scholarly journals Metal Matrix Composite in Heat Sink Application: Reinforcement, Processing, and Properties

Materials ◽  
2021 ◽  
Vol 14 (21) ◽  
pp. 6257
Author(s):  
Mirza Murtuza Ali Baig ◽  
Syed Fida Hassan ◽  
Nouari Saheb ◽  
Faheemuddin Patel

Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The ever-increasing performance of electronic systems together with miniaturization calls for better heat dissipation. Therefore, the heat sink materials should not only have high thermal conductivities, low densities, and cost, but also have coefficients of thermal expansion matching to those of semiconductor chips and ceramic substrates. As traditional materials fail to meet these requirements, new composite materials have been developed with a major focus on metal matrix composites (MMCs). MMCs can be tailored to obtain the desired combination of properties by selecting proper metallic matrix and optimizing the size and type, volume fraction, and distribution pattern of the reinforcements. Hence, the current review comprehensively summarizes different studies on enhancing the thermal performance of metallic matrices using several types of reinforcements and their combinations to produce composites. Special attention is paid to the types of commonly used metallic matrices and reinforcements, processing techniques adopted, and the effects of each of these reinforcements (and their combinations) on the thermal properties of the developed composite. Focus is also placed on highlighting the significance of interfacial bonding in achieving optimum thermal performance and the techniques to improve interfacial bonding.

Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.


2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.


Author(s):  
T. J. Lu ◽  
D. Sui ◽  
T. Kim ◽  
M. L. Xu

The challenge in thermal management is the capability to remove heat from the device while maintaining acceptable component operating temperatures. Metal foams with high porosity ε∼0.9 have in recent years emerged as a promising heat dissipation medium, due to high extended surface area densities as well as tortuous flow passages that promote the coolant flow mixing. This study focuses on investigating experimentally the thermal performance of highly porous aluminum foam heat sinks with open cells under the impingement of axial fan flows. While the porosity, foam thickness and axial fan rotation are fixed, three selected pore densities and varying impinging distance are considered. The parameters of overall thermal resistance Rθ and temperature difference ΔT are used to evaluate thermal performance of aluminum foam heat sink which is also compared with that of a conventional fin heat sink. The experimental results represent aluminum foam heat sinks can provide similar or better cooling performance with more compact (a 50% reduction in both the weight and volume) than conventional fin heat sink.


Author(s):  
Moo Joong Kim ◽  
Sangjin Kim ◽  
Kuen Tae Park ◽  
Hyun Jung Kim ◽  
Dong-Kwon Kim

The heat sinks are used to dissipate heat from electronic and industrial systems. In the present study, in order to overcome limitation of traditional heat sink, we suggest and experimentally investigate new concept of heat sink which use evaporation of water. The heat sink is made from sintered copper plate and absorbs supplied water like sponges by capillarity-driven wetting. The absorbed water evaporates at the surface of heat sink and the surface temperature is dropped due to the latent heat of water evaporation. In this study, we experimentally compare the heat dissipation performance of the suggested heat sink with traditional heat sink. And we investigate the performance of heat sink made from the sintered copper plate with various particle radius and porosities. Finally, we find the fin spacing, at which the thermal performance is maximized.


Nanomaterials ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 738
Author(s):  
Xin Zhang ◽  
Shaoqing Wang

The relationship between point defects and mechanical properties has not been fully understood yet from a theoretical perspective. This study systematically investigated how the Stone–Wales (SW) defect, the single vacancy (SV), and the double vacancy (DV) affect the mechanical properties of graphene/aluminum composites. The interfacial bonding energies containing the SW and DV defects were about twice that of the pristine graphene. Surprisingly, the interfacial bonding energy of the composites with single vacancy was almost four times that of without defect in graphene. These results indicate that point defects enhance the interfacial bonding strength significantly and thus improve the mechanical properties of graphene/aluminum composites, especially the SV defect. The differential charge density elucidates that the formation of strong Al–C covalent bonds at the defects is the most fundamental reason for improving the mechanical properties of graphene/aluminum composites. The theoretical research results show the defective graphene as the reinforcing phase is more promising to be used in the metal matrix composites, which will provide a novel design guideline for graphene reinforced metal matrix composites. Furthermore, the sp3-hybridized C dangling bonds increase the chemical activity of the SV graphene, making it possible for the SV graphene/aluminum composites to be used in the catalysis field.


Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2143
Author(s):  
Shaimaa I. Gad ◽  
Mohamed A. Attia ◽  
Mohamed A. Hassan ◽  
Ahmed G. El-Shafei

In this paper, an integrated numerical model is proposed to investigate the effects of particulate size and volume fraction on the deformation, damage, and failure behaviors of particulate-reinforced metal matrix composites (PRMMCs). In the framework of a random microstructure-based finite element modelling, the plastic deformation and ductile cracking of the matrix are, respectively, modelled using Johnson–Cook constitutive relation and Johnson–Cook ductile fracture model. The matrix-particle interface decohesion is simulated by employing the surface-based-cohesive zone method, while the particulate fracture is manipulated by the elastic–brittle cracking model, in which the damage evolution criterion depends on the fracture energy cracking criterion. A 2D nonlinear finite element model was developed using ABAQUS/Explicit commercial program for modelling and analyzing damage mechanisms of silicon carbide reinforced aluminum matrix composites. The predicted results have shown a good agreement with the experimental data in the forms of true stress–strain curves and failure shape. Unlike the existing models, the influence of the volume fraction and size of SiC particles on the deformation, damage mechanism, failure consequences, and stress–strain curve of A359/SiC particulate composites is investigated accounting for the different possible modes of failure simultaneously.


Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.


2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).


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