thus better the heat dissipation performance on the surface of the high-power LED chip. In addition, the thermal performance of a high-power LED water cooling system with four different aspect ratios’ microchannel structures is further studied experimentally. Specifically, the coupling effect between the fluid velocity distribution in the microchannels and the heat dissipation performance of a high-power LED water cooling system is qualitatively analyzed and compared with the simulation results of the fluid velocity distribution. The results fully demonstrated that a larger aspect ratio of the microchannels results in better heat dissipation performance on the surface of the high-power LED chip. Originality/value Optimizing the structural parameters to facilitate a relatively uniform velocity distribution to improve the water cooling system performance may be a key factor to be considered.

CuDia Slug Size Variation Analysis on Heat Dissipation of High Power LED

2014 ◽  
Vol 487 ◽  
pp. 33-36 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli
Keyword(s):  
Natural Convection ◽  
High Power ◽  
Heat Dissipation ◽  
Size Variation ◽  
Simulation Method ◽  
Point Of View ◽  
Junction Temperature ◽  
Variation Analysis ◽  
Single Chip ◽  
Simulation Results

The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug.

Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

2011 ◽  
Vol 130-134 ◽  
pp. 3967-3971
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Jhih Wei Huang
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Thermal Dissipation ◽  
Liquid Cooling ◽  
K Value ◽  
Control Factors ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

scholarly journals An Independent Internal Cooling System for Promoting Heat Dissipation during Dry Cutting with Numerical and Experimental Verification

2017 ◽  
Vol 7 (4) ◽  
pp. 332 ◽  
Author(s):  
Bin Yao ◽  
Weifang Sun ◽  
Binqiang Chen ◽  
Xiaojin Yu ◽  
Yuchao He ◽  
...  
Keyword(s):  
Experimental Verification ◽  
Heat Dissipation ◽  
Cooling System ◽  
Internal Cooling ◽  
Dry Cutting

scholarly journals Passive Cooling Solutions for High Power Server CPUs with Pulsating Heat Pipe Technology: Review

2021 ◽  
Vol 9 ◽  
Author(s):  
Chenxi Li ◽  
Ji Li
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Data Centers ◽  
Heat Dissipation ◽  
Waste Heat ◽  
Smart Cities ◽  
Heat Pipes ◽  
Passive Cooling ◽  
Pulsating Heat Pipe ◽  
Compact Structure

Data centers are becoming more powerful and more integrated with the continuous development of smart cities, which brings us more technological convenience, but also generates a large amount of waste heat. At present, the efficient and green cooling scheme is one of the key researches and development points to ensure the stable and safe operation of power electronic devices and achieve energy saving and consumption reduction. As a branch of the heat pipe, the pulsating heat pipe is one of most promising passive cooling techniques among many candidates for its unique advantages such as small size, simple and compact structure, and high heat dissipation efficiency, but its application in data centers just begins, and there are few reports on research and implementation. Based on the introduction of the basic structure, working mechanism and outstanding advantages of pulsating heat pipes, this paper reviews in detail the researches on the factors affecting its performance, so as to evaluate the possibility of using pulsating heat pipes in data centers. Finally, the latest application and development of pulsating heat pipes applied to heat dissipation of high-power CPUs are summarized, which can provide a guidance for subsequent research and engineering application.

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