scholarly journals Challenges and Applications of Emerging Nonvolatile Memory Devices

Electronics ◽  
2020 ◽  
Vol 9 (6) ◽  
pp. 1029 ◽  
Author(s):  
Writam Banerjee

Emerging nonvolatile memory (eNVM) devices are pushing the limits of emerging applications beyond the scope of silicon-based complementary metal oxide semiconductors (CMOS). Among several alternatives, phase change memory, spin-transfer torque random access memory, and resistive random-access memory (RRAM) are major emerging technologies. This review explains all varieties of prototype and eNVM devices, their challenges, and their applications. A performance comparison shows that it is difficult to achieve a “universal memory” which can fulfill all requirements. Compared to other emerging alternative devices, RRAM technology is showing promise with its highly scalable, cost-effective, simple two-terminal structure, low-voltage and ultra-low-power operation capabilities, high-speed switching with high-endurance, long retention, and the possibility of three-dimensional integration for high-density applications. More precisely, this review explains the journey and device engineering of RRAM with various architectures. The challenges in different prototype and eNVM devices is disused with the conventional and novel application areas. Compare to other technologies, RRAM is the most promising approach which can be applicable as high-density memory, storage class memory, neuromorphic computing, and also in hardware security. In the post-CMOS era, a more efficient, intelligent, and secure computing system is possible to design with the help of eNVM devices.

1999 ◽  
Vol 35 (10) ◽  
pp. 848 ◽  
Author(s):  
K. Nakazato ◽  
K. Itoh ◽  
H. Mizuta ◽  
H. Ahmed

Author(s):  
Beomsang Yoo ◽  
Taehui Na ◽  
Byungkyu Song ◽  
Seong-Ook Jung ◽  
Jung Pill Kim ◽  
...  

2013 ◽  
Vol 685 ◽  
pp. 372-377 ◽  
Author(s):  
Wen Wen Qiu ◽  
Hong Deng ◽  
Mi Li ◽  
Min Wei ◽  
Xue Ran Deng ◽  
...  

Resistive random access memory (RRAM) has attracted comprehensive attention from academia and industry as a new-type of nonvolatile memory. This memory has many advantages, such as high-speed, low power consumption, simple structure, high-density integration, etc. Therefore, it has a strong potential to replace DRAM. This paper summarizes the recent progress of the studies on RRAM. Although the achievement obtained has been summarized, there is still a long way from the real application. We also discuss the principle and related properties of RRAM and forecast the preparation trends of RRAM


2012 ◽  
Vol 51 (2S) ◽  
pp. 02BD01 ◽  
Author(s):  
Takashi Ohsawa ◽  
Fumitaka Iga ◽  
Shoji Ikeda ◽  
Takahiro Hanyu ◽  
Hideo Ohno ◽  
...  

2006 ◽  
Vol 918 ◽  
Author(s):  
E.G. Yeo ◽  
L.P Shi ◽  
R Zhao ◽  
T.C. Chong

AbstractIn this paper, ultra-high memory density and high speed non-volatile phase change random access memory (PCRAM) was investigated by material engineering. The melting point, crystallization point and activation energy of crystallization of the Bismuth (Bi) doped Germanium-Antimony-Tellurium (GeSbTe) compound was measured using differential scanning calorimetry (DSC) and compared to other GeSbTe ternary compounds. It was observed that the melting temperature of Bi-doped GeSbTe was lower than that of GeSbTe. On the other hand, its activation barrier was found to be reduced, which in turn increased the speed of crystallization of Bi-doped GeSbTe. Bi-doped GeSbTe was then used as a phase change material in the fabrication of PCRAM devices. The properties of PCRAM fabricated using this material were then compared to those using GeSbTe, with emphasis on the programming current required. The results obtained revealed that lower programming current of up to 40% has been achieved for PCRAM with Bi-doped GeSbTe compared to those with other GeSbTe compounds. Bi-doped GeSbTe also has low RESET current and fast speed of crystallization with scaling, making it a suitable material for high speed, ultra-high density PCRAM fabrication in the future.


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